JPS61205139U - - Google Patents
Info
- Publication number
- JPS61205139U JPS61205139U JP8886985U JP8886985U JPS61205139U JP S61205139 U JPS61205139 U JP S61205139U JP 8886985 U JP8886985 U JP 8886985U JP 8886985 U JP8886985 U JP 8886985U JP S61205139 U JPS61205139 U JP S61205139U
- Authority
- JP
- Japan
- Prior art keywords
- heater chip
- conductors
- tip
- screwed
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8886985U JPH0238452Y2 (enrdf_load_stackoverflow) | 1985-06-14 | 1985-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8886985U JPH0238452Y2 (enrdf_load_stackoverflow) | 1985-06-14 | 1985-06-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61205139U true JPS61205139U (enrdf_load_stackoverflow) | 1986-12-24 |
| JPH0238452Y2 JPH0238452Y2 (enrdf_load_stackoverflow) | 1990-10-17 |
Family
ID=30642420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8886985U Expired JPH0238452Y2 (enrdf_load_stackoverflow) | 1985-06-14 | 1985-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238452Y2 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02197382A (ja) * | 1989-01-24 | 1990-08-03 | Murata Mfg Co Ltd | 熱圧着用ヒータチップ |
| JPH03486A (ja) * | 1989-05-29 | 1991-01-07 | Murata Mfg Co Ltd | 熱圧着用ヒータチップ |
-
1985
- 1985-06-14 JP JP8886985U patent/JPH0238452Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02197382A (ja) * | 1989-01-24 | 1990-08-03 | Murata Mfg Co Ltd | 熱圧着用ヒータチップ |
| JPH03486A (ja) * | 1989-05-29 | 1991-01-07 | Murata Mfg Co Ltd | 熱圧着用ヒータチップ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0238452Y2 (enrdf_load_stackoverflow) | 1990-10-17 |