JPS61227198A - Method for plating on circular outside peripheral part of printing wheel for printer or the like and plating device used for said method - Google Patents

Abstract

PURPOSE:To form a plating layer which is uniform and thick on the surface of printing wheels in the stage of subjecting the printing wheels of a printing device to plating by revolving the wheels while rotating between two anodes in a plating cell and conducting electricity thereto. CONSTITUTION:A rotatable cathode 3 is disposed in the plating liquid 2 in the plating cell 1 and many pieces of the printing wheels 12 are attached to a rack 11 attached and connected radially with plural pieces of hangers 9 for rack to the cathode 3. The anodes 7 consisting of an Ni metal are disposed to the inside wall part of the cell 1 and the outside of the cathode 3. The plural racks 11 are rotated between both anodes 17 by rotating the cathode 3; and the wheels 12 as the cathode are electroplated with Ni while the rack 11 itself is rotated by a reel 13 for rotation. The thick Ni plating layer is effectively formed on the outside peripheral surface of the wheels 12, i.e., the part on the outside peripheral surface required to be inscribed with types. The thin Ni plating layer is formed on the upper and lower unnecessary parts.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a plating method useful when forming a printing shaft used in a printing device such as a check writer by plating coating on plastic, and a plating method using this method. The present invention relates to plating apparatus useful for carrying out the method.

[Conventional technology]

BACKGROUND ART Conventionally, a method has been known in which a print shaft body is formed using plastic as an alternative to metal, and the outer surface is coated with plating.

Conventionally, a method as shown in FIG. 6 has been used to perform the above-mentioned plating process.

That is, a plating bath 1 is filled with a plating solution 2, a nickel anode 3 is arranged on the outer periphery of the plating bath 1, and a cathode 4 is placed in a rack 40 in the center.
．． This is done by fitting and locking the resin dial 42, which is the object to be plated, into a shaft mounting hole provided in the center of a branch rack 41 that protrudes from the rack 40 in the radial direction, and then energizing it. was.

[Problem that the invention seeks to solve]

However, the conventional method described above has a drawback in that the thickness of the plating layer of each object to be polished varies and becomes non-uniform.

This is mainly due to ■Differences in the distance between the nickel anode and the object to be plated in the plating tank, ■Differences in current density in the upper, middle, and lower parts of the plating tank, and ■Differences in the distance between the nickel anode and the object to be plated in the plating tank, and ■Differences in the current density in the upper, middle, and lower parts of the plating tank. This problem is caused by differences in the density of the suspended objects to be plated, (2) and differences in conductive resistance.

In view of this, the present invention aims to reduce the thickness and unevenness on the circumference without damaging the tip shape of the outer periphery of the plastic body formed in the shape of a disc, that is, the outer surface shape of the type engraved on the outer periphery. The purpose is to realize highly reliable plating coating without causing any damage.

[Means for solving problems]

In the present invention, a thick and uniform plating layer is formed on the outer peripheral surface of the plastic object to be plated by rotating the object to be plated made of plastic in a plating bath and energizing the object while revolving around an electrode. .

An example of this will be described in detail.

1 is a plating tank, and the inside of this plating tank 1 is filled with a plating solution 2. Further, a cathode shaft 3 is disposed in the center of the plating tank 1.

The lower end 3a of the cathode shaft 3 protrudes downward through the bottom wall 1a of the plating tank, and is inserted into a cathode energizing box 4 filled with a conductor such as mercury.

Further, the cathode shaft 3 has a cap gear 5 fitted on the shaft 3.
The driving force of the drive motor 6 is transmitted and rotated. Furthermore, a hanger cathode receiver 7 is attached to the upper end 3b of the cathode shaft 3. A rack holder 8 projects in the radial direction from the hanger cathode holder 7, and a rack hanger 9 and a cathode energizing saddle 10 are disposed at the tip thereof in two directions, one above the other. Further, a vertical rod 8a hangs downward from the middle part of the rack support 8, and an annular rack lower end support 8b is attached to the lower end of the vertical rod 8a.

Further, 1) is a rack, into which the object to be plated 12 is inserted and mounted through its center hole. The rack 1) has a rack rotating roll 13 attached to its upper end, the neck region of this roll 13 is supported by the rank hanger 9 and the cathode current-carrying saddle 10, and its lower end is supported by the rack lower end supporter 8b. There is.

Note that the hanger cathode receiver 7. Rack holder 8° Rack hanger 9. The cathode current-carrying saddle 10 and the like are all made of copper, brass, stainless steel, or the like having good conductivity, and are configured to use the object 12 to be plated as a cathode.

