JPS61229344A - Ic package - Google Patents

Ic package

Info

Publication number
JPS61229344A
JPS61229344A JP7181885A JP7181885A JPS61229344A JP S61229344 A JPS61229344 A JP S61229344A JP 7181885 A JP7181885 A JP 7181885A JP 7181885 A JP7181885 A JP 7181885A JP S61229344 A JPS61229344 A JP S61229344A
Authority
JP
Japan
Prior art keywords
package
heat
fin
heat sink
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7181885A
Other languages
Japanese (ja)
Inventor
Masaru Ishizuka
勝 石塚
Yoshiro Miyazaki
芳郎 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP7181885A priority Critical patent/JPS61229344A/en
Publication of JPS61229344A publication Critical patent/JPS61229344A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To radiate efficiently the heat generated in an IC package by a method wherein earth pins directly connected with the electric circuit in the IC package are thermally connected to heat-radiating fins. CONSTITUTION:A heat-radiating fin 2 is installed on an IC package 1 to be mounted on a substrate 3 and an earth pin 4 connected to the substrate 3 are thermally connected in one united body with the fin 2, which is a heat dissipating member. The heat to generate in the interior of the IC package 1 is radiated from the fin through two paths of the path of the heat to be transmitted directly to the fin 2 from the earth pins 4 and the path of the heat to be transmitted to the fin 2 through the upper surface of the package.

Description

【発明の詳細な説明】 ［発明の技術分野］ 本発明はＩＣパッケージの改良に係る。[Detailed description of the invention] [Technical field of invention] The present invention relates to improvements in IC packages.

［発明の技術的背景とその問題点］ 従来のＩＣパッケージにおいては、その基板搭載面とは
反対側の面に板上のアルミニウムフィンを取付けてあり
、伝導によって放熱を行なうようにしている。ところが
、最近になってＩＣの高密度実装化が急速に進み、パッ
ケージ内の温度上昇が著しくその温度が作動安全範囲を
超過するおそれがある。[Technical Background of the Invention and Problems Therewith] In a conventional IC package, an aluminum fin on a plate is attached to the surface opposite to the substrate mounting surface, and heat is dissipated by conduction. However, recently, high-density packaging of ICs has progressed rapidly, and there is a possibility that the temperature inside the package will rise significantly and exceed the safe operating range.

これには次のような原因が考えられる。まず、放熱量を
増加させるにはフィンの面積を拡大すればよいが小型化
のために、前記面積の拡大が制限されること、次にパッ
ケージから直接アルミニウムフィンに伝熱されるように
なっているが、パッケージとアルミニウムフィンとの接
触熱抵抗が大きく放熱効率が低いことである。This may be due to the following reasons. First, to increase the amount of heat dissipated, it is possible to increase the area of the fins, but due to miniaturization, expansion of the area is limited.Second, heat is transferred directly from the package to the aluminum fins. However, the contact thermal resistance between the package and the aluminum fins is large and the heat dissipation efficiency is low.

［発明の目的］ 本発明は上記の事情に基きなされてたもので、伝熱効率
の高い放熱フィンを備え、放熱能力の大きなＩＣパッケ
ージを得ることを目的としている。[Object of the Invention] The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to obtain an IC package that is equipped with radiation fins with high heat transfer efficiency and has a large heat radiation ability.

［発明の概要］ 本発明のＩＣパッケージは、パッケージ内の電気回路と
直接に接続した接地ピンを熱の放散体と熱的に接続した
ことを特徴とする。[Summary of the Invention] The IC package of the present invention is characterized in that a ground pin directly connected to an electric circuit within the package is thermally connected to a heat dissipator.

［発明の実施例］ 第１図は本発明の一実施例の断面図を示す。この図にお
いて、ＩＣパッケージ１に、はフィン２が装着されてお
り、ＩＣパッケージ１は基板３に実装されている。また
、基板３に接続される接地用ピン４は熱の放散体である
フィンと一体化されている。[Embodiment of the Invention] FIG. 1 shows a sectional view of an embodiment of the invention. In this figure, a fin 2 is attached to an IC package 1, and the IC package 1 is mounted on a substrate 3. Further, the grounding pin 4 connected to the substrate 3 is integrated with a fin that is a heat dissipator.

