JPS61221222A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPS61221222A
JPS61221222A JP6094885A JP6094885A JPS61221222A JP S61221222 A JPS61221222 A JP S61221222A JP 6094885 A JP6094885 A JP 6094885A JP 6094885 A JP6094885 A JP 6094885A JP S61221222 A JPS61221222 A JP S61221222A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
composition
silica powder
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6094885A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564166B2 (enExample
Inventor
Takeshi Uchida
健 内田
Akira Yoshizumi
善積　章
Kazutaka Matsumoto
松本　一高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP6094885A priority Critical patent/JPS61221222A/ja
Publication of JPS61221222A publication Critical patent/JPS61221222A/ja
Publication of JPH0564166B2 publication Critical patent/JPH0564166B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP6094885A 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物 Granted JPS61221222A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6094885A JPS61221222A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6094885A JPS61221222A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61221222A true JPS61221222A (ja) 1986-10-01
JPH0564166B2 JPH0564166B2 (enExample) 1993-09-14

Family

ID=13157121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6094885A Granted JPS61221222A (ja) 1985-03-27 1985-03-27 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61221222A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01206656A (ja) * 1988-02-15 1989-08-18 Nitto Denko Corp 半導体装置
JPH0259416A (ja) * 1988-08-25 1990-02-28 Nippon Chem Ind Co Ltd 微細溶融球状シリカおよびその製造法
JPH04325543A (ja) * 1991-04-24 1992-11-13 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2009215329A (ja) * 2008-03-06 2009-09-24 Denki Kagaku Kogyo Kk エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
JP2017195319A (ja) * 2016-04-22 2017-10-26 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置
EP3124437A4 (en) * 2014-03-27 2017-12-13 Mitsubishi Materials Electronic Chemicals Co., Ltd. Black titanium oxynitride pigment, method for producing same, and semiconductor-sealing resin compound using black titanium oxynitride pigment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01206656A (ja) * 1988-02-15 1989-08-18 Nitto Denko Corp 半導体装置
JPH0259416A (ja) * 1988-08-25 1990-02-28 Nippon Chem Ind Co Ltd 微細溶融球状シリカおよびその製造法
JPH04325543A (ja) * 1991-04-24 1992-11-13 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2009215329A (ja) * 2008-03-06 2009-09-24 Denki Kagaku Kogyo Kk エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
EP3124437A4 (en) * 2014-03-27 2017-12-13 Mitsubishi Materials Electronic Chemicals Co., Ltd. Black titanium oxynitride pigment, method for producing same, and semiconductor-sealing resin compound using black titanium oxynitride pigment
JP2017195319A (ja) * 2016-04-22 2017-10-26 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置

Also Published As

Publication number Publication date
JPH0564166B2 (enExample) 1993-09-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term