JPS61232630A - Inspection device for electronic part - Google Patents

Abstract

PURPOSE:To couple an electrical coupling means with the handler side rapidly, easily and positively by mounting a moving mechanism horizontally moving a test head under an erected state up to a position where the coupling means is coupled with the handler side. CONSTITUTION:A test head 13 has no structure in which the test head is axially supported directly by a shaft 14 to a base 12, and is supported axially through a horizontal moving mechanism 7. With the horizontal moving mechanism 7, a guide member 20 and a movable carriage 21 are connected slidably as seen in a sliding mechanism section, and the guide member 20 is pivotally supported rotatably by the shaft 14. The test head 13 is fixed to the movable carriage 21, and a sliding locking pin 8 capable of locking and releasing a sliding between the guide member 20 and the movable carriage 21 is fitted. The test head 13 is shifted in the vertical direction at an attitude before mounting, but the test head 13 is transferred in the before and behind directions to a handler 2 when the test head 13 is positioned at an erected attitude to a test stand 1.

Description

Detailed Description of the Invention [Industrial Application Field 1] The present invention relates to an electronic component that is used in combination with a handler that sequentially conveys a large number of electronic components to automatically measure and inspect a large number of electronic components in sequence. Regarding inspection equipment, especially for IC (
The present invention relates to an electronic component testing device that can be quickly, easily, and reliably connected to a handler in a testing device that tests semiconductor integrated circuits.

[Prior Art] Automatic inspection equipment used when mass producing small electronic components such as ICs is generally configured by combining a test stand and a handler.

FIG. 4 shows an example of a conventional automatic inspection device in which a test stand 1 and a handler 2 are combined and arranged.
A plurality of connection pins 9 are installed horizontally in the handler 2. A large number of ICs are sequentially transported as indicated by arrows 41 and /\, and are electrically connected to the connecting pin 9 when passing near the connecting pin 9.

On the other hand, in the test stand l, the test head 13 is attached to the shaft 14 on the second side of the base 12 supported by the leveling port 11.
is pivotally mounted and rotatably supported through the
The test head 13 is provided with a socket 15.

Then, the test head 13 is rotated to the upright position B as indicated by the arcuate arrow A, the socket 15 and the connecting pin 9 are connected, and the test head is fixed in the upright position B shown by the imaginary line using the fixing screw 3. The inspection will be carried out. Note that 4 is a lock shaft having a function of automatically catching the test head 13, and 5 is a fitting for connecting the test stand 13 and the handler 2. Reference numeral 6 denotes a fixing pin that holds the test head 13 in the position shown by the solid line.

Further, 16 is a slip ring that urges the test head 13 in the direction of the arc arrow A.
The structure is such that the biasing force disappears when the body approaches the upright position B. As a result, only a small rotational force is required when the test head 13 is erected in the direction of the arrow A, and a buffering function is achieved when the test head 13 is laid down in the opposite direction of the arrow A.

[Problems to be Solved by the Invention] However, in the conventional test stand as shown in FIG.
When connecting the socket 15 to the connecting pin 9, there is a problem in that the socket 15 and the connecting pin 9 are often damaged.

[Purpose of the Invention] The present invention has been made in view of the circumstances of the prior art, and it solves these problems and makes it possible to quickly, easily and reliably connect the handler side. The purpose of the present invention is to provide an inspection device for electronic components.

[Means for Solving the Problem 1] The means in the specific invention of this application for achieving such an object is to hold the test head in an upright position to a position where an electrical coupling means such as a socket is coupled to the handler side. A moving mechanism that moves horizontally is provided.

Further, the means in the related invention is provided with a moving mechanism and a locking mechanism for horizontally moving the test head in an upright state to a position where the electrical coupling means is coupled to the handler, and the moving mechanism is attached to the test stand. A guide member pivotally mounted on one end, a moving table that slides by engaging with this guide member and fixes and supports the test head, a moving drive mechanism that moves this moving stand, and a driving state of this moving drive mechanism. When the test head is set in an upright position, the guide member is in a horizontal state and is fixed in a horizontal state by a long mechanism, and the operating means controls the handler. It is placed on the side where the bonding state can be observed from the side.

