JPS6122859B2 - - Google Patents
Info
- Publication number
- JPS6122859B2 JPS6122859B2 JP9725178A JP9725178A JPS6122859B2 JP S6122859 B2 JPS6122859 B2 JP S6122859B2 JP 9725178 A JP9725178 A JP 9725178A JP 9725178 A JP9725178 A JP 9725178A JP S6122859 B2 JPS6122859 B2 JP S6122859B2
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- plate
- insulating plate
- wiring metal
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9725178A JPS5524464A (en) | 1978-08-11 | 1978-08-11 | Complex semiconductor system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9725178A JPS5524464A (en) | 1978-08-11 | 1978-08-11 | Complex semiconductor system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5524464A JPS5524464A (en) | 1980-02-21 |
| JPS6122859B2 true JPS6122859B2 (enrdf_load_stackoverflow) | 1986-06-03 |
Family
ID=14187343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9725178A Granted JPS5524464A (en) | 1978-08-11 | 1978-08-11 | Complex semiconductor system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5524464A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5642410Y2 (enrdf_load_stackoverflow) * | 1976-08-12 | 1981-10-05 |
-
1978
- 1978-08-11 JP JP9725178A patent/JPS5524464A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5524464A (en) | 1980-02-21 |
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