JPS61203264A - Automatic work mounting/dismounting method and device for lapping machine - Google Patents

Automatic work mounting/dismounting method and device for lapping machine

Info

Publication number
JPS61203264A
JPS61203264A JP60024796A JP2479685A JPS61203264A JP S61203264 A JPS61203264 A JP S61203264A JP 60024796 A JP60024796 A JP 60024796A JP 2479685 A JP2479685 A JP 2479685A JP S61203264 A JPS61203264 A JP S61203264A
Authority
JP
Japan
Prior art keywords
work
eccentric
dismounting
lapping machine
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60024796A
Other languages
Japanese (ja)
Inventor
Toshio Konishi
Original Assignee
Toa Kogyo Kk
Yamaguchi Kiyoine
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toa Kogyo Kk, Yamaguchi Kiyoine filed Critical Toa Kogyo Kk
Priority to JP60024796A priority Critical patent/JPS61203264A/en
Publication of JPS61203264A publication Critical patent/JPS61203264A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To absorb the carrier and the work together simultaneously by absorbing the eccentric section of work through an absorption pad then applying a correcting/reinforcing board onto the rear face of thin unstable carrier fitted with a work and holding onto a plane.
CONSTITUTION: A drive sun gear 3 is arranged in the center of lapping machine while an internal gear 4 is arranged on the outercircumference. A planetary pinion supported on an annular lapping table 5 is gearing between them 3, 4. A compatible pad will absorb the eccentric section of work W0. The eccentric section of work can be absorbed through weak force of small pad while supported by a flexure correcting/reinforcing board from the rear of carriers P1WP5 fitted with thin work W0 thus to enable simultaneous adsorption and mounting/dismounting. Furthermore, a feed relay center 6 and containing relay center 7 are provided in the feed line and the containing line.
COPYRIGHT: (C)1986,JPO&Japio
JP60024796A 1985-02-12 1985-02-12 Automatic work mounting/dismounting method and device for lapping machine Pending JPS61203264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60024796A JPS61203264A (en) 1985-02-12 1985-02-12 Automatic work mounting/dismounting method and device for lapping machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60024796A JPS61203264A (en) 1985-02-12 1985-02-12 Automatic work mounting/dismounting method and device for lapping machine

Publications (1)

Publication Number Publication Date
JPS61203264A true JPS61203264A (en) 1986-09-09

Family

ID=12148149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60024796A Pending JPS61203264A (en) 1985-02-12 1985-02-12 Automatic work mounting/dismounting method and device for lapping machine

Country Status (1)

Country Link
JP (1) JPS61203264A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333413A (en) * 1991-12-18 1994-08-02 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
WO2000069597A1 (en) * 1999-05-17 2000-11-23 Kashiwara Machine Mfg. Co., Ltd. Method and device for polishing double sides

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333413A (en) * 1991-12-18 1994-08-02 Shin-Etsu Handotai Co., Ltd. Automatic wafer lapping apparatus
WO2000069597A1 (en) * 1999-05-17 2000-11-23 Kashiwara Machine Mfg. Co., Ltd. Method and device for polishing double sides
US8002610B2 (en) 1999-05-17 2011-08-23 Sumitomo Mitsubishi Silicon Corporation Double side polishing method and apparatus
DE10081456B3 (en) * 1999-05-17 2016-09-15 Kashiwara Machine Mfg. Co., Ltd. Apparatus for double-sided polishing
DE10081456B9 (en) * 1999-05-17 2016-11-03 Kashiwara Machine Mfg. Co., Ltd. Apparatus for double-sided polishing

Similar Documents

Publication Publication Date Title
AU559399B2 (en) Workpiece carrier
JPS60143135A (en) Car with rocking device for driving wheel
JPS5851009A (en) Machine tool equipped with pallet exchanger
JPH0236034A (en) Working method and device for work in carriage
DE3173168D1 (en) Automatic tool changing device adaptable to be mounted on machine tools having a vertical or horizontal spindle, and automatic means for handling and positioning these tools in the spindles of machine tools
DE2950881A1 (en) Device for controlling a machine tool, the tool of which is rotated by an axle with regard to the workpiece and which can be addressed in this axis
GB2144698B (en) A method for feeding articles to an apparatus with the articles presented according to a predetermined angular disposition, and apparatus for carryingg out said method
AU1824983A (en) A method of utilizing the energy in the surface waves in a body of liquid, such as waves on the surface of an ocean, andequipment for carrying out said method
JPH01182198A (en) Aircraft window polishing device
EP0186107A3 (en) Chucking device for workpiece in grinding machine
JPH03112724A (en) Wiring for vehicle motor and piping device
JPS60106983A (en) Method and device for deterging workpiece by plazma jet
JPS62187579A (en) Positioning device for car body
EP0174799A3 (en) Machine tools, in particular grinding machines with apparatus for changing grinding wheel tools and workpieces
DE3246168A1 (en) Grinding machine
DE3346148A1 (en) Device for detachable fastening, preferably a grinding wheel on a power-driven hand tool
EP0180175A3 (en) Surface grinding apparatus
JPS59217278A (en) Floppy disk driver
JPH0197550A (en) Grinding machine
DE3402164A1 (en) Holding device for a part, in particular hub cover pads, a steering wheel
GB2152430B (en) Workpiece support for use in sawing
AU1807883A (en) Attachment device for use with a sewing machine
JPH0241864A (en) Polishing device
JPS5645367A (en) Liquid waxxless mounting tool for wafer with minute size
GB2152864B (en) Composite machining lathe with tool-changing apparatus