JPS61207039A - Power semiconductor cooling device and manufacture thereof - Google Patents

Abstract

PURPOSE:To diminish the contact resistance heat by a method wherein a heat pipe to be pressure-fixed in a through hole of block is pressure-welded into the through hole by expanding the pipe to form it into one body with the block. CONSTITUTION:A heat pipe 3 is inserted into a through hole 2 of a metallic block 2 before the pipe 3 is completed i.e. the material pipe of container is inserted into the specified position in the state of straight pipe to be expanded for pressure-fixing into one body with the block 2. In order to completely exhaust air from fine flaws or dents inside the through hole 2 and the periphery of material pipe, both wall of material pipe are coated with grease or bonding agent with excellent heat conductivity to be expanded by means of force-fitting steel ball and pulling out plug and then any excessive coating material may be exhausted filling any recessions with the coating material for almost complete pressure-fixing to diminish the contact resistance heat almost into zero. Through these procedures, after finishing the insertion of material pipe into the insertion through hole 2, the material pipe may be bent at specified position to complete the heat pipe 3 through specific processes.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Field of Application The present invention relates to the structure and structure of a cooling device that utilizes heat pipes 1e/Ff to cool electric power semicircular elements such as thyristors, diodes, and transistors. Concerning improvements in manufacturing methods.

(1) It has been more than 10 years since the structure used in heat pipe containers for cooling power semiconductors was put into practical use.The heat transfer characteristics of heat pipes depend on the power loss of the semiconductor. It is extremely effective for cooling heat generated. However, the basic structure of cooling devices using heat pipes has not changed much during this time. Namely, a metal block that comes into contact with a semiconductor and draws out its heat. A heat pipe that is inserted into a metal block and pumps out the heat from the metal block and transfers it to the heat dissipation section, and is installed in the heat pipe and radiates heat into the air through forced convection. It is customary to be formed from three components: a group of fins. What is often used in this cooling device is a flat thyristor. Multi-add product of metal blocks and flat thyristor elements alternately! - to be used. io with this kind of structure,
To ensure good conduction, the metal block is generally a pure copper block, and the A,6,1 copper block and heat pipes efficiently transfer thermal energy and transfer heat to the fins. However, the available space for the fin group attached to the *T and I15 heat pipes, in which a large number of thyristors are laminated with metal blocks, is extremely limited to 3 tons. Siemens (West Germany) is proposing a structure that increases the fin area between thyristor cooling devices.

FIG. 6 shows the structure of the basic unit, in which a heat absorbing portion of a heat pipe 3 bent into a metal block IKμL shape is inserted. A fin group 5 is attached to the heat radiation part of the heat pipe. 14-a, 4-bα fins are protected. In the figure, a heat pipe 3 is connected to block l (/J
Although it is inserted in the right side, it is possible to sufficiently expand the fin area of the fin NU by stacking it alternately with the unit installed on the left side. be. i.e. the center of the metal block @x-x'
By increasing the distance between the center of the neat pipe and the center of the neat pipe, a sufficient depth t can be given to the air flow n/. Also, although not shown, it is possible to make the fin width equal to the thyristor spacing. Siemens' [a-J! was made in 1975. Maximum allowable voltage and voltage ftuL of thyristors at that time was 5KV
, 40 nA [degrees], and in the thyristor coolers of the time, they were small in a metal block and inserted into a coil.
There was only one heat pipe, and the problem at the time was how to expand the fin area.

In recent years, for example, thyristors with a capacity of 4KV and 1500A have been put into practical use, and thyristors with a capacity of 4KV and 2500A are also being prototyped, and there is a trend towards larger capacities. Due to this, it becomes impossible to deal with the problem with a single heat pipe, and several heat pipes are inserted into the same metal block.
The L metal block has also become larger than the VC. As a result of this, a new problem arises: the weight of the metal block becomes too much for handling.

Quantification has become a blind spot issue. At the same time, the number of fins is increasing, the area of each fin is increasing, and the weight of the fins is also increasing, and the problem of making the fins smaller is becoming a problem for IL. especially.

