JPS61228646A - Ic-chip extracting tool - Google Patents
Ic-chip extracting toolInfo
- Publication number
- JPS61228646A JPS61228646A JP6956985A JP6956985A JPS61228646A JP S61228646 A JPS61228646 A JP S61228646A JP 6956985 A JP6956985 A JP 6956985A JP 6956985 A JP6956985 A JP 6956985A JP S61228646 A JPS61228646 A JP S61228646A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- arms
- pull
- pair
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
Abstract
Description
【発明の詳細な説明】
Ａ Ｍ業上の利用分野
本発明は、ＩＣチップ抜取り工具、特に富士速製Ｍ８
８８５０８−ＣＦ ＲＯＭ チップのような、特殊なソ
ケットに実装されているＩＣチップを抜き取るための工
具に関する。[Detailed description of the invention] A Field of application in the M industry The present invention relates to an IC chip extraction tool, particularly an M8 manufactured by Fujisoku.
88508-Relates to a tool for extracting IC chips mounted in special sockets, such as CF ROM chips.
Ｂ 発明の概要
本発明によるＩＣチップ抜取り工具は抜き取ろうとする
ＩＣテップの中心においてそのＩＣチップに立てたＩｉ
線ＩＩｃ関して対称な回転運動と平行移動を組み合わせ
た一連の動作上行なうリンク機構によりそのＩＣチップ
なソケットやチップ自体に傷みを与えることをしに確実
に抜き堆ることを可能にする。B. Summary of the Invention The IC chip extraction tool according to the present invention is a tool for extracting an IC chip that is placed at the center of the IC chip to be extracted.
A series of operational linkages combining rotational and translational movement symmetrical about line IIc allows for reliable ejection of the IC chip without damaging the socket or the chip itself.
Ｃ従来の技術
ＩＣテップには、鉤えは富士速製のＭＢ ８８５０ｇ−
ＣＦのよ５Ｖｃ＠３図に示す如＜ＩＣチップ７を特殊な
形状なもつソケットに実装するものがある。C Conventional technology The hook for the IC tip is MB 8850g made by Fujisoku.
There is a type of CF, such as 5Vc@3, in which an IC chip 7 is mounted in a socket having a special shape, as shown in FIG.
実装されるとＩＣテップ７はその糊面の端子νがソケッ
ト内面の端子１３に、＊触し電気的接続が得られるよう
になっている。との−負接続を確実にするためＩＣテッ
プ７はソケット８内ｋかなり強固に密着するので、その
チップ７を交換するｋはビンセット等先端の鋭利なもの
ｔ切り欠き１４ｔ’介してソケット内に挿入しこじるよ
うにして抜き取らざるな得なかった。When mounted, the terminal ν on the adhesive side of the IC chip 7 touches the terminal 13 on the inner surface of the socket, thereby establishing an electrical connection. In order to ensure a negative connection with the IC tip 7, it fits quite tightly inside the socket 8, so when replacing the chip 7, insert a sharp object such as a bottle set into the socket through the notch 14t'. I had no choice but to insert it and pry it out.
Ｄ 発明が解決しようとする問題点
しかし従来の抜き取り方法はソケットにむりな力なかけ
る他、その使用した工具先端でソケット端子にｍ命的な
損傷を与え易く、そのうえ作業方法も画一的でな（、Ｉ
Ｃチップ交換時の作業性や交換恢の信頼性に欠けるとい
う欠点があった。D. Problems to be solved by the invention However, the conventional extraction method not only applies excessive force to the socket, but also tends to cause fatal damage to the socket terminal with the tip of the tool used, and furthermore, the working method is not uniform. Na(, I
There were drawbacks such as a lack of workability and reliability when replacing the C chip.
本発明の目的は、上述したソケットに実装されているＩ
Ｃチップを一連の動作で確実に、かつソケットやチップ
自体に何ら損傷を与えずに抜き取ることｔ可能くするＩ
Ｃチップ抜取り工具を提供することである。The object of the present invention is to implement an I
It is possible to remove the C chip reliably in a series of operations without causing any damage to the socket or the chip itself.
An object of the present invention is to provide a C-chip extraction tool.
Ｅ 問題点な解決するための手段
上記目的を達成するために、本発明によるＩＣチップ抜
取り工具は、１対のグリップアームと、咳グリップアー
ムの対を掘るとき、互に反対方向に回転するプルアップ
アームと、咳プルアップアームの各々と上下動するリン
クで連結され、連結されているプルアップアームと同じ
方向に回転する１対のキャッチアームと、上記リンクの
下端部にＩ＆けられていて抜き取ろうとするＩＣチップ
を挿み、上記グリップアームの対を握るとき、 ＩＣ
チップを挿んだ状態で上昇するチャックとｔ備えたこと
を要旨とする。E. Means for Solving Problems In order to achieve the above object, the IC chip extraction tool according to the present invention has a pair of grip arms and a puller that rotates in opposite directions when digging the pair of grip arms. A pair of catch arms that are connected to each of the up arm and the cough pull up arm by links that move up and down, and that rotate in the same direction as the connected pull up arms, and that are attached to the lower ends of the links. When inserting the IC chip to be removed and grasping the above pair of grip arms,
The gist is that it is equipped with a chuck that rises with the chip inserted.