Although the rack 1) is not shown in FIG. 1, ten racks can be mounted in this example. 1. Next, the roll 13 is pressed against the rolling contact surface 14A of the rack rotation ring 14 disposed above the plating tank 1. Note that the ring 14 is attached, for example, to the upper end of the support column 15 via a hinge 16.

Note that 17 is an Nt anode, which is suspended by a Cu ring 18.

Therefore, in the above configuration, by operating the drive motor 6, the cathode shaft 3 is rotated, and accordingly, the entire rack receiver 8, which is integrated with this shaft 3, is also rotated.

In addition, the racks 1 each mounted on the rack receiver 8 are
Since the rack rotation roll 13 attached above the rack 1) is in rolling contact with the rolling contact surface 14A of the rack rotation ring 14, the plated object 12 is also rotated as the rack 1) rotates on its own axis.

Therefore, by passing a current during the above rotation, the anode Cu
Current flows from the ring 18 to the rack 1), and this rack 1)
) is to be plated.

FIG. 3 is a partially enlarged view of FIG. 2, and as is clear from this figure, the objects 12 to be plated are mounted on the rack 1) so as to fit the shaft mounting holes 12a and stack them. There is. Above and below the group of objects 12 to be plated, auxiliary cathode plates 21 formed in a disc shape of stainless steel, copper, brass, etc. are attached via spacers 19 and fixed with nuts 20.

This auxiliary cathode plate 21 acts to alleviate concentration of current density at the top and bottom of the group of objects 12 to be plated.

In addition, as a method of applying electricity to bring the rack 1) and the object 12 to the same potential, as shown in FIG. 4, a coil spring 22 is wound around the outer periphery of the rack 1), This can be easily achieved by contacting the Note that the coil spring 22 is wound around the rack 1) and tightened to reduce its diameter, and if the object 12 to be plated is inserted in this state and the spring 22 is released, the coil spring 22 will expand in diameter. It will come into firm pressure contact with the hole 12a.

In addition, as shown in FIG.
3 may be sandwiched between each of the overlapping objects 12 to be plated, and the cup 23 may be brought into contact with the side surface of each object 12 to be plated.

〔Effect of the invention〕

In the above configuration, the object to be plated 12 is inserted into the stacking rack 1), and the entire object to be plated 12 serves as a cathode via the spring 22 or cup 23 of rank 1).

Therefore, when a current is passed through the plating tank 1, it flows from the anode to the cathode, and the current density is high on the outer circumferential surface of the plated object 12, that is, on the circumferential surface of the printing shaft where the type is engraved.
In Figure 2, the current density on both the upper and lower sides is low, so there is a difference in the thickness of the plating film, and the plating layer is thick on the outer peripheral surface of the object to be plated, and thinner on both sides.

In this way, the plated layer on the outer circumferential surface of the object to be plated, that is, the type ring, is thick and both sides are thin, so the engraved type portions formed on the outer circumferential surface are directly subjected to load during printing, and frictional force is also Although it is a large area, it is well protected. In addition, there are places on both sides and the inner diameter that come into contact with other parts such as the printing machine controller, ratchet, guide, etc. Also, the inner diameter has a thin plating coating due to the clearance with the shaft, making it easier to manage. Become.

[Brief explanation of the drawing]

FIG. 1 is a schematic vertical sectional view of the plating bath, and FIG. 2 is a plan view thereof. Fig. 3 is an enlarged vertical cross-sectional view of the main part explaining the energization state of the rank and the object to be plated, Fig. 4 is an enlarged longitudinal sectional view of the main part showing an example of the energization method, and Fig. 5 is the same (showing another example). 6A is a plan view of the cup, FIG. 6B is a side view of the cup, and FIG. 6C is an enlarged vertical cross-sectional view of a main part showing an energized state. FIG. 6 is a schematic vertical cross-section showing a conventional example. It is a diagram. 1... Plating tank 3... Cathode shaft Muro... Drive motor 1)... Rack 12... Object to be plated 14... Rack rotation ring 17... Ni cathode 18 ...Anode Cu ring patent applicant Max Co., Ltd. Max Electronics Co., Ltd.

Claims (2)

[Claims] (1) A method of plating a plastic body, such as a printer printing wheel, by rotating the body in a plating bath and energizing it while revolving around an electrode. (2) A cathode shaft is disposed in the center of the plating tank, and an anode is disposed around the circumference, and a rack for mounting the plated objects that can rotate around the cathode shaft and rotate on its own axis is attached to the anode. A plating device installed in the inner diameter direction.