Another reason for the weight increase is that the metal blocks, heat pipes, and fins are mostly made of pure copper. In consideration of the cooling length of the heat pipe type thyristor used for the required purpose, 1 unit is 13kl/lj! The current situation is that there are some that do. The reason why copper is used as a material is that in order to exhibit the highest performance as a heat pipe, it is necessary to obtain the necessary cooling performance other than using pure water working fluid (maximum heat transfer). Therefore, copper containers and W4 wicks are the most suitable containers that are highly compatible with H9 pure water hydraulic fluid. In contrast to copper heat pipes, pure copper is the most suitable fin material and block material because it has fewer electrical hazards than copper heat pipes and has the lowest thermal resistance. It is something that The structure of a current heat pipe type power semiconductor cooling device in which blocks and fins are enlarged in the prior art is shown in a TGS diagram. The insertion holes 2-a and 2 for heat pipe insertion are given a distance equal to the block 1rC light.
-bs2-c.

is set n. For this reason, the blocks are becoming larger. The reason why the large spacing is given is to improve the fin efficiency of the fin f#5, which is long layered on the heat dissipation part of the inserted linear heat pipes 3-a, 3-b*3-c. This depends on the fact that sufficient spacing is required to close the gap. Therefore, in order to increase the heat dissipation capacity, the heat pipe spacing is increased by increasing the length of the fins in the direction of air convection.
, 1ctl', the block becomes larger n.

Increasing the size of the block tl17J In order to increase the fin area, a heat pipe with a good shape in which the heat pipe meandered at a steep angle was also proposed. However, the working principle of a heat pipe is to utilize a high-velocity flow of a working liquid vapor in a container, and therefore, when the pipe is repeatedly bent in opposite directions within a narrow range, there is a large pressure loss in the vapor flow. There is no excuse for this to occur. This greatly reduces the performance of the heat pipe. Moreover, the rough bending process in a narrow range may increase the process vItt-.

In the conventional AA large capacity semiconductor cooling system as described above, a large gap remains in the area. Another factor is the spacing between the heat pipe and the metal block. The heat pipe is simply press-fitted into the insertion hole, and when the heat pipe is inserted into the insertion hole, there is no contact due to the slight unevenness on both surfaces. iI heat resistance occurs and it cannot be used at all. To prevent this, we recommend applying thermally conductive grease and thermally conductive bonding material and press-fitting it. However, even if it is called thermal conductivity, the thermal conductivity (1o, 5 to 0.7 KC
a// m-h-℃, pure copper heat transfer 4 army 33 Q
l/660~'/4' compared to KCa//m・h・℃
It's just an IO. For this reason, the cooling performance is greatly reduced due to the cracks that occur between the inner wall of the insertion hole and the surface of the heat pipe, and the rumored low thermal resistance of the FFL material. Heat pipe diameter J54m,
The thermal resistance of the thin paint film in the case of the heating element 4 rate α7xcaJ/In-h-'C, thin sliding door thickness O, l m, Director General of the Insertion Department 20011Ik is 0.0077°C, as V general thermal resistance. In cooling equipment for large-capacity semiconductor devices where 0.01°C/W is required, the slave layer alone has a thermal resistance of 77% Jvj7
JIll is completely unacceptable. Therefore, it is customary to apply this connection method only to Hitomi Kotani's semiconductor devices. Therefore, the large-capacity power semiconductor device cooling tj [! In t, a contact layer using VC tin-lead solder is used to connect the heat pipe and the metal block.