ＩＣパッケージ１の内部で発生した熱は、接地用ピン４
から直接フィンに伝達されてフィンから放熱されるのと
、ＩＣパッケージ１上面を介してフィン２に伝達されフ
ィン２から放熱されるのとの両面で放熱される。接地用
ピン４はパッケージ内部の電、気回路と直接に接続され
、しかもその熱抵抗は極めて小さいので、パッケージ内
部で発生した熱はフィン２から効率良く放熱され、パッ
ケージ上面を介してのフィンからの放熱と相俟ってパッ
ケージ内の温度の上昇を防止する。The heat generated inside the IC package 1 is transferred to the grounding pin 4.
Heat is radiated both by being directly transmitted from the IC package 1 to the fins and radiated from the fins, and by being transmitted to the fins 2 via the upper surface of the IC package 1 and radiated from the fins 2. The grounding pin 4 is directly connected to the electrical and electrical circuits inside the package, and its thermal resistance is extremely small, so the heat generated inside the package is efficiently dissipated from the fins 2 and transferred from the fins via the top surface of the package. Combined with heat dissipation, this prevents the temperature inside the package from rising.

第１図と同一部分には同一符号を付した第２図は本発明
の第２の実施例を示す。この実施例においては、熱の放
散体としてヒートシンクを使用する。すなわち、ＩＣパ
ッケージを搭載する基板３のパッケージ搭載位置にヒー
トシンク５を設置し、ＩＣパッケージはヒートシンク５
を介して基板３に搭載する。而して、前記のヒートシン
ク５とＩＣパッケージの接地ピンとは接続片６によって
熱的に接続する。FIG. 2, in which the same parts as in FIG. 1 are denoted by the same reference numerals, shows a second embodiment of the present invention. In this embodiment, a heat sink is used as a heat dissipator. That is, the heat sink 5 is installed at the package mounting position of the board 3 on which the IC package is mounted, and the IC package is mounted on the heat sink 5.
It is mounted on the board 3 via. The heat sink 5 and the ground pin of the IC package are thermally connected by the connection piece 6.

ＩＣパッケージ１内で発生した熱は接地ピン４から接続
片６を介してヒートシンク５に伝達されここから放熱さ
れるのと、パッケージ上面を介してフィン２に伝達され
ここから放熱されるのとの両面で放熱される。接地ピン
４はパッケージ内部の電気回路と直接に接続しており、
内部に発生した熱はきわめて低い熱抵抗で伝達され、ま
た接続片６も熱抵抗が低いのでヒートシンク５による冷
却は良好に行われ、パッケージ上面を介してのフィンか
らの放熱と相俟ってパッケージ内の温度上昇を防止する
。Heat generated within the IC package 1 is transmitted from the ground pin 4 via the connection piece 6 to the heat sink 5 and radiated from there, and is transmitted to the fin 2 through the top surface of the package and radiated from there. Heat is dissipated on both sides. Ground pin 4 is directly connected to the electrical circuit inside the package.
The heat generated inside is transferred with extremely low thermal resistance, and since the connecting piece 6 also has low thermal resistance, cooling by the heat sink 5 is performed well. Prevent temperature rise inside.

なお、ヒートシンク５はＩＣパッケージ１と基板３との
間に収容されているので、余分のスペースを大きく必要
とせず製品の小形化を妨げるおそれはない。また、ヒー
トシンク５の能力如何によっては、フィン２０面積を減
じることができるから、狭い場所で放熱する必要がある
場合には有利である。Note that since the heat sink 5 is housed between the IC package 1 and the substrate 3, it does not require a large amount of extra space and there is no risk of hindering miniaturization of the product. Furthermore, depending on the capacity of the heat sink 5, the area of the fins 20 can be reduced, which is advantageous when heat needs to be dissipated in a narrow space.

前記各図と同一部分には同一符号を付した第３図は本発
明の第３の実施例を示す。この実施例では、熱の放散体
としてヒートシンク板を使用する。FIG. 3 shows a third embodiment of the present invention, in which the same parts as those in the previous figures are denoted by the same reference numerals. In this embodiment, a heat sink plate is used as a heat dissipator.

すなわち、ＩＣパッケージ１の接地ピン４を基板３に貝
通させ、接地ピン４の先端間はヒートシンク板７によっ
て熱的に接続されている。That is, the ground pins 4 of the IC package 1 are passed through the substrate 3, and the tips of the ground pins 4 are thermally connected by the heat sink plate 7.

