JPS61221301A - Composition for metallic green compact - Google Patents

Abstract

PURPOSE:To prepare a compsn. from which a metallic green compact is easily formed at a low temp. under a low pressure by incorporating a specific ratio of inorg. binder and bonding adjusting agent into metallic powder or a mixture composed of the metallic powder and ceramic powder. CONSTITUTION:The compsn. for metallic green compact is prepd. of 100pts.wt. 1 or >=2 kinds of the metallic powder or the mixture composed of 1 or>=2 kinds of the metallic powder and the ceramic powder, 5-25pts.wt. inorg. binder and if necessary, 0-20pts.wt. bonding adjusting agent. Al, Zn, Fe, etc. are used for the metallic powder and the grain size thereof is made <=100 mesh and >=0.05mmu. SiC and Al2O3 are used for the ceramic powder and the grain size is made about 0.5-10mmu. The mixing ratio of the metallic powder and ceramic powder is made 100:3-100:30. Silicate, amorphous silica and colloidal silica are used for the binder. Oil and polyhydric alcohol are used for the adjusting agent.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a metal compact composition containing a metal alone or a metal and ceramics.

Conventional technology Conventionally, in Western countries, quench-hardened materials have been used for molds, but in order to create durable molds that do not cause failure, it is necessary to quench-harden them after die carving or quench-harden them. It is done by mold engraving pre-finished materials.

However, with this, it takes time to carve only hard materials, and post-processing causes problems with distortion and increases in processing costs, so in Japan, nearly 90% of molds for plastics are made of materials that are not hardened. We only use hardened materials when necessary. In addition, general mold processing depends on the differences in cavities, but it takes a long time to manufacture and requires advanced technology, so it is inevitably expensive. A method to reduce processing costs and obtain molds at high speed has been developed and put into practical use. For example, cold working called cold bobbing, the show process method, electrical discharge machining, electroforming, fully automatic profile milling machines, fully automatic drilling machines, etc. that do not require human labor have been developed to improve economic efficiency.

However, changes in mold machining methods have been accompanied by changes in the mold steel materials used, with cold bobbing methods using low-carbon alloy steel, and electrical discharge machining methods using high-hardness mold steel that has been quenched and tempered. It is also possible to process cemented carbide. In addition, zinc alloy (
ZAS) or beryllium copper is used in some of the molds.

Cermet is well known as a heat-resistant composite material consisting of ceramic powder and metal powder. To obtain such a cermet, a method is generally used in which ceramic powder and metal powder are mixed, compression molded, and then sintered. The obtained cermet has properties that incorporate the hardness, corrosion resistance, and heat resistance of ceramics, and the strength of metals. If such a cermet is used in a mold, there is no need to harden the metal to increase its hardness as in the past, and mold processing is simplified.

Problems to be Solved by the Invention A problem with such cermets is that a large amount of heat and pressure is required in compression molding and sintering of the mixture of ceramic powder and metal powder. For this reason, the mold (
There is a problem in that it adversely affects the lifespan of the master piece (dies, punches) and molding master pieces.

Further, since cermet is a sintered body mixed with ceramic powder, mechanical processing such as cutting and cutting is difficult.

Means for Solving the Problems The technical means (structure of the invention) taken by the present invention to solve the above-mentioned one problem are as follows.

That is, the metal compact composition of the present invention comprises one or more metal powders or one or two metal powders.
a mixture of at least one seed and a ceramic powder; an inorganic binder;
It is characterized in that it contains a bonding regulator if necessary, and the inorganic binder consists of silicates, amorphous silica, and colloidal silica.

As described above, according to the present invention, since a specific inorganic binder is added to the metal powder or the mixture of metal powder and ceramic powder, it is possible to mold the product at relatively low temperature and low pressure without sintering. I can do it. In addition, by changing the particle size of metal powder and ceramic powder, the mixing ratio of metal powder, ceramic powder, and binder, and the composition ratio of binder, we can improve hardness 1 mechanical workability (cutting, grinding, polishing, drilling, etc.). Various green compacts with different physical properties such as thermal conductivity and electrical conductivity can be easily produced.

The green compact according to the present invention can be suitably used as a mold for molding plastics, rubber, etc. because of its ease of manufacture and various physical properties. This makes it possible to easily create molds with complex shapes. Moreover, it can be suitably used in other applications requiring heat resistance, thermal conductivity, electrical conductivity, and the like.