Heat pipe diameter: 25.4, device solder layer thickness: 0.15 mm, solder thermal conductivity: 3 nKcal/rn-h・'C,
No, thermal resistance of soldering as 200m (!
-Calculated as O,OO027°C/W. This level of thermal resistance increase of 0 is 0.01℃/W (there is no need to worry about it at all even in cooling equipment that requires a D general thermal resistance @
However, soldering heat pipes is an extremely difficult task. In the case of pure water working fluid, heating the heat pipe to over 200'C due to the saturated steam pressure intensifier port may cause damage and deformation of the container, which is dangerous.
Depending on the transmission characteristics, the entire heat pipe has a uniform temperature,
The soldering temperature of 180° C. for all parts other than the bonded portion of the 4 joints becomes 180° C., making handling difficult. Oil again! Rt-
Then, the heat dissipates and solidifies, making it impossible to insert. In addition, the metal block 1j with a large heat capacity (solder 1! must be maintained at the melting temperature without exceeding 200°C, and the solder bonding process is performed while maintaining this state and preventing air from entering the expansion hole. There is a view to implement this.The difficulty of this 71-hour process increases the cost of the equipment, and 9 countermeasures are required.Relatively small capacity heat pipe type semiconductor cooling technology
11. A Freon 114' first cycle may be used. Copper or aluminum can be used as the four-way metal, and aluminum is generally used. Freon hydraulic fluid reaches a saturated vapor pressure of several 10 atm or more at 20 G'C, which is dangerous, so do not solder it.
It is not possible to adopt the law. Also, Freon has extremely low latent heat compared to pure water, so a normal heat pipe cannot provide good thermal resistance. For this reason, we used Freon hydraulic fluid and integrated the fin mounting part and block part with a large capacity semiconductor cooling device.

There are examples where both are formed as hollow containers. In this case as well, in order to greatly increase the inner *IiY product in order to compensate for the small point of heat exchange, the inner wall surface was made into a comb shape and countless fins of 7 tons were installed on the inner wall. Like this? It is extremely difficult to form a Jfi structure with pure copper, so it is generally made of aluminum. However, it has not been widely used in practice due to the high tooth profile due to the complexity of the structure and the fact that the high quality steel is difficult to obtain.

(c) Problems to be Solved by the Invention The present invention attempts to improve and solve the nine problems that remain in the prior art as described above.

a. Weight of heat receiving metal block tJt! ! J Large points and points that are too large.

b. The heat dissipation area per heat pipe is too small.

Difficult to insert C3 metal block and heat pipe.

d. The thermal resistance shown above increases significantly in the case of failure of solder bonding.

e. The selection range of constituent materials for the cooling device is narrow compared to pure water working fluid.

f. Another problem is that the fin material is mainly pure copper, so it is heavy.

g. Machinery for metal blocks■ Labor costs are expensive. Another problem is that copper fins are prone to corrosion.

B) Means and actions for solving the problems The solution means and actions corresponding to each of the above points are as follows.

a. The block is made smaller by reducing the interval between successive layers of heat pipes in the block. Historically, as a middle step to reduce the insertion interval, the heat pipes are placed horizontally and the heat pipes are bent uniformly to the necessary heat pipe spacing at the extension fin insertion part to form a heat dissipation part. The FA section will depend on the setting of the bending position.

Also, in order to increase the contact area between the heat pipe and the block in a small block, the heat receiving part should not be installed inside the T block as in the past, but should be passed through it, and the ineffective part of the heat vibe terminal should be made to extend outside the block.

By bending both ends of a nine-penetration heat pipe at right angles to form a σ-shaped heat pipe, the ineffective area of the heat receiving part is eliminated.

b. Fin m, T
Expand lta'. , in the case of a larger capacity, it depends on the use of a U-shaped heat pipe.
It would be possible to double the amount of heat pipe c, 4 [We do not apply solder bonding or bonding material therapy to the insertion of the block and heat pipe. In addition, the installation of completed heat pipes will also be canceled. The connection hole xl1 provided in the block is used as a through hole, and the base tube for the bottom shape of the heat pipe is inserted and the tube is enlarged to bring the #f coating surface into pressure contact with the block. When carrying out simultaneous expansion of the entire surface using this pipe expansion method, such as the hydraulic pipe expansion method, there is a risk of air being trapped in the pressure section. desirable. Bending process tS+ after completion of pressing
After that, it was completed as a heat pipe.

d. The above method has no failure in insertion and has extremely low thermal resistance. In order to further reduce the contact thermal resistance, before expanding the tube, apply one coat of thermally conductive grease or thermally conductive adhesive to the inner wall of the insertion hole and the outer wall of the container tube, and then use the appropriate ball insertion method and plug. If the tube is expanded by the drawing method, the minute recess in the pressure welding part will be replaced with air frame plastic material, and the excess material will be discharged and returned with a small semi-catalytic abrasive. .

