JPS6120734Y2 - - Google Patents

Info

Publication number

JPS6120734Y2

JPS6120734Y2 JP10984676U JP10984676U JPS6120734Y2 JP S6120734 Y2 JPS6120734 Y2 JP S6120734Y2 JP 10984676 U JP10984676 U JP 10984676U JP 10984676 U JP10984676 U JP 10984676U JP S6120734 Y2 JPS6120734 Y2 JP S6120734Y2

Authority

JP

Japan

Prior art keywords

lead

lead wires

electrodes

solder

recesses

Prior art date

1976-08-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000003990 capacitor Substances 0.000 claims description 19
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
• 229910000679 solder Inorganic materials 0.000 claims description 14
• 239000000853 adhesive Substances 0.000 claims description 6
• 230000001070 adhesive effect Effects 0.000 claims description 6
• 239000003989 dielectric material Substances 0.000 claims description 6
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 239000012528 membrane Substances 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000007772 electroless plating Methods 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• 230000010354 integration Effects 0.000 description 1
• 238000005259 measurement Methods 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 239000003973 paint Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 230000001105 regulatory effect Effects 0.000 description 1