JPS61202484A - 発光ダイオ−ド装置 - Google Patents

発光ダイオ−ド装置

Info

Publication number
JPS61202484A
JPS61202484A JP60045375A JP4537585A JPS61202484A JP S61202484 A JPS61202484 A JP S61202484A JP 60045375 A JP60045375 A JP 60045375A JP 4537585 A JP4537585 A JP 4537585A JP S61202484 A JPS61202484 A JP S61202484A
Authority
JP
Japan
Prior art keywords
lead
light emitting
alloy
emitting diode
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60045375A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0424879B2 (enExample
Inventor
Nobuo Ogasa
小笠　伸夫
Akira Otsuka
昭 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP60045375A priority Critical patent/JPS61202484A/ja
Publication of JPS61202484A publication Critical patent/JPS61202484A/ja
Publication of JPH0424879B2 publication Critical patent/JPH0424879B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP60045375A 1985-03-05 1985-03-05 発光ダイオ−ド装置 Granted JPS61202484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60045375A JPS61202484A (ja) 1985-03-05 1985-03-05 発光ダイオ−ド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60045375A JPS61202484A (ja) 1985-03-05 1985-03-05 発光ダイオ−ド装置

Publications (2)

Publication Number Publication Date
JPS61202484A true JPS61202484A (ja) 1986-09-08
JPH0424879B2 JPH0424879B2 (enExample) 1992-04-28

Family

ID=12717518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60045375A Granted JPS61202484A (ja) 1985-03-05 1985-03-05 発光ダイオ−ド装置

Country Status (1)

Country Link
JP (1) JPS61202484A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359403A (ja) * 2001-05-31 2002-12-13 Nichia Chem Ind Ltd 発光装置
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
JP2005347375A (ja) * 2004-06-01 2005-12-15 Shinko Electric Ind Co Ltd 発光素子用ステム及び光半導体装置
US7408203B2 (en) 2004-04-17 2008-08-05 Lg Electronics Inc. Light emitting device and fabrication method thereof and light emitting system using the same
WO2009081470A1 (ja) * 2007-12-21 2009-07-02 Mitsubishi Electric Corporation レーザ光源モジュール
JP2009272656A (ja) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd 半導体発光素子及びその製造方法
US20110147785A1 (en) * 2008-02-22 2011-06-23 Illinois Tool Works Inc Surface mount led and holder

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359403A (ja) * 2001-05-31 2002-12-13 Nichia Chem Ind Ltd 発光装置
US7408203B2 (en) 2004-04-17 2008-08-05 Lg Electronics Inc. Light emitting device and fabrication method thereof and light emitting system using the same
US8008677B2 (en) 2004-04-17 2011-08-30 Lg Electronics Inc. Light emitting device and fabrication method thereof and light emitting system using the same
EP1596440A1 (en) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Light emitting device
JP2005347375A (ja) * 2004-06-01 2005-12-15 Shinko Electric Ind Co Ltd 発光素子用ステム及び光半導体装置
WO2009081470A1 (ja) * 2007-12-21 2009-07-02 Mitsubishi Electric Corporation レーザ光源モジュール
US8233512B2 (en) 2007-12-21 2012-07-31 Mitsubishi Electric Corporation Laser light source module
JP5430406B2 (ja) * 2007-12-21 2014-02-26 三菱電機株式会社 レーザ光源モジュール
US20110147785A1 (en) * 2008-02-22 2011-06-23 Illinois Tool Works Inc Surface mount led and holder
US8362513B2 (en) * 2008-02-22 2013-01-29 Illinois Tool Works Inc. Surface mount LED and holder
JP2009272656A (ja) * 2009-08-20 2009-11-19 Sumitomo Electric Ind Ltd 半導体発光素子及びその製造方法

Also Published As

Publication number Publication date
JPH0424879B2 (enExample) 1992-04-28

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