e. Since the generation of heat is large in semiconductors, it is preferable that the heat pie 1 used in the cooling device be one made of pure water, which has a large amount of heat transfer. However, in addition to heat pipe materials that can be easily used with pure water and are suitable for living, the range of I4 materials is narrow, and only pure copper and pure nickel are available for general purpose use. Regarding thermal conductivity, pure copper is the only material for the heat pipe. In addition, pure copper has traditionally been used as a block material because the block and heat pipe are inserted by solder bonding, which makes it easy to attach and has good thermal conductivity. Power semiconductor cooling according to the present invention! In IF, as a means to solve this problem (t), the two are pressure-welded and integrated by expanding and inserting the tube. Therefore, consider the solder layer adhesion.
Since there is no metal, it is possible to use an aluminum block with good thermal conductivity, although the pure copper content is a little low. In addition, steel ball press-in method or plug pull-out method is available for pipe expansion method! e
Between the aluminum block and the copper heat pipe! Aluminum corrodes because it will become almost unpaid around the time! ! ! No galvanic corrosion occurs between metals.

It is impossible to solder the aluminum heat pipe to the aluminum block. 01, the durability of the adhesive strength of the aluminum solder in the expansion hole circle is poor, and the soldering work is high compared to lead soldering, so the vapor pressure of the sea bream liquid made in the heat vibrator is There are 7 problems such as high temperature and danger. : We are friends. However, by adopting the expanded fold viewing method, there is no jamming during the manufacturing and ascent process, and there is no need to scrunch the aluminum solder, making it possible to insert an aluminum heat pipe. This also makes it possible to replace the inner @IICn pure steel t1 with which the working fluid comes in contact, and use aluminum on the outer side, making it possible to use a double pipe heat pipe tf. A round steel aluminum heat pipe using black alumite as an external wave has excellent corrosion resistance than copper heat pipes, and has the effect of strengthening the corrosion resistance of the cooling device as a whole.

! Most of the conventional heat pipe type semiconductor cooling devices use sub-fins, but the reason why l1m becomes large and it becomes a problem is not necessarily because the conductivity is good and t0
Since the heat pipe is a copper heat pipe, I couldn't use the island aluminum fins, which could cause damage. Also, it is easy to cheat on copper fins, so anodized aluminum is used.
III.Although the use of aluminum was 'A'ln, there was a risk of electrolytic corrosion! A good friend of mine. However, the n&i' steel aluminum 2
] It is now possible to apply a 1F heat pipe, and even if aluminum fins are used in the heat dissipation part of this box, the risk of electrical corrosion caused by the same metal inserts will be completely eliminated.

It is possible to solve all the serious problems caused by using copper fins instead of aluminum fins, as well as the problem of poor corrosion resistance.

3. The problem with replacing the copper block 1 is that machining is difficult. Machining the heat pipe insertion hole is a difficult and expensive process. In the case of conventional solder insertion, in order to prevent air entrapment and to reduce the heat resistance by making the solder thinner, a machine with a high W4 degree is required. In the case of FEE*, there is no need to consider the accuracy of the reversible hole. In addition, when the insertion holes are parallel to each other and there are through-holes, the block can be extruded to 0T, and the need for finishing blades due to machining is eliminated, making it possible to significantly reduce the cost of the block. . Another great advantage is that it is possible to use aluminum blocks for expanded WEE deposition.

In other words, the extrusion molding of aluminum blocks and the extrusion molding of copper can be achieved with much higher efficiency and lower cost, resulting in cost reductions of OTt+H.

In order to solve the above-mentioned problems and their effects, 1. In the present invention, the insertion of the heat pipe after completion is discontinued.

It can be seen that the manufacturing method in which parallel parallel holes are provided in the block and the container tube is pressed against the tube by the tube expansion method has a large number of drawing effects.