Examples of the metal powder include Zn and AI.

Examples include metal powders such as Fe and Ni. These metal powders may be used alone or in combination of two or more, but if necessary, they may be mixed with ceramic powder to form a composite. Ceramic powder has high hardness, corrosion resistance,
Because it has excellent heat resistance, it is used for the purpose of modifying green compacts made only of metal. Such ceramic powders include S r C, A 1203 ,
T+C.

Bed, TiO2,5i02. Examples include ZrO2. Among these, SiC has the second highest thermal conductivity and hardness after BeO, so it can be suitably used for molds and the like.

The particle size of the metal powder used has a large effect on the physical properties of the resulting green compact. That is, when the particle size of the metal powder is high, a green compact that is porous and has high adhesive strength can be obtained. On the other hand, when the particle size is small, a green compact with low adhesive strength between particles and low hardness can be obtained. Therefore, in order to obtain a green compact that is not porous and has high adhesive strength and hardness, metal powder with large particle size and metal powder with small particle size are mixed and used.

The usable particle size range of the metal powder is preferably 100 mesh (ASTM unit, the same shall apply hereinafter) or less and 0.05 mμ or more. When the particle size is smaller than this, only a green compact with poor adhesive strength can be obtained. Furthermore, it is appropriate that the ratio of metal powder with large particle size to metal powder with small particle size is about 3:1 to 1:3 by weight.

Further, one or a portion of these metal powders may be replaced with a ceramic powder, or a ceramic powder may be further added to the mixture of these metal powders.

When mixing ceramic powder with metal powder, the ceramic powder is in the form of a fine powder with a particle size of about 0.5 to 10 mμ, which gives a metallic luster color to the surface of the green compact and provides mechanical workability. It is preferable.

When the particle size of the ceramic powder is larger than 10 mμ, the hardness becomes too high and mechanical processing such as cutting becomes impossible.

In addition, the mixing ratio of metal powder:ceramic powder is preferably 100:3 to 100:30 by weight; if the ceramic powder is larger than this, the mechanical workability of the green compact becomes difficult and the conductivity increases. If it is smaller than this, the modification effect of the green compact made only of metal powder will be insufficient. When metal powder and ceramic powder are kneaded together with a binder within the above range and molded, the metal powder coats the ceramic powder, improving the properties of the ceramic powder, which is a non-conductor to heat and electricity. It becomes possible to exhibit thermal conductivity and electrical conductivity almost equivalent to metals. As the metal powder to be mixed with the ceramic powder, it is preferable to use a soft metal powder (for example, zinc powder, etc.) so that it can easily coat hard ceramics.

The binder in this invention is, for example, Japanese Patent Publication No. 55-18
The binders described in Japanese Patent Publication No. 673 and Japanese Patent Publication No. 56-51)50 can be used, and are composed of silicates such as sodium silicate and potassium silicate, amorphous silica, and colloidal silica. As the sodium silicate, for example, 3
Either one of sodium silicate No. 2 and sodium silicate No. 2 or a mixture thereof can be used. Amorphous silica is an ore powder that contains about 75 to 85% amorphous silica, which is highly active and different from ordinary silica. The trace amount of carbon is amorphous in terms of X″4iA and is so-called glue silica.

The analytical values are shown below.

Sing A7! z03 FezO3CCaOMg
O Others 82.5 2.06 4.96 23.1
2 1.88 When the amorphous silica and sodium silicate in 0.4 are mixed, 75 to 85% of amorphous soluble silicic acid and carbon, which are the components of the amorphous silica, are dissolved by the alkali of the sodium silicate, A unique sodium silicate with high heat resistance is produced. Furthermore, colloidal silica is used to increase heat resistance. The sodium silicate is added to dissolve the amorphous silica and also serve to increase adhesive strength, and its proportion in the binder is preferably 30 to 50 parts (parts by weight, hereinafter the same). Potassium silicate is added to increase the bonding strength of the binder, and is suitably added in an amount of 5 to 10 parts. Further, amorphous silica can be used in an amount of 30 to 50 parts, and colloidal silica can be used in an amount of 9 to 1) parts. Additionally, sodium silicofluoride as a hardening agent to increase the water resistance of the binder.

A small amount of one or more of potassium silicate pentachloride and aluminum phosphate may be added. Preferred blending examples of the binder are shown below.

