JPS61197466U - - Google Patents
Info
- Publication number
- JPS61197466U JPS61197466U JP8196385U JP8196385U JPS61197466U JP S61197466 U JPS61197466 U JP S61197466U JP 8196385 U JP8196385 U JP 8196385U JP 8196385 U JP8196385 U JP 8196385U JP S61197466 U JPS61197466 U JP S61197466U
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- piping
- mounting device
- lead wire
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Description
第1図は本考案の一実施例におけるサーミスタ
センサの取付装置の全体図、第2図は第1図のA
―A線による断面図、第3図は従来の配管用セン
サの全体図、第4図は従来のサーミスタセンサの
取付装置の装着前の構成図、第5図は同配管セン
サを装着した構成図である。
1…サーミスタ素子、2…素子部樹脂、3…充
填用樹脂、4…ケース、5…リード線、6…セン
サ止め具、7…配管、7a…凹部。
Figure 1 is an overall view of the thermistor sensor mounting device in one embodiment of the present invention, and Figure 2 is A of Figure 1.
-A cross-sectional view along the A line, Figure 3 is an overall view of a conventional piping sensor, Figure 4 is a configuration diagram of a conventional thermistor sensor before installation of the mounting device, and Figure 5 is a configuration diagram with the same piping sensor installed. It is. DESCRIPTION OF SYMBOLS 1... Thermistor element, 2... Element part resin, 3... Resin for filling, 4... Case, 5... Lead wire, 6... Sensor stopper, 7... Piping, 7a... Recessed part.
Claims (1)
続されたものを、配管の一部に設けた凹部におい
て充填用樹脂にて埋設したサーミスタセンサの取
付装置。 A thermistor sensor mounting device in which a thermistor element and a lead wire are connected by soldering, etc., and are buried in a recess provided in a part of piping with filling resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8196385U JPS61197466U (en) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8196385U JPS61197466U (en) | 1985-05-31 | 1985-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61197466U true JPS61197466U (en) | 1986-12-09 |
Family
ID=30629245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8196385U Pending JPS61197466U (en) | 1985-05-31 | 1985-05-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61197466U (en) |
-
1985
- 1985-05-31 JP JP8196385U patent/JPS61197466U/ja active Pending
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