(E)'#Example 7tl applied to the means and operation for solving each item as mentioned above! An example is shown in FIG. FIG. 2 shows the heat pipes as viewed from the top, and FIG. 3 shows the shape of the blocks. , FIG. 4 shows another implementation sequence. Metal block in L, 2-aa2-t), 2-ei each heat pipe insertion communication hole 6rX, semiconductor pressurized W
: It is an electrodeposited plane that confuses people.

The through holes are provided parallel to the layered plane, parallel to each other, and horizontal to the block installation attitude. As can be seen from Figure 3, the spacing between the through holes is much smaller than that of the conventional structure shown in Figure 5. The diameter is 2, which is the same as the conventional spacing on the fin plane! For the heat pipe of S@, it is necessary to have a spacing of at least about 25 tin or more.
It can be made as small as possible. This is due to the fact that the structure has no relationship between the heat pipe spacing between the fins and the heat pipe spacing in the block.

It is possible to shorten the length of the sheet pipes in the direction of arrangement of the sheet pipes in the ICz reblock by 4 ohm when replacing three 25-diameter human pipes.
It is now possible to make it as small as t-width. Since the through hole 2-a @ 2-ba 2-C is a hole for inserting an expanded tube, higher precision is not required compared to soldering or mechanical press-fitting. Furthermore, since there is no relation to fin attachment, a large degree of freedom is allowed in the mutual positional accuracy of the through holes. Therefore, it is O7 IP to mold each through hole simultaneously with the outer diameter of the block by extrusion, and the typical mechanical force is not required thereafter. It is shaped like a snow-covered block when viewed from the electrical installation side.

In response to the fact that the horizontal section of the lower heat vibrator is longer, the heat pipe's lPI absorption length is increased to improve heat absorption efficiency. Therefore, the shape need not be limited to a trapezoid, but may be a rectangle or a square. However, from a cost standpoint, it is desirable that the shape be such that a large number of blocks can be obtained by cutting without waste from a bar material with a nonagonal cross section extruded in the longitudinal direction of the through hole. The material of the metal block is preferably pure copper and pure aluminum; a copper block is used when extremely high cooling performance is required, and an aluminum block is used when an inexpensive device is required. 3-a and 3-b in FIGS. 1 and 2.

3-c is a heat pipe, which is inserted through the W over-insertion hole of the metal block as a heat receiving part in the middle part of each, and the other part is perpendicular to the side surface of the metal block at a predetermined position. , bent upwards. In that part, enlarge the its side of both sides of the block and put it on both sides f'Lf
It is normally not allowed to go outside the C range. In general, a flat semiconductor cooling device is used in a state where a large number of cooling devices and a large number of semiconductor elements are alternately placed horizontally, and a large potential difference is applied between the various elements and the cooling device RT during regular use. , depending on the fact that they are not allowed to come into contact with each other. The heat pipes bent upward are arranged in an array at the upper part of the metal block to form a heat dissipation section. The heat dissipation part is 5-a in the figure.
*A fin group may be formed for each heat pipe as in 5-b+5-c.

It does not matter even if a common fin group such as the fin group shown in FIG. 5 is attached. 4-a*4-bn This is a protection plate that protects the fins and guides the forced convection wind. The arrangement state of the heat pipes on the plane of the protection plate 4-1) is shown in Fig. This array rclf may be an imaginary array. The electric contact surfaces 6 on both sides of the block 1 are extended to the outer width of the protection plate and the fins, and lie in parallel planes.

The heat pipe 3 and the through hole 2 of the block are inserted and connected before the heat pipe 3 is completed. That is, the raw Vt-straight pipe of the container is inserted to a predetermined position, the raw pipe is expanded, and the raw pipe is crimped and integrated. In order to minimize air entrapment during pipe expansion, it is desirable to use the steel ball press-in method or the plug-pulling method. In order to completely eliminate air in minute scratches and dents inside the through hole and on the outer periphery of the tube, apply grease or follower material with good thermal conductivity to both walls, press-fit the four balls, and plug. If the expansion is done by pulling out, the excess material will be completely drained away.
.