ＩＣパッケージ１内で発生した熱は、接地ピン４からヒ
ートシンク板７に伝達されここから放熱されるのと、パ
ッケージ上面からフィン２に伝達されここから放熱され
るのとの両面で放熱される。Heat generated within the IC package 1 is radiated both from the ground pin 4 to the heat sink plate 7 and radiated therefrom, and from the top surface of the package to the fins 2 and radiated from there.

接地ピン４はパッケージ内部の電気回路と直接に接続さ
れており、熱抵抗もきわめて低いのでパッケージ１内部
で発生した熱は、ヒートシンク板７にきわめて低い熱抵
抗で伝達され、ヒートシンク板７による冷却は良好に行
われ、パッケージ１上面を介してのフィン２からの放熱
と相俟ってパッケージ１内の温度上界を防止する。The grounding pin 4 is directly connected to the electrical circuit inside the package and has extremely low thermal resistance, so the heat generated inside the package 1 is transmitted to the heat sink plate 7 with extremely low thermal resistance, and the heat sink plate 7 does not provide cooling. This is well done, and together with the heat dissipation from the fins 2 through the upper surface of the package 1, an upper limit of the temperature inside the package 1 is prevented.

なお、ヒートシンク板７は必要に応じてその大きさを変
更することができ、基板下のスペースが許す限りヒート
シンク板７を大きくして、フィン２を省略することもで
きる。また、基板下一杯にヒートシンク板を大きくして
、複数のＩＣパッケージの放熱に共用することもでき、
ＩＣパッケージの小形化に伴なう高効率の冷却手段と言
うことができる。Note that the size of the heat sink plate 7 can be changed as necessary, and the heat sink plate 7 can be made as large as the space under the board allows, and the fins 2 can be omitted. In addition, the heat sink plate can be enlarged to the bottom of the board and used for heat dissipation from multiple IC packages.
This can be said to be a highly efficient cooling means as IC packages become smaller.

［発明の効果］ 上記から明らかなように本発明のＩＣパッケージにおい
ては、パッケージ内で発生した熱を効率良く放熱できる
ので、本発明のＩＣバツケ〒ジは高密度実装のＩＣパッ
ケージとして最適のものである。[Effects of the Invention] As is clear from the above, the IC package of the present invention can efficiently dissipate the heat generated within the package, making the IC package of the present invention optimal as a high-density packaging IC package. It is.

【図面の簡単な説明】[Brief explanation of drawings]

第１図本発明の第１の実施例の正面図、第２図は第２の
実施例の正面図、第３図は第３の実施例の正面図である
。 １・・・ＩＣパッケージ　　２・・・フィン３・・・基
板　　　　　　　４・・・接地ピン５・・・ヒートシン
ク　　　６・・・接続片７・・・ヒートシンク板 出願代理人FIG. 1 is a front view of the first embodiment of the present invention, FIG. 2 is a front view of the second embodiment, and FIG. 3 is a front view of the third embodiment. 1... IC package 2... Fin 3... Board 4... Ground pin 5... Heat sink 6... Connection piece 7... Heat sink board application agent

Claims (1)

【特許請求の範囲】[Claims] パッケージ内の電気回路と直接に接続した接地ピンを熱
の放散体と熱的に接続したことを特徴とするＩＣパッケ
ージ。An IC package characterized in that a ground pin directly connected to an electric circuit within the package is thermally connected to a heat dissipator.
JP7181885A 1985-04-03 1985-04-03 Ic package Pending JPS61229344A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7181885A JPS61229344A (en) 1985-04-03 1985-04-03 Ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7181885A JPS61229344A (en) 1985-04-03 1985-04-03 Ic package

Publications (1)

Publication Number Publication Date
JPS61229344A true JPS61229344A (en) 1986-10-13

Family

ID=13471512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7181885A Pending JPS61229344A (en) 1985-04-03 1985-04-03 Ic package

Country Status (1)

Country Link
JP (1) JPS61229344A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062389A (en) * 2008-09-04 2010-03-18 Sony Corp Integrated device and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062389A (en) * 2008-09-04 2010-03-18 Sony Corp Integrated device and electronic equipment

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