No. 3 Sodium Silicate 120g No. 2 Sodium Silicate 50g Potassium Silicate 10g Amorphous Silica 120g Colloidal Silica 45g Other (hardening agent) approx. Log (added at time of use) (PH approx. 1)) These binder components are sufficient Stir and mix to 1 at room temperature.
Leave to stand for 2 hours to separate into an upper layer liquid and a lower layer liquid. These upper and lower layer liquids are sol.

The upper layer liquid is mainly composed of silicate and sol-like silica (including colloidal silica and amorphous silica), and is a light gray, viscous and transparent liquid. When the water is removed from this liquid, a dense, elastic film is formed. This point is completely different from ordinary sodium silicate.

The main component of the lower layer liquid is gray-black, amorphous, highly concentrated sol-like silicic acid, and like the upper layer liquid, after the water is removed from this liquid, an elastic and dense film is formed. This film is more flexible than the upper layer liquid and has a stronger effect of mitigating impact, but its adhesive strength is inferior to that of the upper layer liquid. Also, due to the action of the curing agent, the upper layer liquid gradually increases in viscosity and becomes a sticky liquid like starch syrup, but it is difficult to change the sol from a gel by using the curing agent alone.

However, when the lower layer liquid is added to the upper layer liquid to create a mixed liquid, the viscosity increases and goes beyond the starch syrup-like state to a gel state immediately. The blending ratio of the upper layer liquid and the lower layer liquid affects the adhesive strength, hardness, brittleness, etc. between particles between the required powder compacts, so the blending ratio is determined as appropriate according to these properties. Usually, it is preferable to mix the upper layer liquid and the lower layer liquid within the range of 5:1 to 1:5 (weight ratio).The upper layer liquid and the lower layer liquid are mixed, and metal powder or metal powder and ceramic powder When these are added, sufficiently kneaded, and left at room temperature, gelation progresses in about 30 to 60 minutes, making hot-press molding possible.

It is preferable to mix the binder in a ratio of 5 to 25 parts per 100 parts of the metal powder alone or a mixture of metal powder and ceramic powder. If the amount of the binder is larger than that, the adhesion strength will decrease. If the particles are smaller, the properties of the metal or ceramic will be lost, and if the particles are smaller, the bonds between the particles will be weak and the compact will become fragile.

The bonding regulator is used to make it easier for particles such as metal powder to be wetted with a binder, and to prevent particles from coagulating into hard lumps. Metal powders and ceramic powders, especially finely powdered ceramic powders, are difficult to wet with water and other liquids, and the finer the particles, the more likely they are to agglomerate like American flour. When this is put into a molding container and heated and pressurized to create a green compact, the binder does not penetrate into the green compact and the particles coagulate together, causing rough, hard lumps to be scattered on the surface and inside of the green compact. 0 If the grains are removed from the surface, the surface will have a metallic luster, but a concave portion will remain where the grains were removed, impairing the smoothness of the surface. Therefore, in order to improve the wettability of the metal powder and ceramic powder with the binder and to prevent the reaction with the metal, oil (mineral oil, etc.) or polyhydric alcohol such as ethylene glycol or glycerin is used as a bond modifier. . These bond modifiers do not necessarily have to be used, and do not need to be used if wetting of particles and binder or coagulation between particles is not a problem. In addition, along with these binding regulators,
A small amount of surfactant may be used. This surfactant is also used to improve the wetting of the particles with the binder, and is generally an ether-type surfactant that does not react with the binder and is easily decomposed by heat. For example, polyethylene lauryl ether or the like can be used. It is preferable to use the bonding regulator in a ratio of 0 to 20 parts per 100 parts of the metal powder or the mixture of metal powder and ceramic powder, and if the amount of the bonding regulator is larger than that, the adhesion between particles The strength will be reduced.

A method for producing a green compact using each of these components will be explained based on FIG. 1. FIG. 1 is a process diagram for producing a green compact by mixing metal powder and ceramic powder. First, metal powder and ceramic powder are thoroughly mixed in predetermined amounts. To this, predetermined amounts of the binder and bond modifier prepared as described above are added and kneaded to form a slurry. When this slurry is left at room temperature, gelation progresses in about 30 to 60 minutes. At that time, remove the liquid that seeps from the surface by absorbing it with filter paper or the like. In this state, the slurry is filled into a molding container and heated and pressed to obtain a green compact.