Ｆ 作用
グリップアームの対を握ると、プルアームとキャッチア
ームがリンクな持ち上げる方向に回転し、リンク下端部
のチャックは先端にＩＣテップを掴んだまま上昇し、そ
れを抜き取る。F Operation When gripping the pair of grip arms, the pull arm and catch arm rotate in the direction of lifting the link, and the chuck at the lower end of the link rises while gripping the IC tip at the tip and pulls it out.
Ｇ 実施的
第１図は本発明によるＩＣチップ抜取り工具の正面図、
第２図から１！４図までは同じ工具の動作を説明するた
めの一部正面図である。G Practical Figure 1 is a front view of the IC chip extraction tool according to the present invention;
2 to 1 to 4 are partial front views for explaining the operation of the same tool.
同図におい曵、１はグリップアーム、２はリターンスプ
リング、３はプルアップアーム、４はリンク、５はキャ
ッチアーム、６はチャック、９は長孔、 １０はキャッ
チスプリング、 １１はシャーシで、１〜６，９．１０
の各部材は図示の如く夫々１対ずつシャーシｌｌ上に設
けられ【いる。即ち、グリップアームｌはシャーシｌｌ
上に回動可能に設けられていて、リターンスプリング２
を介してプルアップアーム３に連結されており、常時は
１１１図の位置にあるように該スプリングによって付勢
されている。プルアップアーム３もシャーシ■上に枢支
され、夫々の一端が遊ａ １５ ｔ−有するようにビン
１４によって結合され、かつリンク４を介してキャッチ
アーム５の一端に連結されている。キャッチアーム５の
他端はシャーシ１１に形成した長孔９内にビン１６によ
って遊嵌され、かつビン１６にはキャッチスプリング１
０が係合している。リンク４の下端部にはチャック６が
設けられている。In the same figure, 1 is the grip arm, 2 is the return spring, 3 is the pull-up arm, 4 is the link, 5 is the catch arm, 6 is the chuck, 9 is the elongated hole, 10 is the catch spring, 11 is the chassis, 1 ~6,9.10
As shown in the figure, a pair of each member is provided on the chassis II. That is, grip arm l is connected to chassis ll
The return spring 2 is rotatably provided on the top.
The pull-up arm 3 is connected to the pull-up arm 3 through the pull-up arm 3, and is normally biased by the spring so that it is in the position shown in Fig. 111. The pull-up arm 3 is also pivotally supported on the chassis 1, and one end of each is connected by a pin 14 with play a 15 t-, and is connected to one end of the catch arm 5 via a link 4. The other end of the catch arm 5 is loosely fitted into a long hole 9 formed in the chassis 11 by a pin 16, and a catch spring 1 is attached to the pin 16.
0 is engaged. A chuck 6 is provided at the lower end of the link 4.
第２図に示すよ５に抜き取ろうとするＩＣチップ７ｔ＃
挿むようにチャック６なソケット８の中に挿入する。つ
いで、グリップアーム１の対の上部な握り締めると、下
端は広がり、プルアップアーム３１に：矢印の方向に回
転させる。プルアップアーム３の内側の先端にはリンク
４の上端が回転するように連結されており、プルアップ
アーム３０回転とともにリンク４は引き上げられる。リ
ンク４の下端はキャッチアーム５の内側の先端と回転す
るよ５に連結されており、リンク４が上昇すると、キャ
ッチアーム５は１８３図に示す矢印の方向に回転し、同
時にリンク４の先端は矢印で示すように挟まり、その先
端に形成されているチャック６はＩＣチップ７な挿む。As shown in Figure 2, the IC chip 7t# to be extracted at 5
Insert it into the socket 8 of the chuck 6. Then, when the upper part of the pair of grip arms 1 is squeezed, the lower ends are spread, and the pull-up arm 31 is rotated in the direction of the arrow. The upper end of a link 4 is rotatably connected to the inner tip of the pull-up arm 3, and the link 4 is pulled up as the pull-up arm 30 rotates. The lower end of the link 4 is rotatably connected to the inner tip of the catch arm 5. When the link 4 rises, the catch arm 5 rotates in the direction of the arrow shown in Figure 183, and at the same time the tip of the link 4 The IC chip 7 is inserted into the chuck 6 formed at the tip of the chuck as shown by the arrow.