If the recess is filled with non-woven material, it may not be completely crimped.
The contact thermal resistance t of the 1M portion can be reduced to almost zero. In this way, the insertion into the insertion hole is completed, and the iFB is inserted into the blank tube at a predetermined position, and the heat pipe 3 is completed through a predetermined process.

Unlike the conventional structure for inserting heat pipes, the insertion of the present invention is in a press-contact state and there is no risk of corrosion or electrolytic corrosion at this insertion part, so it is possible to insert aluminum heat pipes and aluminum heat pipes. Become. Also, as mentioned above, since there is no need for high-temperature sputum production, it is possible to insert a Freon heat pipe. Therefore, in the second embodiment of the present invention, the material of the heat pipe 3 is pure copper, aluminum, aluminum alloy copper, or the like.

In addition, if the material of the heat pipe 3 is copper as the fin material, the outer surface of the heat pipe 3 is aluminum. is used for Z.

1Cs in Fig. 1 in Fig. 4 of the second embodiment? While each heat pipe is a U-shaped tubular container, it is a container bent at a predetermined angle. It is proportional. In the figure, the heat dissipation S is concentrated only on one side of block 1 11IIIi. Correspondingly, the block is formed into a tongue shape with the opposite side of the heat dissipating side being vertical. This shape is not limited to the tongue shape, but may be rectangular or square.

In order to reduce the size of the block and increase the heat receiving area, the heat pipe is inserted into the ineffective portion of the end of each heat pipe so that the hole A is exposed in the vertical direction of the block. The structure of this embodiment is convenient for assembling when the flat semiconductor elements and the semiconductor cooling device 11+- of the present invention are alternately stacked for summer use. In addition, the fin width t can be increased by twice if the fin is attached to the camphor wood on such a side, thereby increasing the heat dissipation effect.

Or bending 7 of this embodiment! ! The degree may be any angle between the If line and a right angle. That is, any angle can be adopted for the relative posture of the fin surface and the block.

1st Embodiment of the Manufacturing Method The basic aR method along with the explanation of the structure will be explained in the section of means and functions for solving the shortcomings regarding the manufacturing method of the conductor cooling device under pressure having the structure as shown in FIGS. 1 and 4. explained. Heat pipe t-fin #Pt- with a strange shape as shown in the figure
It is almost impossible to perform solder bonding using the conventional method with such precision as to insert and attach the connector. This is because all the solder in the through holes has become molten and has flowed out. Also solder bonding between aluminum block and copper heat pipe, aluminum block and aluminum jacket heat pipe, and copper block and aluminum jacket heat pipe is also 11! In terms of reliability, solder fitting is not possible. Furthermore, it is impossible to solder the Freon hydraulic fluid heat pipe from the viewpoint of safety. Therefore, the structure related to the non-invention is the expansion of the container in its original state before the heat pipe is completed.
It can be said that it cannot be manufactured with anything other than l. , 7J The structures shown in FIGS. 1 and 2 have some disadvantages in terms of implementation. In other words, the distance between the heat dissipating parts of each heat pipe is actually about 50 to 60 mm due to fin efficiency! If there is a lot of sweetness, it is therefore extremely difficult to insert a bending tool during bending. Also, if you insert and expand the container in the form of a TTM tube, you will have to expand the entire volume, which is a problem! It has been completed. Also, it is convenient to use a blank pipe on which fin groups have been formed in advance, as shown in Figure 1.
In J case, it is impossible to insert into the seeding hole.

The means illustrated in FIGS. 8 and 9 as a 4@-like embodiment are desirable. In the figure, numeral 31 indicates a short straight pipe. It is much easier to expand the solid material first. Connect the remaining container airtightly to the tip of the short length gf. In this case, connect the remaining container 33 to the tip of the gf. Therefore, it is recommended to complete the processing that is expected to be difficult.In other words, complete the bending knife loe and installation of individual fins before connecting. In the case of a connection, it is also possible to use the example jL in which the raw pipe and the remaining container are directly connected as shown in FIG. It is possible to manufacture the power semiconductor cold Ml 1tD according to the present invention as illustrated in FIGS. 1 and 4 only by the manufacturing method according to the above.It also becomes possible to miniaturize the metal block, increase the amount of 1ffl, and use aluminum. While retaining the high performance of copper-water heat pipes, it is also possible to use aluminum for the outer cover and aluminum for the fins.

