JPS6122450B2 - - Google Patents
Info
- Publication number
- JPS6122450B2 JPS6122450B2 JP55104743A JP10474380A JPS6122450B2 JP S6122450 B2 JPS6122450 B2 JP S6122450B2 JP 55104743 A JP55104743 A JP 55104743A JP 10474380 A JP10474380 A JP 10474380A JP S6122450 B2 JPS6122450 B2 JP S6122450B2
- Authority
- JP
- Japan
- Prior art keywords
- hollow body
- ceramic capacitor
- capacitor unit
- grinding
- square plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003985 ceramic capacitor Substances 0.000 claims description 31
- 239000003990 capacitor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 5
- 238000005336 cracking Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Ceramic Capacitors (AREA)
Description
本発明はセラミツクコンデンサの製造方法、特
に角板状セラミツク素体の全表面に金属メツキを
施して成る角板状セラミツクコンデンサユニツト
の端面のメツキ層を研削して該コンデンサユニツ
トの表裏両表面上のメツキ層を分離させて電極を
形成する方法に関する。
近年、セラミツク電子部品、例えば、セラミツ
クコンデンサを製造する場合、その電極形成方法
として従来の銀焼き付け法に代わり化学メツキ法
が採用されるようになつてきた。しかし、この方
法ではセラミツク素体の全表面にメツキ層が形成
されるため、所要の電極を形成するためにはセラ
ミツク素体の端面に折出したメツキ、すなわち、
セラミツクコンデンサユニツトの端面を研削し、
該コンデンサユニツトの表と裏のメツキ層を分離
させて電極とする後加工が必要である。このた
め、薄肉角板状セラミツクコンデンサを製造する
場合に角板状セラミツクコンデンサユニツトの端
面を研削する方法としては、セラミツクコンデン
サユニツトの端面に硬質微粒子を吹き付けて研削
するサンドブラスト法、あるいは全面にメツキを
施した大寸法の薄板セラミツクをスライサ、スク
ライバー、ワイヤソー、レーザー等で所要寸法に
切断することにより端面加工する方法などが提案
されている。しかし、前者は個々のコンデンサユ
ニツトの寸法が小さく、しかもその肉厚が薄いこ
とから作業性に劣り量産的でないという問題があ
り、後者は加工能率あるいは生産性が悪く、また
設備費が高いという問題があつた。
本発明は、上記問題を解決し、多量の薄肉角板
状セラミツクコンデンサユニツトを同時に効率よ
く加工でき高品位の製品を得ることができるセラ
ミツクコンデンサの製造方法を提供することを目
的とする。
本発明に係るセラミツクコンデンサの製造方法
は、三角形断面形状の内周面を有し該内周面に研
削機能を付与してなる中空体内に、角板状セラミ
ツクコンデンサユニツトを装填し、前記中空体を
自転させると共に周転させて前記角板状セラミツ
クコンデンサユニツトの端面を前記中空体の内周
面と摩擦接触させることを特徴とするものであ
る。
本発明の好ましい実施態様においては、中空体
の三角形断面形状の内周面の一辺と角板状セラミ
ツクコンデンサユニツトの一辺の長さの比は
2.5：１〜3.5：１である。
以下、本発明方法の実施に使用する装置の一例
を示す添付の図面を参照して本発明を具体的に説
明する。
第１図〜第３図において、本発明に係る角板状
セラミツクコンデンサの製造方法において使用す
る装置は、セラミツクコンデンサユニツトを収容
しその端面を研削する複数の中空体１と、該中空
体１を自転させる駆動機構２および中空体１を自
転させる駆動機構３とから主として構成されてい
る。中空体１は塩化ヒニル等の合成樹脂、あるい
は銅、アルミニウム、鉄もしくはそれらの合金等
で形成され、断面形状正三角形の内周面１ａを有
し、その外周面１ｂは三角形、円形など適当な断
面形状に形成される。
また、その内周面１ａに研削機能を付与する手
段としてサンドペーパ１６を挿脱自在に内周面に
取り付けてある。しかし、サンドペーパを用いた
場合、反復して使用すると、その表面に固着され
た砥粒が脱落し、研削能力が低下すると同時に、
脱落した砥粒がコンデンサユニツト表面のメツキ
層に損傷を与えるので、これを防止するためサン
ドペーパを用いる代わりにSiC，Al2O3等の紛末
状研削剤をフエノール樹脂その他の接着剤で中空
体の内周面にコートしてもよく、また、SiC等の
紛末状研削剤を所定形状の中空体に成形し、これ