Heating may be done at a temperature above room temperature, and there are no particular restrictions on the heating temperature, but in order to reduce damage to the dies, punches, and molding masters used for molding, it is important that the temperature does not reach the normal sintering temperature. Preferably, the temperature is generally below about 400-450°C. Further, for the same reason, it is preferable that the pressure is as low as possible, and generally about 1 ton/- is appropriate. The above manufacturing procedure and conditions are the same even when metal powder is used alone.

Although the powder compact produced in this way contains ceramic powder, it has a metallic luster color, thermal conductivity,
In addition to having excellent electrical conductivity, the ceramic powder significantly improves hardness, wear resistance, corrosion resistance, etc. In addition, by appropriately determining the particle size and blending amount of metal powder and ceramic powder, we can achieve high adhesive strength between particles and
Polishing.

Processing such as perforation becomes possible, and the green compact can be processed into any shape.

Examples Example 1 (Composite green compact of metal powder and ceramic powder): Hard SiC powder in the form of ultrafine powder (average particle size 0.7
mμ, A-2 type manufactured by Showa Denko Corporation) and 20 g of Zn powder (350 meso s ASTM) were mechanically mixed in an automatic mortar for about 5 days. moreover,
15.5 g of this mixed powder was taken and mixed with 300 mesoyu of Zn powder to make 60 g, and mixed again in an automatic mortar for 2 hours to obtain a mixed powder (the SiC powder content in the mixed powder was approximately 13%). Become).

On the other hand, 120 g of No. 3 sodium silicate, 5 g of No. 2 sodium silicate
0g, potassium silicate 10g, amorphous silica 12
A mixed solution was prepared by mixing 0g of colloidal silica and 35g of colloidal silica. This mixed solution was left at room temperature for about 12 hours to separate into an upper layer liquid and a lower layer liquid. Next, the upper layer liquid and the lower layer liquid were
:1 to obtain a binder. This binder liquid 2
Add hardening agent (sodium silica >0.5g to 0g,
After kneading well in a mortar, take 8 g of this kneaded liquid and add 20 g of ethylene glycol, which is a binding adjustment liquid.
% aqueous solution and 2 g of oil with a boiling point of about 150-200℃
was added and stirred to thoroughly disperse the oil. 50 g of the above-mentioned mixed powder was gradually added to this while stirring to obtain a mushy mud-like mixture. This slurry was thoroughly kneaded with a spatula and then left to stand for about 2 hours.

During this time, excess liquid oozed out on the surface of the muddy material, so
This was absorbed with filter paper. Eventually, it becomes a clay state containing a binder liquid inside. The material of the molded container for filling is S.
Made of K3 steel, length 50i.

A hollow cylinder with a diameter of 30+n and a wall thickness of 5 dragons and a thickness of about 2 dragons in diameter.
The container consisted of an upper and lower disk-shaped ram, and the above-mentioned clay mixture was pounded and filled into this container. This filled container was attached to a small hydraulic machine for 5 tons in a small electric furnace. Then, the powder was gradually heated and pressed at a heating rate of 0.8° C./min to a temperature of about 400° C. to produce a green compact. When this powder compact was cut with an automatic saw and then cut with a lathe, the surface became a smooth cut surface with a silvery white metallic luster and no irregularities. In order to check the adhesion strength of this surface, the material is SK3 steel and the diameter is 2.
01. Using the surface of a cylinder with a height of 25 ss as a reference, the surface was repeatedly cut using a grinder (Kanto Kiki type mini hand grinder) under the same conditions.

As a result, the green compact with a silvery-white and glossy surface contained only a small amount of cutting waste powder. On the other hand, when the surface of a cylinder made of SK3 steel was cut using the same grinder, almost no cutting powder was produced. In addition, the hardness of the surface of the compact by the Shore hardness tester is 35 to 4o, and the hardness of the cylinder made of SK3 steel is 30o.
~35, which was almost unchanged. Furthermore, the electrical resistance measured by a tester was almost the same as that of SK3 steel. Also, various machining processes were possible.