Second Embodiment of Manufacturing Method The manufacturing method according to the present invention allows the contact thermal resistance between the heat pipe and the metal block to be extremely reduced by integrally press-welding the heat pipe and the metal block. Also, the insertion hole machine 〃Ωwork'? r,! Ii
In short, it is also possible to achieve a significant cost reduction.

However, by omitting the mechanical force, there is a risk that secondary air intake holes may be left in the 1st and 71st directions, which are in contact with the strong tube expansion force.

If the power loss is 300 or more, the required total thermal resistance is 0.01℃/W, and the increase in thermal resistance due to trapped air in a cooling device such as v is small, such as 112℃/W. However, it cannot be ignored. In such cases, the holes remaining on the welding surface in the press-welded state should be made of thermally conductive #
There is a need to make IJ quality, fill it, and expel the air. @1
Figure 0 shows an example of such countermeasures. In this case, when inserting the μ blank tube Jt, apply a viscous coating material such as thermally conductive grease, paint, or coating material to the blank tube surface 31 and the inner wall 2 of the insertion hole. After that, the relative position of the block 1 and the raw pipe 31 lt
The J shell is expanded from one side of the block 1 by press-fitting the steel ball 361 while keeping it fixed, or by pulling out the plug.

Thermal conductive grease 35 is discharged from the ground end 1 into the insertion hole 1
And Yusuke Junko appeared on tv. At this time, fine pores remain between the two and are filled with thermally conductive grease, resulting in a rLz-like appearance. Thermal resistance in such a pressure-welded state is
[DJ becomes a small person with a certain degree of incompetence.

(f) Effects of the Invention The P# value of the structure of the power half-four body cooling device according to the present invention is Beno 34! The basic point is that it is structured based on a number of factors.

a, A metal block for receiving heat from a metal block with through holes for inserting heat pipes in parallel horizontally.

b-M Heat pipe inserted into the through hole 1 and crimped and integrated with the block using the tube expansion method.

C, l The above heat pipe in which the positive position 1f is bent upward for VcIIM, and the aligned No. 1747 is the device.

This is similar to the individual effects corresponding to the above GJ a + b - c 6 terms.

a. The block and its openings allow it to be molded together in one step by extrusion, and the block is made into a compact size.

b. Soldering FF is no longer necessary, and room temperature insertion is possible.
゜Machining of the insertion hole is not required. Also, the thermal resistance is extremely small. Also, the continuous layer of aluminum tubes becomes OT drive.

C. The heat dissipation area per heat pipe increases.

Combining the above-mentioned structures and effects, the device according to the present invention has a weight of 11g and a total weight of 9! You can take action with the following effect: @-.

d. The entire device can be significantly reduced in weight and size.

e, fJFs A high-performance device with small resistance can be obtained.

In addition to f, aluminum block, aluminum heat vibrator, aluminum fin, and Freon hydraulic fluid, a lightweight cooling length can be constructed.

3. Due to the summer use of the aluminum copper pipe container, only the parts that come into contact with pure water operation are made of pure copper, aluminum blocks, and aluminum fins.

As with aluminum heat pipes, all the exposed parts can be made of T-resistant aluminum, so the heat pipes of water-operated copper containers have high performance, high 1g weight, and are lightweight. Ideal cooling with high corrosion resistance! ftIt is being invaded @

[Brief explanation of drawings]

Fig. 1 is a schematic configuration diagram showing an embodiment of the present invention, A21 is a plan view showing the arrangement state of the heat pipes as seen from the top, and Fig. 3
Fig. 4 is a perspective view of a metal block, Fig. 4 is a 14-schematic configuration diagram showing an embodiment of the field of the present invention, Figs. 5 to 7 are schematic configuration diagrams of conventional T-bottoms, and Figs. Fig. 10 is a front view showing nine states in which a short straight raw pipe is expanded and crimped onto a μ metal block, and a raw FK heat pipe container is connected to it. 1 ・-metal block, 2- a * 2-1),
2-c...Insertion hole, 3-a, 3-b, 3-c-heat pipe, 4-a+4-fi"" retention plate, 5-a*5
-b, 5-c...Fin group. Figure 1 Figure 2 Figure 3 Figure 4 Figure 6, Figure 7