を焼成したもの、あるいはフエノール樹脂と研磨
剤を混合してホツトプレス法で直接中空体を作つ
たものなどを使用してもよい。これらの場合、サ
ンドペーパを用いた場合に比べて約1/7〜1/10に
研研削時間を短縮でき、また、研削度も0.12mm程
度にまで向上させることができる。
各中空体１は駆動用シヤフト４に固定された複
数の回転デイスク５に軸受ベアリング６を介して
回転自在にシヤフトに平行に配置され、それらを
巻回するベルト７およびモータ９に取り付けられ
たプーリ８を介してモータ９により駆動され自転
させられる。シヤフト４はその両端部で軸受ベア
リング１０を介して基台１１上に回転自在に配設
され、その一端に取り付けられたプーリ１２およ
びモータ１５に取り付けられたプーリ１３並びに
両プーリ１２，１３間に張られたベルト１４を介
してモータ１５により駆動される。従つて、モー
タ５を作動させるとシヤフト４および回転デイス
ク５が回転し、回転デイスク５に保持された各中
空体１がシヤフト４を中心にしてその周囲を回転
する。すなわち、周転する。中空体１の両端はゴ
ム栓、キヤツプ１７等で開閉される。
上記構造の装置を用いて本発明を実施する場
合、まず、各中空体１内に角状セラミツクコンデ
ンサユニツト１８を一杯になるまで装填し、次い
でその両端をゴム栓１７にて封止した後、モータ
９，１５を作動させる。モータ９を作動させると
中空体が自転し、その自転数が増加するに伴い角
板状セラミツクコンデンサユニツトはその平面が
中空体心軸に直交する方向に自立しその端面が中
空体１の研削面、例えば、サンドペーパ１６の表
面に接触する。しかし、中空体１の自転だけでは
その回転とコンデンサユニツトの回転が同じにな
り、いわゆる共回りするため端面研削ができない
ため、本発明においては中空体１を周転させるこ
とによりコンデンサユニツト１８に遠心力を付与
し、中空体１の研削面との接触圧力を大きくし、
中空体１の自転と周転によるコンデンサユニツト
端面と研削面との摩擦接触により研削し、コンデ
ンサユニツトの表裏両表面上のメツキ層を分離さ
せ、電極を形成している。なお、中空体を自転さ
せることなく周転だけさせると遠心力によりコン
デンサユニツトが研削面に押圧されるだけで研削
は行なわれない。また、コンデンサユニツトの割
れや電極となるメツキ層の損傷を来たすことな
く、研削を効果的に行なうためには、正三角形断
面形状の中空体の一辺と角板状セラミツクコンデ
ンサユニツトの一辺の長さの比が2.5：１〜3.5：
１の範囲とするのが好ましい。
なお、本発明において中空体の内周面を三角形
断面形状にしたのは、角板状セラミツクコンデン
サユニツトの端面と研削面との接触面積を増大さ
せて研削効率を高め、かつ、研削時のコンデンサ
ユニツトの割れを防止すると同時に、研削により
発生した紛末や脱落した砥粒を中空体の三角形断
面形状の内周面の頂点側に集めて電極となるコン
デンサユニツトの表裏両表面のメツキ層の損傷を
防止するためである。
以下、実施例について説明する。
一辺の長さが15mmの正三角形断面形状の内周面
を有する中空体を用い、一辺の長さ4.8mm、厚さ
0.2mmの薄肉角板状セラミツクコンデンサユニツ
トを第１図の装置により研削し、セラミツクコン
デンサユニツト100個につにて両表面間の導通テ
ストを行なつた。その結果を研削条件と共に下表
に示す。
The present invention relates to a method for manufacturing a ceramic capacitor, and more particularly, to a rectangular ceramic capacitor unit which is formed by applying metal plating to the entire surface of a rectangular ceramic element body. This invention relates to a method of forming electrodes by separating plating layers. In recent years, when manufacturing ceramic electronic components such as ceramic capacitors, chemical plating has come to be used instead of the conventional silver baking method as a method for forming electrodes. However, in this method, a plating layer is formed on the entire surface of the ceramic body, so in order to form the required electrode, it is necessary to deposit plating on the end face of the ceramic body.
