JP2629495B2 - Pin removal method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing a plurality of pins inserted into a difference hole (through hole) of a matrix board (printed circuit board) in a sword-like manner. The present invention relates to a method for removing a pin that can be removed from a difference hole (through hole) of a printed circuit board.

The other end of a telephone line having one end connected to a telephone or the like is connected to a matrix board connected to an exchange, that is, a printed board provided with a plurality of difference holes (through holes). The connection and disconnection between the telephone line and the exchange are performed by inserting and removing a needle-like pin into a difference hole (through hole).

[0003] Since the number of telephone lines is several thousands, and in some cases, tens of thousands, the number of pins to be inserted into and removed from the difference holes (through holes) is extremely large, and the number of pins is increased. The number of man-hours for removing the pin increases. In addition, extra-fine pins are required due to miniaturization of the device.

Therefore, the difference hole (through hole)
As a part of improving the efficiency of inserting and removing a pin from the pin without damaging the pin, there is a strong demand for a pin removing method capable of efficiently removing a pin inserted into a difference hole (through hole).

A matrix board having a vertical line group and a horizontal line group and forming a signal path by inserting a cross connection pin into a difference hole provided at an intersection of the vertical line group and the horizontal line group will be described below. The substrate and the difference hole are hereinafter defined as through holes. That is, the through hole itself is not a continuous conductor and is in a connected state.

[0006]

2. Description of the Related Art Next, a conventional method for removing a pin inserted into a through hole of a printed circuit board will be described with reference to FIGS. FIGS. 1A and 1B are views for explaining a pin removing device, in which FIG. 1A is a sectional side view of a main part showing a configuration of the device, and FIG. 2
FIG. 4 is a diagram for explaining a pin removal speed.

[0007] In this specification, the same parts, the same materials, and the like are given the same reference numerals throughout the drawings. When the number of pins inserted in a through hole of a printed circuit board is small, it is not uncommon for the method to remove the pins manually by using tweezers or the like. It is performed by a pin removal device.

This pin removing device is controlled by a central processing unit 50 to hold a pin 21 inserted into a through hole 10a of a printed circuit board 10 and to release the pin 11 from a pin holding mechanism 20 having a hand 21. A compliance mechanism 30 that accommodates the pin gripping mechanism 20 in the housing 31 excluding the hand 21 and elastically supports the pin gripping mechanism 20 in a space inside the housing 31 by a spring 32, for example, Central processing unit 50
Is controlled by the hand 21 of the compliance mechanism 30
Is connected to the piston 41 on the side wall of the housing 31 opposed to
The moving mechanism 40 moves in the Pb direction.

Next, a method of removing the pins 11 inserted into the through holes 10a of the printed circuit board 10 by using the pin removing device will be described step by step. First, the pin gripping mechanism 20 controlled by the central processing unit 50 moves the iron core 22 of the solenoid in the direction of the arrow Fa, and moves the hand 21 in the direction of the arrow.
Rotate in the Ha direction to open.

Next, the moving mechanism 40 controlled by the central processing unit 50 pushes the piston 41 in the direction of the arrow Pa, and the head of the pin 11 inserted into the through hole 10a of the printed circuit board 10 Press with the tip of the rod 23. When the rod 23 hits the head of the pin 11, the compliance mechanism 30 becomes free.

Thereafter, the pin gripping mechanism 20 is moved to its core 22
Is moved in the direction of the arrow Fb, and the hand 21 which has been rotated and opened in the direction of the arrow Ha is rotated in the direction of the arrow Hb to grip the pin 11 from four directions (see FIG. 1 (b)).

In this state, when the moving mechanism 40 gradually retracts the piston 41 in the direction of the arrow Pb and moves the housing 31 of the compliance mechanism 30 in the direction of the moving mechanism 40, the pin gripping mechanism 20 The pin 11 moves freely within the axis, and the axis of the pin 11 coincides with the direction of the pulling force applied to the pin.

When the moving mechanism 40 draws the piston 41 further deeply in the direction of the arrow Pb, the pin holding mechanism 20 and the housing 31 of the compliance mechanism 30 are moved together.
In the direction of
Is removed.

[0014]

However, when the pin 11 is removed by such a mechanism, there are the following problems.

One of them is that the compliance mechanism 30 must be operated with a force greater than a specific force in order to operate the compliance mechanism 30 when gripping the pin 11, but the pin 11 is suddenly moved with a large gripping force. The problem is that the pin 11 breaks when gripped.

Further, in order for the compliance mechanism 30 to operate, the rod 23 is pressed against the pin 11 to float the housing 31. However, during the extraction process, the force pressing the pin 11 disappears, and the compliance mechanism 30
Tries to return to the original state. This force is applied to the pin 11 and the pin gripping mechanism 20, so that the pin gripping mechanism 20
If the gripping force is less than that force, the pin 11 opens slightly and the pin 11 does not slip out. Also, if the pin 11 is gripped with too much force, the force applied to the pin 11 during the extraction process
(Moment) increases and the pin 11 is damaged. In the conventional pin removing method, when the pin 11 is gripped, the pin 11 is operated with a constant force as shown by a curve A in FIG. When the pin 11 was pulled out, the pin 11 was operated at a constant speed as shown by a curve A in FIG. For this reason,
The second problem is that the pin 11 is damaged during the removal process or does not slip out.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide a method for removing pins from a through-hole of a printed circuit board efficiently without damaging the pins. It is in.

