JPS61205160U - - Google Patents
Info
- Publication number
- JPS61205160U JPS61205160U JP1986085821U JP8582186U JPS61205160U JP S61205160 U JPS61205160 U JP S61205160U JP 1986085821 U JP1986085821 U JP 1986085821U JP 8582186 U JP8582186 U JP 8582186U JP S61205160 U JPS61205160 U JP S61205160U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- semiconductor light
- optical
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986085821U JPS61205160U (US20100012521A1-20100121-C00001.png) | 1986-06-05 | 1986-06-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986085821U JPS61205160U (US20100012521A1-20100121-C00001.png) | 1986-06-05 | 1986-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61205160U true JPS61205160U (US20100012521A1-20100121-C00001.png) | 1986-12-24 |
Family
ID=30636562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986085821U Pending JPS61205160U (US20100012521A1-20100121-C00001.png) | 1986-06-05 | 1986-06-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61205160U (US20100012521A1-20100121-C00001.png) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5559785A (en) * | 1978-10-27 | 1980-05-06 | Fujitsu Ltd | Light emitting semiconductor device |
-
1986
- 1986-06-05 JP JP1986085821U patent/JPS61205160U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5559785A (en) * | 1978-10-27 | 1980-05-06 | Fujitsu Ltd | Light emitting semiconductor device |