[Function] By the way, the inventor investigated the cause of damage to sockets and connection pins in conventional test stands, and found that the cause was that the test head was attached by making an arcuate movement about the pivot axis of the station. Depends on what you're doing. The problem is that the final position of the socket obtained as a result of the circular arc movement is not sufficiently tangentially positioned before the socket is connected to the handler side.

Therefore, as mentioned above, if the test head is installed after it has been horizontally moved from an upright position, it is possible to more reliably position the electrical connection parts such as sockets in the tangential direction. Can be done. Furthermore, if the horizontal movement operation means is placed on the side where the mounting state can be checked, the movement of the test head to the mounting state on the handler side can be performed while being observed, and the mounting operation can be adjusted.

As a result, connection with a handler can be performed quickly, easily, and reliably.

[Example] Hereinafter, an example of the present invention will be described in detail using the drawings.

FIG. 1 is a front view of an IC testing device having a test head according to an embodiment of the present invention, and FIGS. 2(a) and (b)
are explanatory diagrams of the test head moving mechanism, respectively.
FIG. 3 is an enlarged explanatory view of the locking mechanism.

Note that in each of these figures, the same parts are indicated by the same reference numerals.

Here, the Tes I head 13 does not have a structure in which it is directly supported by the shaft 14 on the base 12, but the horizontal movement mechanism 7.
It is pivotally supported through.

This horizontal movement mechanism 7 has a guiding member 20 and a moving table 21 slidably engaged with each other as shown in the sliding mechanism part in FIG. Support for free movement. A sliding locking pin 8 is provided to fix the test head 13 to the moving table 21 and to lock and release the sliding movement between the housing member 20 and the moving table 21.

The direction of movement is downward when the test head 13 is in the pre-installation position shown by the solid line in FIG. It will move in the front and back direction.

As shown in FIG. 2(a), the guide member 20 is provided with a guide shaft 20a, and the movable table 2 is attached to the guide shaft 20a.
A configuration is adopted in which a cylindrical bearing 21a provided on the first side is fitted. As a result, the movable table 21 slides on this guide shaft 20a. As a result, the Tess head 13 fixed to the upper part of the movable table 21 can be moved back and forth.

Here, the test head 13 is moved back and forth by an operation handle 22 disposed at one end of the guide member 20.

As shown in FIG. 2(b), which is shown in the state before being upright in order to explain the movement drive mechanism, the guide member 20A (only one side is shown in the drawing, but two are provided at each end) An operating handle 22 is fixed to an end of a shaft 20c supported by a bearing on a fixed bracket 20b. The bevel gear 23 fixed to this shaft 20c rotates in accordance with the rotation of the operating handle 22, and the rotation causes the shaft 2.
The signal is transmitted to the gear 24 fixed to Od, and the shaft 20d rotates.

Here, a pawl portion 25 is engaged with the shaft 20d, and the rotation of the shaft 20'd is switched to forward and backward movement of the pawl portion 25 by a so-called pawl screw mechanism. As the pole part 25 moves, the engaging member 2B fixed to the test head 13 side moves back and forth, and the base part +3a of the test head 13 moves back and forth, causing the test head 1
3 moves back and forth.

The engaging member 26 has a through hole through which the shaft 20d passes, and a gap 26a is provided between the pole portion 25 and the engaging member 26 so that they engage with each other. . This makes adjustment easier.

Here, when the test head 13, which is supported by the shaft 14 shown in FIG. The mounted socket (indicated by the imaginary line) 15 faces the connecting pin 9 in front, and is parallel to and spaced apart from the mounted position.

