JPS6122382U

JPS6122382U - Support to prevent burrs from forming due to cutting of excess lead wires

Info

Publication number: JPS6122382U
Application number: JP10644684U
Authority: JP
Inventors: 辰実津江
Original assignee: Individual
Current assignee: Individual
Priority date: 1984-07-16
Filing date: 1984-07-16
Publication date: 1986-02-08

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はプリント基板にリード線を溶着した断面図であ
る。第２図は半田とリード線を同時に切断した断面図である
。イは切断された部分である。口はカッターの進行方向である。第３図はワ７イヤブラ
シで矢印の方向に回転腰切断面を整掃する断面図で、ハ
はその進行方向である。基板は口の方向に進む。第４図はカッターの進行の反対側を半田を長くした断面
図で、第５図はＡ矢視の平面図である。第６図は、第４図の二の上面で切断した断面で第２図と
同一である。次工程は第３図と共通である。第７図は半田を斜めにしたものである。１・・・・・・電気部品、２・・・・・・絶縁基板、３
・・曲リ一ド線、４・・・・・・貫通孔、５・・・・・
・半田、６・・・・・・配線、７・・・・・・ワイヤブ
ラシ。FIG. 1 is a cross-sectional view of lead wires welded to a printed circuit board. FIG. 2 is a cross-sectional view in which the solder and lead wires are cut at the same time. A is the cut part. The mouth is the direction of travel of the cutter. FIG. 3 is a cross-sectional view of cleaning the cut surface of the rotating hip in the direction of the arrow with a wire brush, and C is the direction of movement. The substrate advances toward the mouth. FIG. 4 is a sectional view with the solder lengthened on the opposite side of the cutter's movement, and FIG. 5 is a plan view taken in the direction of arrow A. FIG. 6 is a cross section taken at the upper surface of FIG. 4, and is the same as FIG. 2. The next process is the same as in Figure 3. Figure 7 shows the solder diagonally. 1...Electrical component, 2...Insulating board, 3
...Curved lead wire, 4...Through hole, 5...
・Solder, 6... Wiring, 7... Wire brush.

Claims

[Scope of utility model registration request]

When excess lead wires from electrical components on printed circuit boards are mechanically cut, the remaining lead wires are pushed by the cutter and may become bent, the cut surface may become oval, or there may be a gap left on the opposite side of the direction in which the cutting tool advances. In order to prevent this, the part where the lead wire fills the through hole and exits from the back side is made larger in diameter than the through hole and raised higher, and the part where the lead wire is cut to the board is fixed and the lead wire is A device that simultaneously cuts solder and solder to the required length to prevent lead wire defects.