Grind the end face of the ceramic capacitor unit,
Post-processing is required to separate the plated layers on the front and back sides of the capacitor unit to form electrodes. For this reason, when manufacturing thin square plate ceramic capacitors, the methods of grinding the end faces of the square plate ceramic capacitor units include the sandblasting method, in which hard particles are sprayed onto the end faces of the ceramic capacitor unit, or the entire surface is plated. A method has been proposed in which end faces are processed by cutting the large-sized thin ceramic plate into required dimensions using a slicer, scriber, wire saw, laser, or the like. However, the former has the problem of poor workability and is not suitable for mass production due to the small dimensions of each capacitor unit and thin wall thickness, while the latter has problems of poor processing efficiency or productivity and high equipment costs. It was hot. SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a method for manufacturing a ceramic capacitor that can efficiently process a large number of thin square plate-shaped ceramic capacitor units at the same time and obtain a high-quality product. A method for manufacturing a ceramic capacitor according to the present invention includes loading a rectangular plate-shaped ceramic capacitor unit into a hollow body having an inner circumferential surface having a triangular cross-sectional shape and imparting a grinding function to the inner circumferential surface; The present invention is characterized in that the end face of the square plate-shaped ceramic capacitor unit is brought into frictional contact with the inner circumferential surface of the hollow body by rotating the square plate-shaped ceramic capacitor unit on its own axis and around its axis. In a preferred embodiment of the present invention, the ratio of the length of one side of the inner peripheral surface of the triangular cross-sectional shape of the hollow body to the length of one side of the square plate-shaped ceramic capacitor unit is
The ratio is 2.5:1 to 3.5:1. The present invention will now be described in detail with reference to the accompanying drawings, which show an example of the apparatus used to carry out the method of the present invention. 1 to 3, the apparatus used in the method of manufacturing a rectangular ceramic capacitor according to the present invention includes a plurality of hollow bodies 1 for accommodating ceramic capacitor units and grinding their end faces, and It mainly consists of a drive mechanism 2 that rotates the hollow body 1 and a drive mechanism 3 that rotates the hollow body 1. The hollow body 1 is made of synthetic resin such as hinyl chloride, copper, aluminum, iron, or an alloy thereof, and has an inner peripheral surface 1a with an equilateral triangular cross-sectional shape, and an outer peripheral surface 1b with an appropriate shape such as triangular or circular. It is formed into a cross-sectional shape. Further, as a means for imparting a grinding function to the inner circumferential surface 1a, a sandpaper 16 is detachably attached to the inner circumferential surface. However, when using sandpaper repeatedly, the abrasive grains stuck to its surface fall off, reducing the grinding ability.