Claims (8)

[Claims] (1) A power semiconductor cooling device that cools a power semiconductor element by bringing it into contact with an electrical contact surface provided on a flat surface of a metal block on which a heat pipe type radiator is attached, in which a plurality of through holes are connected to each other. Metal blocks installed in parallel and parallel to the electrically connected surfaces and horizontally in the installed position of the blocks, and inserted through the respective through holes of the metal blocks to receive heat from them. The section is composed of a plurality of heat pipes that are crimped and integrated on the inner wall of each through hole by a tube expansion method, and each heat pipe is bent upward and vertically at a predetermined position and arranged in parallel. 1. A power semiconductor cooling device characterized in that a group of heat dissipating fins are individually or commonly attached to predetermined portions of the parallel section to form a heat dissipating section. (2) The power semiconductor cooling device according to claim 1, characterized in that the metal block has a trapezoidal shape when viewed from the surface on which the electrical contact surface is provided. Power semiconductor cooling equipment. (3) In the power semiconductor cooling device according to claim 1, a liquid mainly composed of pure water is used as the working fluid of the heat pipe, and the container of the heat pipe is welded. It has a double metal tube structure in which the outer periphery of the inner tube made of pure copper or copper alloy is closely and integrally coated with the outer periphery of the inner tube made of pure copper or copper alloy, except for the part where the aluminum coating has been removed. A power semiconductor cooling device characterized in that a container is used, and a group of fins attached to a heat dissipation part of a heat pipe is also made of aluminum or an aluminum alloy. (4) In the power semiconductor cooling device according to claim 1, each heat pipe has a bent shape bent at a predetermined angle, and the heat receiving portion thereof is inserted through the through insertion hole. A power semiconductor cooling device characterized in that an ineffective part of a heat receiving part as a heat pipe is exposed outside the block. (5) In the power semiconductor cooling device according to claim 1, each heat pipe inserted into the through hole of the block is pressed into the through hole by pipe expansion and integrated with the block. A heat pipe is characterized in that it consists of a short straight pipe part that projects outside the block, and another part of the heat pipe that is integrally connected to the straight pipe at one or both ends in an airtight manner. Power semiconductor cooling equipment. (6) A method for manufacturing a power semiconductor cooling device configured by inserting a heat pipe into a through hole provided in a metal block, in which first a base tube of a heat pipe container is penetrated and inserted into the through hole. Next, the raw pipe is expanded and crimped into the through hole to be integrated with the metal block, and then the container is formed into a heat pipe with a predetermined shape and configuration,
A method of manufacturing a power semiconductor cooling device, which further comprises forming a heat dissipation portion having a predetermined configuration to complete the device. (7) In the method for manufacturing a power semiconductor cooling device according to claim 6, first, a short straight heat pipe material tube is inserted into a through hole of a metal block so that predetermined lengths of both ends protrude. , While maintaining the relative positions of the raw pipe and the metal block, the raw pipe is expanded and crimped onto the inner wall of the through hole to integrate the metal block and the raw pipe, and then one end or both ends of the raw pipe are Manufacture of a power semiconductor cooling device characterized in that heat pipe containers having a predetermined shape and configuration are airtightly connected, and then a predetermined heat pipe forming means is applied, and further a heat dissipation part forming means having a predetermined structure is applied to complete the device. Method. (8) A method for manufacturing a power semiconductor cooling device according to claim 6, in which, when inserting the raw tube into the through hole, either or both of the inner wall of the through hole and the outer peripheral wall surface of the raw tube insertion part. Power semiconductor cooling is carried out by applying a coating material such as grease, paint, or adhesive with good thermal conductivity to the tube, and the tube expansion method is carried out by ■ bulb press-in method or plug pull method. Method of manufacturing the device.