[0018]

The object of the present invention is to grasp and release the outer peripheral surface of a pin 11 which is inserted into a through hole 10a of a printed circuit board 10 so as to be freely inserted and removed, as shown by a curve B in FIGS. Pin holding mechanism 20 having a hand 21 for performing
The compliance mechanism 30 supporting the pin gripping mechanism 20 in the space inside the housing 31 excluding at least the hand 21 by the elastic means 32, and the tip of the piston 41 to the housing 31 of the pin gripping mechanism 20. Connected, Compliance Mechanism Department 30
A moving mechanism unit 40 for alternately moving forward and backward with respect to the printed circuit board; and a pin removing device including a central processing unit 50 for controlling operations of the pin gripping mechanism unit 20 and the moving mechanism unit 40.
In the method of removing the pin 11 inserted in the through hole 10a, the pin inserted in the through hole 10a with the hand 21
When gripping 11, the gripping force is gradually increased to a predetermined gripping force, and when the pin 11 gripped by the hand 21 is pulled out, the range in which the coupling force between the through hole 10a and the pin 11 is large is The gripping force of the pin 11 by the hand 21 is removed at a low speed while maintaining the predetermined gripping force, and the gripping force of the pin 11 after the coupling force is reduced is reduced at a high speed by reducing the predetermined gripping force. This is achieved by a method for removing a pin.

[0019]

According to the pin removing method of the present invention, when the pin 11 is gripped, the pin 11 is controlled so as to gradually increase the force as shown by the curve B in FIG. At the time when the gripping operation is completed, the gripping force is increased to a value sufficient for operating the compliance mechanism 30. Next, the moving mechanism 40 is operated, but before the operation, the compliance mechanism 30
The grip force is increased so that the hand 21 does not open due to the reaction force of the hand. As for the operating speed of the moving mechanism 40, the withdrawal speed of the piston 41 of the moving mechanism 40 is reduced in a range where the coupling force between the through hole 10a of the printed circuit board 10 and the pin 11 is large (range Sa in FIG. 2). After the coupling force is reduced (the range of Sb in FIG. 2), the speed of the piston 41 is increased, and the gripping force is reduced.

Therefore, the method for removing the pin of the present invention is as follows.
The pins 11 can be efficiently removed from the through holes 10a of the printed circuit board 10 without being damaged.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for removing a pin according to an embodiment of the present invention will be described below with reference to FIGS.

The pin removing method according to one embodiment of the present invention uses the pin removing device used in the above-described conventional pin removing method as it is, and substantially follows the method of use.

However, in the pin removing method according to one embodiment of the present invention, the pin 11 is not damaged and the removal speed of the piston 41 of the moving mechanism 40 (the retraction speed in the direction of arrow Pb in FIG. 1) is determined. As shown by curve B in FIG. 2, the pin 11 and the through-hole until the tip of the pin 11 comes to a substantially middle position in the depth direction of the through-hole 10a of the printed circuit board 10.
Since the bonding force with the pin 10a is large, the speed in the conventional pin removal method is used, and the bonding force between the pin 11 and the through-hole 10a becomes almost zero when the tip of the pin 11 passes through Sa.
The range of Sb is set to double speed.

Therefore, since usually Sa <Sb, the pin removing method according to the embodiment of the present invention can efficiently remove the pin from the through hole of the printed circuit board. The gripping force of the hand 21 of the pin gripping mechanism 20 (for example, the voltage applied to the solenoid), the withdrawal speed on the piston 41 of the moving mechanism 40, Sa and Sb, etc. are previously input as data to the central processing unit 50. It goes without saying.

[0025]

As described above, according to the present invention, the pins can be efficiently removed from the through holes of the printed circuit board without damaging the pins.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a pin removing device;

FIG. 2 is a diagram for explaining a pin removal speed;

FIG. 3 is a diagram illustrating a state of a change in a gripping force of a pin by a hand.

[Explanation of symbols]

 10 is a printed circuit board, 10a is a through hole, 11 is a pin, 20 is a pin gripping mechanism, 21 is a hand, 22 is an iron core, 23 is a rod, 30 is a compliance mechanism, and 31 is The housing, 32 is a spring (elastic means), 40 is a moving mechanism, 41 is a piston, and 50 is a central processing unit.

Claims (1)

(57) [Claims] 1. A through hole (10a) in a printed circuit board (10).
A pin gripping mechanism (20) having a hand (21) for gripping and releasing the outer peripheral surface of a pin (11) inserted and removed freely into the
A compliance mechanism (30) in which a pin gripping mechanism (20) is supported by elastic means (32) in a space inside a housing (31) housed except for at least the hand (21); and a piston (41). A moving mechanism section (40) that connects the tip to the housing (31) of the pin gripping mechanism section (20) and alternately moves forward and backward with the compliance mechanism section (30), and a pin gripping mechanism section (20) A pin inserted into a through-hole (10a) of a printed circuit board (10) by a pin removing device including a central processing unit (50) for controlling the operation of the moving mechanism unit (40).
In the removal method of (11), the pin (11) inserted into the through hole (10a) with the hand (21)
When grasping a pin, the grasping force increases gradually and reaches a predetermined grasping force, and when removing the pin (11) grasped by the hand (21), the connection between the through hole (10a) and the pin (11) is performed. In the range where the force is large, the gripping force of the pin (11) by the hand (21) is pulled out at a low speed while maintaining the predetermined gripping force, and the gripping force of the pin after the coupling force decreases becomes the predetermined gripping force. A pin removal method characterized in that the pin is reduced and removed at a high speed.