JPS61206284A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To transmit heat generated from a semiconductor laser chip effectively over the outside of a package by fitting the semiconductor laser chip onto a stem, hermetically sealing the laser chip by the package and confining an insulating and good thermal conductive liquid or solid or semisolid solution into the package. CONSTITUTION:A semiconductor laser diode chip 1 is set up on one surface side of a chip mount body 2 vertically mounted onto a stem 3, and connected to a terminal electrode 9 by a conductive wire 7. A photodiode 6 for monitoring beams is fitted where opposite to the chip 1, and connected to a terminal electrode 10 by a conductive wire 8. Terminal electrodes 9-11 are fixed to the stem 3, glass 5 for extracting beams is bonded so as to close an opening in a cap 4, the upper section of the stem 3 is hermetically sealed and sealed by the cap 4, and an insulating cooling liquid 21 is encapsulated into a space section on the inside of the cap 4. Accordingly, the internal heat generation of the chip 1 can be extracted to the outside through the insulating cooling liquid 21 from the whole surface, thus preventing the thermal breaking of the chip 1, then miniaturizing constitution.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor laser device C2, and is particularly used in devices such as optical communication using a semiconductor laser.

[Technical background of the invention and its problems]

Conventionally, semiconductor laser devices have been provided with a heat sink to prevent heat from rising in the semiconductor laser diode chip due to increased output. FIG. 2 is a cross-sectional configuration diagram showing a conventional semiconductor laser device, in which 1 is a semiconductor laser diode chip, 2 is a semiconductor laser diode chip, and 2 is a semiconductor laser diode chip.
is a chip mount body (board), 3 is a stem, 4 is a cap, 5 is a glass for light extraction, 6 is a photodiode for the original monitor, 7.8 is a conductive wire, 9 to 11 are terminal types ($) 4
(!J-do). In this way, (2) In order to prevent the heat rise of the semiconductor laser diode chip 1 (;, the heat dissipation plate, that is, the stem 3, and the chip mount body 2 are used, and the double heating plate structure improves the heating effect, so C2 is It would be possible to make the structure larger, but there are restrictions on the structure and there is a problem in that it cannot be made larger than necessary.

[Purpose of the invention]

The present invention has been developed in view of the above-mentioned circumstances, and it is an object of the present invention to provide a semiconductor laser device capable of effectively transmitting heat emitted from a semiconductor laser chip to the outside of the package.

[Summary of the invention]

In the present invention, a semiconductor laser chip is disposed on the whole stem and sealed with a package, and the semiconductor laser chip is disposed on the whole stem and sealed in a package.
It is characterized by containing a liquid, solid, or semi-solid solution with P, rim property and good heat conductivity.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to all the drawings. 1st
The figure shows the same embodiment, or since this is an example of the second (2) corresponding case, the same reference numerals are used for the corresponding locations f2. That is, the semiconductor laser diode chip 1 is connected to the C on the stem 3. 2 vertical (2 chip mount bodies (plates) 2
The conductive wire 7 connects the terminal '
The electrode 9 is read later. Original monitor photodiode 6
is a semiconductor laser diode chip 1 (two arranged in opposite positions) and connected to a conductive wire 8 (two twisted terminals *poles 10; terminal electrodes 9, 10, 11 are connected to stem 3)
is fixed. The last one for light extraction is cap 4.
The cap 4 is inserted into the stem 3 to close the opening of the stem 3.
The top is sealed and sealed. The space C2 inside the cap 4 is filled with, for example, a water-soluble insulating cooling element 21 having excellent heat transfer properties. As this insulating cooling liquid 21, for example, a commercially available fluorine-based inert liquid (product name: Fluorinert) manufactured by Sumitomo 3M Co., Ltd. is used.

As mentioned above, in the space inside the C2 semiconductor laser device,
By enclosing a water-soluble insulating coolant 21 with excellent heat transfer properties, the internal heat generation of the semiconductor laser diode chip f1 can be reduced to all parts of the chip. frl (conventionally, heat is generated only from the mounting surface of the chip f1) through the insulating coolant U liquid 21 to the outside (2 Narita), which can cause thermal breakdown of the semiconductor laser diode chip or the semiconductor laser diode 9
It is possible to suppress the wavelength change to a long wavelength mode (0.25 to 0.3 nm/'c) caused by internal heat generation of the chinogu. Further, conventionally, external heat was released only from the stem 3, but in the present invention, heat can also be released from the outer surface of the cap 4 via the insulating cooling liquid 21, so that the semiconductor laser device can be miniaturized.

Note that the present invention is not limited to the embodiments, and various applications are possible. For example, the material sealed in the space inside the cap may be a solid or semi-solid solution instead of the insulating coolant 21.

〔Effect of the invention〕

As explained above, according to the present invention C2, the heat generated from the semiconductor radar chip is effectively transferred to the outside of the motherboard.
Therefore, it is possible to provide a semiconductor radar device that can prevent thermal damage to the semiconductor laser chip and miniaturize the structure.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view of one embodiment of the present invention! FIG. 2 is a cross-sectional configuration diagram of a conventional semiconductor laser device. DESCRIPTION OF SYMBOLS 1... Semiconductor laser diode chip, 2... Chip mount body, 3... Stem, 4... Cap, 5
. . . Glass for light extraction, 6. Photodiode for original monitor, 7. 8. Conductive wire, 9A 11. One terminal electrode. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2

Claims (1)

[Claims] 1. A semiconductor laser device comprising a semiconductor laser chip disposed on a stem and hermetically sealed in a package, the package containing a liquid, solid or semi-solid solution having insulating properties and good heat conductivity.