チャック６がＩＣチップ７に当った後では、第４図に矢
印で示すよ５に、キャッチアーム５の上端が長孔９の中
な互に遠ざかる方向に移動し、リンク４は上昇し続け、
ＩＣチップ７なソケット８から抜き取る。このときジャ
ッジ１１の先端は、第４図に見られるよ５に、ソケット
８に当っており、ＩＣチップ７の抜き取りを助ける。After the chuck 6 hits the IC chip 7, the upper ends of the catch arms 5 move away from each other in the elongated hole 9 as indicated by arrows 5 in FIG. 4, and the links 4 continue to rise.
Remove the IC chip 7 from the socket 8. At this time, the tip of the judge 11 is in contact with the socket 8, as shown in FIG. 4, and assists in extracting the IC chip 7.
Ｈ発明の詳細
な説明した通り、本発明によるＩＣチップ抜取り工具な
使用すれば、上述したリンク機１１１による一連の動作
によつ″ＣＣラワンタッチＩＣチップをソケットからは
ずし、それな喬直に掴み上げることができるので作業性
に優れ、ＩＣチップやソケットＩＣ損傷な与えることか
ないので、交換時に宛先しやすい接触不良等の信頼性の
低下が防止でき、また引抜き時、ソケット外筐な支点と
するため、ソケットの半田面への影響や、基板自体への
むすな力か全くかからない、構造が簡単で、価格並びに
保守に対し大変有利であるという利点が得られる。As described in detail in the invention, when the IC chip extraction tool according to the present invention is used, the above-mentioned link machine 111 removes the IC chip from the socket and directly grabs it. Since it can be raised up, it has excellent workability, and since it does not damage the IC chip or socket IC, it is easy to use when replacing it, and prevents reliability degradation such as poor contact. Also, when pulling out the socket, it can be used as a fulcrum on the outer casing of the socket. Therefore, the advantages are that there is no influence on the solder surface of the socket, no force is applied to the board itself, the structure is simple, and it is very advantageous in terms of cost and maintenance.
１３１図は本発９１ｍｋよるＩＣチップ抜取り工具の３
・・・プルアッグアーム、４・・・リンク、５・・・キ
ャッチアーム、６・・・チャック、７・−ＩＣチップ、
８・・・ソケット、９・・−長孔、ｌＯ・・・キャッチ
スプリング、ｌ】・・・ジャッジ。
第５図Figure 131 shows 3 of the IC chip extraction tool made by the original 91mk.
...Pull-up arm, 4...Link, 5...Catch arm, 6...Chuck, 7.-IC chip,
8...Socket, 9...-long hole, lO...catch spring, l]...judge. Figure 5
Claims (1)
に回転するプルアツプアームと、 （ｃ）該プルアツプアームの各々と上下動するリンクで
連結され、連結されているプルアツプアームと同じ方向
に回転する１対のキヤツチアームと、（ｄ）上記リンク
の下端部に設けられていて、抜き取ろうとするＩＣチッ
プを挿み、上記グリツプアームの対を撮るとき、ＩＣチ
ップを挿んだ状態で上昇するチャックとを備えた ことを特徴とするＩＣチップ抜取り工具。[Claims] (a) a pair of grip arms; (b) a pull-up arm that rotates in opposite directions when taking pictures of the pair of grip arms; (c) each of the pull-up arms up and down; (d) a pair of catch arms connected by movable links and rotating in the same direction as the connected pull-up arms; (d) provided at the lower end of the link, into which the IC chip to be extracted is inserted; An IC chip extraction tool comprising: a chuck that rises with an IC chip inserted when the pair of grip arms is taken.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6956985A JPS61228646A (en) | 1985-04-02 | 1985-04-02 | Ic-chip extracting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6956985A JPS61228646A (en) | 1985-04-02 | 1985-04-02 | Ic-chip extracting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61228646A true JPS61228646A (en) | 1986-10-11 |
Family
ID=13406541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6956985A Pending JPS61228646A (en) | 1985-04-02 | 1985-04-02 | Ic-chip extracting tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61228646A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016196048A (en) * | 2015-04-02 | 2016-11-24 | アサヒプリテック株式会社 | Removal device |
| JP2016196049A (en) * | 2015-04-02 | 2016-11-24 | アサヒプリテック株式会社 | Removing method of object to be removed |
-
1985
- 1985-04-02 JP JP6956985A patent/JPS61228646A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016196048A (en) * | 2015-04-02 | 2016-11-24 | アサヒプリテック株式会社 | Removal device |
| JP2016196049A (en) * | 2015-04-02 | 2016-11-24 | アサヒプリテック株式会社 | Removing method of object to be removed |
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