JPS61199001U - - Google Patents

Info

Publication number
JPS61199001U
JPS61199001U JP8287685U JP8287685U JPS61199001U JP S61199001 U JPS61199001 U JP S61199001U JP 8287685 U JP8287685 U JP 8287685U JP 8287685 U JP8287685 U JP 8287685U JP S61199001 U JPS61199001 U JP S61199001U
Authority
JP
Japan
Prior art keywords
electronic component
lands
circuit board
printed circuit
component electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8287685U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8287685U priority Critical patent/JPS61199001U/ja
Publication of JPS61199001U publication Critical patent/JPS61199001U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP8287685U 1985-05-31 1985-05-31 Pending JPS61199001U (US20020193084A1-20021219-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8287685U JPS61199001U (US20020193084A1-20021219-M00002.png) 1985-05-31 1985-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8287685U JPS61199001U (US20020193084A1-20021219-M00002.png) 1985-05-31 1985-05-31

Publications (1)

Publication Number Publication Date
JPS61199001U true JPS61199001U (US20020193084A1-20021219-M00002.png) 1986-12-12

Family

ID=30630990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8287685U Pending JPS61199001U (US20020193084A1-20021219-M00002.png) 1985-05-31 1985-05-31

Country Status (1)

Country Link
JP (1) JPS61199001U (US20020193084A1-20021219-M00002.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256432A (ja) * 1997-03-14 1998-09-25 Nec Corp 樹脂封止型半導体パッケージ
JP2001351802A (ja) * 2000-06-06 2001-12-21 Rohm Co Ltd 電子部品
WO2021201290A1 (ja) * 2020-04-03 2021-10-07 Ｄｏｗａエレクトロニクス株式会社 光半導体パッケージの製造方法及び光半導体パッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256432A (ja) * 1997-03-14 1998-09-25 Nec Corp 樹脂封止型半導体パッケージ
JP2001351802A (ja) * 2000-06-06 2001-12-21 Rohm Co Ltd 電子部品
WO2021201290A1 (ja) * 2020-04-03 2021-10-07 Ｄｏｗａエレクトロニクス株式会社 光半導体パッケージの製造方法及び光半導体パッケージ
JP2021163950A (ja) * 2020-04-03 2021-10-11 Ｄｏｗａエレクトロニクス株式会社 光半導体パッケージの製造方法及び光半導体パッケージ

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