When the test head 13 is rotated to the upright position C as described above, the horizontal movement mechanism 7 also rotates accordingly, so that it is in the state 8G shown by the imaginary line. The sliding direction of the horizontal movement mechanism 7 in this state is the left-right direction in the drawing.

Here, the guide member 20 raises the test head 13 and
When set in the upright position, it is fixed in the horizontal direction by the fixing pin 31 shown in FIG. 2(b). That is, when the test head 13 stands up, the fixing pin 31 shown in FIG. 2(b) is loosely fitted and supported by the bracket l-12a fixed to the upper surface of the base 12, and as shown in FIG. It is biased by a spring 32 and protrudes inward.

On the other hand, the inclined plate 27 shown in FIG. 2(a) is fixed at the lower center of the guide member 20. When the test head 13 is raised up and set in the upright position, as shown in FIG. retreats to the outside. When the test head 13 is completely upright, the spring 3
2, the tip of the fixing pin 31 fits into the through hole 28 shown in FIG. 2(a), and the tip of the L-shaped lock plate 29 is attached by the spring 30 (see FIG. 2(a)). is pushed into the groove 31a of the fixing pin 31, and the guide member 2
Lock 0 horizontally.

In addition, when turning the test head 13 face down and returning it to the original initial position, ・1-shaped ?・Pull the cup v7 29 against the spring 30, pull the fixing pin 31, and insert its tip into the through hole 2.
We will have to evacuate the area outside of 8 and then live there.

To use the test stage configured as shown in the product +, after raising the test head 13 and setting it in the horizontal position C shown by the solid line, remove the fixing pin 8 and open the operating panel. ' to rotate in a predetermined direction and move the test head 13 toward the handler 2 in the direction shown by the imaginary line.

As a result, the test head 13 is guided by the horizontal movement mechanism 7 to move horizontally in parallel, and the socket 15 is coupled to the connection pin 9. During this coupling operation, the socket 15 moves horizontally parallel to the axis of the connecting pin 9 as the test head 13 on which the socket 15 is mounted moves, so there is no risk of damaging the connecting pin 9. , or connecting pin 9
There is no risk that the socket 15 will be damaged due to this.

Since the operation handle 22 is located on the side surface where the combined state can be observed, the operator can perform the connecting process reliably while confirming the combined state.

When removing the test head 13 from the handler 2, the operator reverses the operating handle 22 and performs the opposite operation.

By the way, as in the embodiment, by a mechanical mechanism using, for example, a handle operation and a ball screw mechanism,
If the heavy test head is moved horizontally, there is no need to push it out by hand, and it can be easily moved with a small force.

As explained above, in the embodiment, a ball screw mechanism is used as the horizontal drive mechanism to move horizontally, but the horizontal movement drive mechanism is limited to this type of mechanism. Although it is not a physical device and is moved by operating a handle, this may be done by a motor drive, or a detector for detecting the attachment state may be provided along with the motor drive so that the attachment can be automatically connected and attached. .

Further, the electrical connection with the handler side is not limited to a socket, and any electrical connection means may be used. The connection can be made with precise location.

By the way, although the embodiments are mainly described with reference to an IC tester, the present invention is not limited to an IC tester, and can of course be applied to testing various electronic components.

[Effects of the Invention] As can be understood from the above explanation, in the specified invention of the application, the test head is held upright and horizontally until the electrical coupling means such as a socket is coupled to the handler. A moving mechanism for moving the test head is provided, and in a related invention, a moving mechanism and a locking mechanism are provided for horizontally moving the test head in an upright state to a position where the electrical coupling means is coupled to the handler. The moving mechanism includes a guide member pivotally attached to one end of the test stand, a moving table that slides by engaging with this guide member and fixes and supports the test head, and a moving drive mechanism that moves this moving table. and an operating means for controlling the driving state of the moving drive mechanism, and when the test head is set in an upright position, the guide member is in a horizontal position and is fixed in the horizontal position by a locking mechanism. and the operating means is arranged on the side where the state of connection with the handler side can be observed from the side.
It can be installed after being horizontally moved from an upright position in a vertical W state, and it is possible to more reliably mount the electrical connection part such as a socket in the tangential direction.