The abrasive particles that fall off will damage the plating layer on the surface of the capacitor unit, so instead of using sandpaper to prevent this, powdered abrasives such as SiC or Al 2 O 3 are applied to the hollow body using phenolic resin or other adhesive. Alternatively, powdered abrasives such as SiC may be formed into a hollow body of a predetermined shape and fired, or a phenol resin and abrasive may be mixed and hot pressed. A hollow body made directly may also be used. In these cases, the grinding time can be reduced to about 1/7 to 1/10 compared to the case where sandpaper is used, and the degree of grinding can also be improved to about 0.12 mm. Each hollow body 1 is rotatably arranged parallel to the shaft via a bearing 6 on a plurality of rotary disks 5 fixed to a drive shaft 4, and a belt 7 winding around them and a pulley attached to a motor 9. It is driven by a motor 9 via a motor 8 and rotated. The shaft 4 is rotatably disposed on a base 11 via bearings 10 at both ends thereof, and includes a pulley 12 attached to one end, a pulley 13 attached to a motor 15, and between both pulleys 12 and 13. It is driven by a motor 15 via a stretched belt 14. Therefore, when the motor 5 is operated, the shaft 4 and the rotary disk 5 rotate, and each hollow body 1 held by the rotary disk 5 rotates around the shaft 4. In other words, it rotates. Both ends of the hollow body 1 are opened and closed with rubber plugs, caps 17, etc. When carrying out the present invention using the apparatus having the above structure, first, the square ceramic capacitor units 18 are loaded into each hollow body 1 until they are full, and then both ends are sealed with rubber plugs 17, and then, Activate motors 9 and 15. When the motor 9 is operated, the hollow body rotates, and as the rotation speed increases, the square plate-shaped ceramic capacitor unit becomes self-supporting in a direction perpendicular to the central axis of the hollow body, and its end face becomes the ground surface of the hollow body 1. , for example, contacts the surface of the sandpaper 16. However, if only the hollow body 1 rotates on its own axis, its rotation and the rotation of the capacitor unit will be the same, so-called co-rotation, so end face grinding cannot be performed. Therefore, in the present invention, by rotating the hollow body 1, the condenser unit Applying force and increasing the contact pressure with the grinding surface of the hollow body 1,
Grinding is performed by frictional contact between the end face of the capacitor unit and the ground surface due to the rotation and revolution of the hollow body 1, and the plating layers on both the front and back surfaces of the capacitor unit are separated to form electrodes. Note that if the hollow body is only rotated without being rotated, the capacitor unit will simply be pressed against the grinding surface by centrifugal force, and no grinding will occur. In addition, in order to grind effectively without cracking the capacitor unit or damaging the plating layer that becomes the electrode, it is necessary to adjust the length of one side of the hollow body with an equilateral triangular cross section to the length of one side of the square plate-shaped ceramic capacitor unit. The ratio is 2.5:1 to 3.5:
The range is preferably 1. In addition, in the present invention, the inner circumferential surface of the hollow body has a triangular cross-sectional shape to increase the contact area between the end face of the square plate-shaped ceramic capacitor unit and the grinding surface, thereby increasing the grinding efficiency, and to improve the grinding efficiency of the capacitor during grinding. At the same time, this prevents cracking of the unit, and also prevents damage to the plating layer on both the front and back surfaces of the capacitor unit, which collects powder generated during grinding and fallen abrasive grains to the apex side of the inner peripheral surface of the triangular cross-section of the hollow body, which becomes the electrode. This is to prevent Examples will be described below. A hollow body with an inner peripheral surface of an equilateral triangular cross-sectional shape with a side length of 15 mm is used, and a side length of 4.8 mm and a thickness of
A 0.2 mm thin rectangular plate-shaped ceramic capacitor unit was ground using the apparatus shown in Fig. 1, and a continuity test between both surfaces was conducted on 100 ceramic capacitor units. The results are shown in the table below along with the grinding conditions.
【表】
上記表から明らかなよに、研削時のセラミツク
コンデンサユニツトの割れによる破損の発生率が
極めて低く、角板状セラミツクコンデンサユニツ
トの端面は全周面が研削されその両表面間を完全
に絶縁することができるので電極とすることがで
きる。また、本発明によれば、中空体内で回転し
ている各コンデンサユニツトの両隣りのものも同
方向に同じ回転数で回つているため、電極となる
コンデンサユニツトの両表面のメツキ層が損傷を
受けることなく、しかもバラバラの状態で中空体
内に装填するだけでよいので、加工能率を著しく
高めることもできる。[Table] As is clear from the above table, the incidence of damage due to cracking of ceramic capacitor units during grinding is extremely low, and the end face of a square plate-shaped ceramic capacitor unit is ground on its entire circumference, and the gap between the two surfaces is completely Since it can be insulated, it can be used as an electrode. Furthermore, according to the present invention, since the capacitor units on both sides of each capacitor unit rotating in the hollow body are also rotating in the same direction and at the same rotation speed, the plating layers on both surfaces of the capacitor units that serve as electrodes are not damaged. Since it is only necessary to load the pieces into the hollow body in pieces without receiving any damage, processing efficiency can be significantly increased.
