JPS61210693A - Thick film hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a thick film hybrid integrated circuit board in which a metallized layer on a substrate and a component holding member are soldered together.

[Conventional technology]

Thick-film hybrid integrated circuit boards are made by creating a circuit with a layer of metal such as Ag-Pd baked onto a ceramic insulating substrate, and then soldering that layer to metal legs that hold circuit components. and then attach the parts to the circuit board.

' Conventionally, in order to mount circuit components in accurate positions on this type of thick film hybrid integrated circuit board, there has been a method of drilling holes in the board, fitting and inserting the legs of the components into the holes, and then soldering them. This method has disadvantages in that the accuracy of the hole diameter must be matched to the accuracy of the same diameter of the component, and that it takes time and effort for insertion. Another method is to use a jig to position the circuit components while soldering. This method has the inconvenience of requiring a jig with high precision and a complicated shape.

Another simple method is a self-alignment method. FIG. 2 shows an enlarged sectional view of the main parts of a thick film hybrid integrated circuit board manufactured by this method. In the figure, legs 3 of circuit components (not shown) are attached with solder 4 to a metallized layer 2 on a substrate 1. In this method, when the solder 4 is melted, the legs 3 of the component are attracted by the adhesion force due to the wetting phenomenon between the solid (metallized layer 2 and legs 3) and the liquid (molten solder), and the component is attached to the substrate l. It is installed in a predetermined position. However, with this self-alignment method, if the printing accuracy when printing the solder cream is poor, the parts may not be installed in the correct position. In particular, if the printing thickness of the solder cream becomes uneven, the legs 3 will be fixed at an angle as shown in FIG. 2, and the circuit components will also be at an angle. Further, there is a drawback that the metallized layer 2 is fixed at a position off the center thereof.

[Problem that the invention seeks to solve]

The present invention solves the above-mentioned drawbacks of conventional thick-film hybrid integrated circuit boards, and allows parts to be fixed with high precision through a simple manufacturing process without using jigs with high precision and complex shapes. It is an object of the present invention to provide a thick film hybrid integrated circuit board.

[Means for solving problems]

The structure of a thick film hybrid integrated circuit board to which the present invention is applied will be explained with reference to FIG. 1, which corresponds to an embodiment.

In the thick film hybrid integrated circuit board of the present invention, a pore 5 is formed in the substrate 1 at a position where a member 3 for holding a component is fixed. At least a portion of the entire inner periphery of the pore 5 in the thickness direction of the substrate and the periphery of the pore 5 is a metallized layer 7 . A metal component holding member 3 located at a position corresponding to the pore 5 and a metallized layer 7 are bonded and fixed by solder 3.

[Effect]

As described above, the thick film hybrid integrated circuit board of the present invention has the metallized layer 7 around the pore 5 of the substrate 1 and over the entire inner periphery of the pore 5, so that components are held in the metallized layer M7. Part 3
When soldering, the molten solder penetrates into the metallized layer 7 on the inner periphery of the pore 5 by capillary action (wetting phenomenon of solid and liquid). At this time, the bottom side of the holding member 3 is uniformly attracted by the penetrating force of the molten solder. Therefore, as shown in FIG. 1, the holding member 3 is positioned so as to close the pore 5 and is attached perpendicularly to the surface of the substrate l.

〔Example〕

Examples of the present invention will be described in detail below.

FIG. 1 is an enlarged sectional view of essential parts of an embodiment of a thick film hybrid integrated circuit board to which the present invention is applied.

For example, a ceramic insulator is used as the substrate 1, and pores 5 are formed at positions where circuit components (not shown) are to be attached. A suspension of a metal such as Ag--Pd and glass frit mixed with a binder is printed and coated on the substrate 1 according to the circuit to be formed, and then baked.

Then, a circuit is created using the metallized layer 7, and
The metallized layer 7 also extends around the inner periphery of the pore 5 . Solder cream is applied by printing onto the circuit board 1. Then, the metal legs 3, which are members for holding the circuit components, are placed in respective predetermined positions of the pores 5, and then the temperature is raised. Then, the solder melts and permeates along the metallized layer 7 on the inner periphery of the pore 5 by capillary action, and the bottom of the leg 3 is uniformly attracted.

The base of the leg 3 is above the pore 5 and parallel to the top surface of the metallized layer 7. The legs 3 stand upright at a predetermined position (the position of the pore 5). When it is then cooled, the solder 8 solidifies in this state. In other words, a thick film hybrid integrated circuit board as shown in FIG. 1 is produced.

In the above embodiment, the depth d of the metallized layer 7 on the inner periphery of the pore 5 is most preferably approximately the same as the radius of the pore 5. If it is significantly smaller than this (approximately % of the radius), the amount of suction of molten solder due to capillary action will be small, making it impossible to correct the original inclination of the legs 3. Further, the depth dimension d is the same as the thickness dimension of the substrate 1, and the metallized layer 7
is provided over the entire inner circumference of the pore 5 to the back surface,
It is easy to create closed voids in the molten solder. As a result, the amount of suction decreases, and the inclination of the legs 3 cannot be corrected.

[Effects of the Invention] As explained above, the thick film hybrid integrated circuit board to which the present invention is applied can place components in predetermined positions (positions that close the pores) by suction due to the capillary action of the pores, and also It is installed perpendicular to the surface. Therefore, it is possible to provide a thick film hybrid integrated circuit board in which circuit components are fixed to the substrate with high precision, without using jigs that have complicated shapes and require precision, and through a simple manufacturing process.

[Brief explanation of drawings]

FIG. 1 is an enlarged cross-sectional view of a main part of a thick film hybrid integrated circuit board to which the present invention is applied, and FIG. 2 is a sectional view of a conventional thick film hybrid integrated circuit board. 1. Substrate, 2.7. Metallized layer, 3
04 Parts holding member, 4・81. Solder, 5. Pore, No. 2, Figure 2

Claims (1)

[Scope of Claims] A metallized layer is provided around a pore provided in a substrate and at least a part of the thickness direction of the substrate over the entire inner periphery of the pore, 1. A thick film hybrid integrated circuit board, characterized in that a metal component holding member located at a position corresponding to the hole and the metallized layer are soldered together.