Moreover, if the means for horizontally moving the test head is placed on the side where the mounting state thereof can be confirmed, the movement of the test head to the mounting state on the handler side can be performed while being observed, and the mounting operation can be adjusted.

As a result, connection with a handler can be performed quickly, easily, and reliably.

[Brief explanation of the drawing]

FIG. 1 is a front view of an IC testing device having a test head according to an embodiment of the present invention, and FIGS. 2(a) and (b)
are explanatory diagrams of the test head moving mechanism, respectively.
Figure 3 is an enlarged explanatory view of the mouth/ink mechanism, and Figure 4
The figure is a front view of an IC testing device having a conventional test head. 1 is a test stand, 2 is a handler, 3 is a fixing screw, 4 is a lock shaft, 5 is a connection fitting between the test stand and handler, 6.16 is a fixed bin, 7 is a horizontal movement mechanism, 8 is a sliding lock 9 is a connection bin, 11 is a leveling bolt, 12 is a base, 13 is a test head, 14 is a shaft, 15 is a socket, 20 is a guide member,
9 is a moving table, 22 is an operating handle, and 31 is a fixed bin. Patent Applicant Hitachi Electronics Engineering Co., Ltd. Agent Patent Attorney Tadashi Kajiyama Koreb Figure 3 Figure 4

Claims (5)

[Claims] (1) A test head that is attached to a handler that sequentially transports electronic components and sets them at a test position via an electrical coupling means such as a socket, and a test stand that pivots this test head so that it can rotate. In an electronic component testing apparatus for testing the electronic component with the test head mounted on the handler in an upright state, the electrical coupling means is attached to the handler with the test head in an upright state. An electronic component inspection device characterized by having a moving mechanism that moves horizontally to a joining position. (2) The moving mechanism pivotally supports the test head and horizontally moves the test head in an upright state, and engages with a guide member whose one end side is pivotally attached to the test stand. Inspection of electronic components according to claim 1, characterized in that the electronic component inspection method according to claim 1 is characterized in that it has a movable table that slides and fixedly supports the test head, and a moving drive mechanism that moves this movable table. Device. (3) The moving mechanism pivots the test head and horizontally moves the upright test head, and engages with a guide member whose one end side is pivotally attached to the test stand. The test head is slidable and fixedly supported by a movable table, a movable drive mechanism for moving the movable base, and an operating means for controlling the driving state of the movable drive mechanism. 2. The electronic component inspection device according to claim 1, wherein the electronic component inspection device is disposed on a side where the state of connection with the handler side can be observed from the side. (4) A test head that is attached to a handler that sequentially transports electronic components and sets them at a test position via an electrical coupling means such as a socket, and a test stand that pivots this test head so that it can rotate. In an electronic component testing apparatus for testing the electronic component with the test head mounted on the handler in an upright state, the electrical coupling means is attached to the handler with the test head in an upright state. A moving mechanism and a locking mechanism are provided for horizontally moving the test head to a position where the test head is coupled, and the moving mechanism engages with and slides on a guide member whose one end side is pivotally connected to the test stand. The test head has a movable base that is fixedly supported, a movable drive mechanism that moves the movable base, and an operating means that controls the driving state of the movable drive mechanism, and when the test head is set in an upright state, The electronic device is characterized in that the guide member is in a horizontal state and is fixed in the horizontal state by the locking mechanism in that position, and the operating means is arranged on a side where the state of connection with the handler side can be observed from the side. Parts inspection equipment. (5) The locking means has a release operation means for releasing the lock, and the release operation means is disposed on a side where the state of connection with the handler side can be observed from the side. 4. The electronic component inspection device according to item 4.