第１図は本発明方法の実施に使用するセラミツ
クコンデンサユニツト端面研削装置の正面略断面
図、第２図はその略側面図、第３図は第１図の
―線における断面図である。
１……中空体、２……自転用駆動機構、３……
周転用駆動機構、４……シヤフト、５……回転デ
イスク、６，１０……軸受ベアリング、７，１４
……ベルト、８，１２，１３……プーリ、９，１
５……モータ、１８……セラミツクコンデンサユ
ニツト。
FIG. 1 is a schematic front sectional view of a ceramic capacitor unit end face grinding apparatus used in carrying out the method of the present invention, FIG. 2 is a schematic side view thereof, and FIG. 3 is a sectional view taken along the line -- in FIG. 1...Hollow body, 2...Rotation drive mechanism, 3...
Rotating drive mechanism, 4... Shaft, 5... Rotating disk, 6, 10... Bearing, 7, 14
...Belt, 8,12,13...Pulley, 9,1
5...Motor, 18...Ceramic capacitor unit.
Claims (1)
削機能を付与してなる中空体内に、全表面に化学
メツキ層を形成してなる角板状セラミツクコンデ
ンサユニツトを装填し、前記中空体を自転させる
と共に周転させて前記角板状セラツクコンデンサ
ユニツトの端面を前記中空体の内周面と摩擦接触
させることにより該角板状セラミツクコンデンサ
ユニツトの端面のメツキ層を研削してコンデンサ
ユニツトの表側と裏側の両表面上のメツキ層を分
離させることを特徴とするセラミツクコンデンサ
の製造方法。 ２ 中空体の三角形断面形状の内周面の一辺と角
板状セラミツクコンデンサユニツトの一辺の長さ
の比が2.5：１〜3.5：１である特許請求の範囲第
１項記載の製造方法。[Scope of Claims] 1. A square plate-shaped ceramic capacitor in which a chemical plating layer is formed on the entire surface of a hollow body having an inner circumferential surface with a triangular cross-section and a grinding function imparted to the inner circumferential surface. The unit is loaded, and the hollow body is rotated and rotated to bring the end face of the square plate-shaped ceramic capacitor unit into frictional contact with the inner peripheral surface of the hollow body, thereby changing the end face of the square plate-shaped ceramic capacitor unit. A method for manufacturing a ceramic capacitor, characterized by separating the plating layers on both the front and back surfaces of a capacitor unit by grinding the plating layer. 2. The manufacturing method according to claim 1, wherein the ratio of the length of one side of the inner peripheral surface of the triangular cross-sectional shape of the hollow body to the length of one side of the square plate-shaped ceramic capacitor unit is 2.5:1 to 3.5:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10474380A JPS5733954A (en) | 1980-07-29 | 1980-07-29 | Grinding method of end surface of ceramic unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10474380A JPS5733954A (en) | 1980-07-29 | 1980-07-29 | Grinding method of end surface of ceramic unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5733954A JPS5733954A (en) | 1982-02-24 |
| JPS6122450B2 true JPS6122450B2 (en) | 1986-05-31 |
Family
ID=14388969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10474380A Granted JPS5733954A (en) | 1980-07-29 | 1980-07-29 | Grinding method of end surface of ceramic unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5733954A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11320688B2 (en) | 2019-03-21 | 2022-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Information display device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112025469B (en) * | 2020-09-10 | 2022-06-10 | 西安奕斯伟材料科技有限公司 | Device, equipment and method for angle polishing of silicon wafer sample |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4923582A (en) * | 1972-06-22 | 1974-03-02 | ||
| JPS5186968A (en) * | 1975-01-29 | 1976-07-30 | Kyushu Nippon Electric | HANDOTAISOCHINOSEIZOHOHO |
-
1980
- 1980-07-29 JP JP10474380A patent/JPS5733954A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4923582A (en) * | 1972-06-22 | 1974-03-02 | ||
| JPS5186968A (en) * | 1975-01-29 | 1976-07-30 | Kyushu Nippon Electric | HANDOTAISOCHINOSEIZOHOHO |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11320688B2 (en) | 2019-03-21 | 2022-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Information display device |
| US11340488B2 (en) | 2019-03-21 | 2022-05-24 | Panasonic Intellectual Property Management Co., Ltd. | Information display device |
| US11422402B2 (en) | 2019-03-21 | 2022-08-23 | Panasonic Intellectual Property Management Co., Ltd. | Information display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5733954A (en) | 1982-02-24 |
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