Example 2: SiC powder (average particle size 6 mμ, Showa Denko ■
30g of Zn powder (35゜Mesoche A)
60 g of STM) were mechanically mixed in an automatic mortar for about 2 days. Furthermore, take 12g of this mixed powder and
The mixture was mixed with Zn powder of 0.00 mesh to give a total weight of 60 g, and mixed again in an automatic mortar for 2 hours to obtain a mixed powder (the SiC powder content in the mixed powder was about 6.7%). This mixed powder 6
When 0 g was gradually added to a solution containing 8 g of the same binder as in Example 1, 4 cc of a 20% aqueous solution of ethylene glycol, and 2 g of oil, a thick slurry formed. This slurry was thoroughly kneaded with a spatula, and then heated and pressed in the same manner as in Example 1 to obtain a green compact.

Although this powder compact has a SiC powder content of about 6.7%, which is about half of that in Example 1, its hardness is 30 to 35 on the Shore hardness tester, which is comparable to that of a cylinder made of SK3 steel. The hardness was close to 35. Furthermore, machinability was easier than in Example 1.

Example 3: SiC powder with coarse particle size (GC#220 manufactured by Showa Denko ■, particle size 100 m, c+.

JIS R6001), 20g of this SiC powder
and 7 g of 350 mesh Zn powder were mechanically mixed in an automatic mortar for about 3 days, and then 4 g of this was taken and 300 mesh
It was mixed with 56 g of mesh Zn powder in an automatic mortar for 2 hours. This mixed powder was mixed with 8 g of the same binder as in Example 1 and 6 cc of water.
and ethylene glycol Ig were gradually added to the mixed solution and stirred, resulting in a thick slurry. This slurry was sufficiently kneaded with a spatula, and heated and pressed in the same manner as in Example 1 to obtain a green compact.

Although this green compact had a SiC powder content of about 5%, which was about 7% lower than that of Example 1, it could not be cut or cut with an automatic saw or lathe. Therefore, the container was cut and the green compact was smashed with a copper hammer. The cracks had an uneven shape, and when cut with the same grinder as in Example 1, almost no cutting powder was generated, and it was confirmed that the adhesive strength between the particles was high. In addition, the scratch resistance was stronger than in Example 1, and the thermal and electrical conductivity were the same as in Example 1, but machining was impossible with a blade of conventional hardness.

Example 4: A green compact was obtained in the same manner as in Example 1, except that alumina powder (average particle size: 0.7 mμ) was used as the ceramic powder instead of SiC powder.

When this compact was cut with an automatic saw or a lathe, the cut surface had a silvery white metallic luster.

Furthermore, the surface adhesion strength, thermal and electrical conductivity, and hardness were almost the same as in Example 1.

Example 5 (Powder compact of metal powder): 80 g of Zn powder (350 mesh) was added to a liquid containing 15 g of the same binder as in Example 1, and thoroughly kneaded by hand. Mix 2% of sodium fluorosilicide as a hardening agent in advance, and then add 2 cc of water and 1 g of oil.
was added. The kneaded material became a mushy liquid material, and after being thoroughly kneaded with a spatula and left for about 2 hours, it became a clay state with less elasticity than in Example 1. Thereafter, a green compact was obtained in the same manner as in Example 1.

When this green compact was cut with an automatic saw and then cut with a lathe, the cut surface had a silvery white metallic luster. The adhesion strength, thermal and electrical conductivity, etc. were the same as in Example 1, but the Shore hardness was close to 30, which is the hardness of a cylinder made of copper material with a Shore hardness of 25 to 30.55C.

This is because SiO□, which is the main component of the binder, improves the hardness of Zn, and in addition to its adhesive effect, this binder also serves to improve the hardness, similar to SiC.

Example 6: Ni instead of soft Zn powder in Example 1
Using the powder, 74 g of this Ni powder (35o mesh) and 1) g of SiC powder (A-2 type, described above) were mixed in an automatic mortar for about one week. When this mixed powder was mixed with the same binder as in Example 1, the particles agglomerated to form a hard lump.

Therefore, in the same manner as in Example 1, 0.5 g of sodium fluorosilicide was added to 20 g of the binder, and after kneading, 1 g of ethylene glycol and 2 cc of water as a bond regulator were added to the 8 g, and 2 g of oil was further added. After the addition, the mixture was sufficiently stirred and 85 g of the mixed powder was gradually added thereto while stirring, resulting in a thick slurry. Thereafter, a green compact was obtained in the same manner as in Example 1.

When this powder compact was cut with an automatic saw and then cut with a lathe, the cut surface had a metallic luster with a color close to brass. Other physical properties were the same as in Example 1. However, the scratch resistance was stronger when using Ni powder than when using Zn powder. Shore hardness remained constant between 35 and 40.

Example 7 (Metal powder compact): Coarse Fe powder (20
0 mesoyu) and fine powder (AFP5H manufactured by Showa Denko ■,
(particle size: 5μ) at a mixing ratio of 3:1 in an automatic mortar for about 2 hours. 80 g of this Fe powder mixture was immersed in a solution containing 12 g of the same binder as in Example 1, and thoroughly kneaded. however,
The binder was mixed with 2% sodium silicofluoride as a hardening agent in advance, and 5 cc of water and 1 g of oil were added. The kneaded material becomes a mushy slurry, and after kneading it well with a spatula,
It was left for about 2 hours. As a result, gelation progressed, resulting in a clay state containing a binder. Thereafter, a green compact was obtained in the same manner as in Example 1.

When this green compact was cut with an automatic saw and lathe, the cut surface had a smooth silvery white metallic luster.

The density 1 strength, thermal and electrical conductivity, etc. were the same as in Example 1, but the Shore hardness exceeded 30, which was almost the same as the hardness of 30 of the cylinder made of 55G steel.

Example 8 (Metal powder green compact): Ni powder (325 mesh) was mixed in an automatic mortar for about 75 hours and then finely divided. This N
80 g of i powder was added to a solution containing 20 g of the same binder as in Example 1, and thoroughly kneaded. However, as a hardening agent, sodium silicofluoride and magnesium silicate were mixed in advance in a ratio of 1:1, and 2 cc of water and 2 g of oil were added to the binder. The kneaded material turned into a muddy slurry, which was well kneaded with a spatula and left for about 2 hours, resulting in Example 1.
It became a clay state with less elasticity compared to. Thereafter, a green compact was obtained in the same manner as in Example 1.

When this green compact was cut with an automatic saw and lathe, the cut surface had a metallic luster with a color close to brass. Adhesion strength, thermal conductivity, electrical conductivity, etc. are the same as in Example 1, but
Shore hardness was 40-45, higher than SK3 steel. Further, machining was possible, and the scratch resistance was stronger than that of a powder compact using metallic Zn.

Example 9 (Porous green compact of metal powder): N with coarse particle size
I powder (200, "Shush") and Fe powder (200 Mefusier) were mixed in a ratio of 1:1. On the other hand, Example 1
20g of the same binder and 0.0g of hardening agent (sodium fluorosilicide).
After adding 5 g and thoroughly kneading, 2 cc of water was added and stirred, 70 g of the mixed powder was gradually added and kneaded. Thereafter, a green compact was obtained in the same manner as in Example 1. However, when applying pressure, care must be taken not to compress it more than necessary, as excessive compression will cause the binder to be discharged and shrink.

When this green compact is cut with an automatic saw and lathe, the surface becomes a cut surface with a silvery white metallic luster with countless small dots scattered, and the adhesion strength and electrical and thermal conductivity are also the same as in Example 1. It looks just like the original, but when you look at it with a magnifying glass, you can see that the small sunspots on the surface become pores, and when you drop a drop of water on the surface, it immediately absorbs it. From this, it can be seen that the green compact is a water-absorbing porous body.

Effects of the Invention According to the present invention, a metal compact can be easily manufactured at a relatively low temperature and low pressure that does not reach sintering, and furthermore, mechanical processing is possible.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process diagram showing the manufacturing process of mixing metal powder and ceramic powder to produce a green compact according to the present invention.

Claims (5)

[Claims] (1) Contains one or more metal powders or a mixture of one or more metal powders and ceramic powder, an inorganic binder, and, if necessary, a bond modifier, wherein the inorganic binder is A metal compact composition comprising silicates, amorphous silica, and colloidal silica. (2) 5 to 2 parts of the inorganic binder is added to 100 parts by weight of the metal powder or the mixture of metal powder and ceramic powder.
5 parts by weight of the metal compact composition according to claim 1, wherein the bonding regulator is blended in an amount of 0 to 20 parts by weight. (3) The weight ratio of the metal powder and ceramic powder is 10
The metal compact composition according to claim (1), which is used in a ratio of 0:3 to 100:30. (4) The ceramic powder has a particle size of 10 mμ or less,
The metal green compact composition according to claim 1, wherein the ceramic powder is mixed with a metal powder having a large particle size and a metal powder having a small particle size. (5) The metal compact composition according to claim (1), wherein the bonding regulator is oil or polyhydric alcohol.