JPS61196556A - Structure of integrated circuit - Google Patents
Structure of integrated circuitInfo
- Publication number
- JPS61196556A JPS61196556A JP60037927A JP3792785A JPS61196556A JP S61196556 A JPS61196556 A JP S61196556A JP 60037927 A JP60037927 A JP 60037927A JP 3792785 A JP3792785 A JP 3792785A JP S61196556 A JPS61196556 A JP S61196556A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- displays
- coded
- codes
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は集積回路の構造物本体の表面に名称や特性な
どを表示した集積回路構造物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit structure in which a name, characteristics, etc. are displayed on the surface of the integrated circuit structure body.
第2図は従来の集積回路構造物を具体的に示す平面図で
あり、図において、1は構造物本体で、例えば集積回路
チップをシリコン樹脂やエポキシ樹脂で固めたデュアル
インライン形に形成された、金属シールやセラミックで
パッケージしたりして形成されている。この構造物本体
10表面、主に面積の広い上下面には、そのパッケージ
された集積回路の名称や性質を特定する表示2が文字、
記号、数字などで印刷または刻印されている。Fig. 2 is a plan view specifically showing a conventional integrated circuit structure. In the figure, 1 is the main body of the structure, for example, an integrated circuit chip formed in a dual in-line shape made by hardening an integrated circuit chip with silicone resin or epoxy resin. , packaged with metal seals or ceramics. On the surface of this structure main body 10, mainly on the upper and lower surfaces with a large area, there is a display 2 that specifies the name and properties of the packaged integrated circuit, including letters and letters.
Printed or engraved with symbols, numbers, etc.
従来の集積回路構成物は以上のように構成されているの
で、構成物本体1に手や物が触れると、表示2が擦れに
よって摩滅したり汚れたりして、次第にその表示を認識
しにくくなり、その構成物本体1の取扱いあるいは管理
が不便あるいは不能になるという問題点があった。また
、従来のかかる表示は小さくてしかも細く、名称などの
誤判読を招くという問題点があった。Conventional integrated circuit components are configured as described above, so when a hand or object touches the component body 1, the display 2 gets worn out or dirty due to rubbing, and the display gradually becomes difficult to recognize. , there is a problem that handling or management of the component body 1 becomes inconvenient or impossible. Furthermore, such conventional displays are small and thin, which has the problem of causing misreading of names and the like.
この発明は上記のような問題点を解消するためになされ
たもので、容易に集積回路の名称などを判別できるとと
もに、摩耗や汚れに対しても表示能力が低下するのを防
止できる集積回路構造物を得ることを目的とする。This invention was made in order to solve the above-mentioned problems, and it provides an integrated circuit structure that allows the name of the integrated circuit to be easily distinguished and prevents the display ability from decreasing due to wear and dirt. The purpose is to obtain something.
この発明にかかる集積回路構成物は、構成物本体の表面
に集積回路を特定する名称などの表示をコード化して設
けたものである。The integrated circuit component according to the present invention has a coded display such as a name identifying the integrated circuit on the surface of the component body.
この発明にかかるコード化した名称は、通常文字などよ
りも極めて太い線で表示されるので、摩滅や汚れによっ
て消失するケースが極めて少ない。Since the coded name according to the present invention is displayed with a much thicker line than normal letters, it is extremely unlikely to disappear due to wear or dirt.
したがって、そのコードの耐久性が良く名称や特性の判
別が誤りなくしかも迅速に行える。Therefore, the code has good durability and the name and characteristics can be determined quickly and without error.
以下、この発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第1図において、1人は集積回路の構造物本体で、この
構造物本体IAの表面には、この集積回路を特定する上
記同様の表示2が印刷や刻印によって設けられている。In FIG. 1, one is a structure main body of an integrated circuit, and on the surface of this structure main body IA, an indication 2 similar to the above for identifying this integrated circuit is provided by printing or engraving.
3は上記表示2と同一内容をもった太い線状の複数本の
コードで、これが色コードとして一定の順序および配列
で表記されている。3 is a plurality of thick linear codes having the same content as display 2 above, and these are expressed as color codes in a fixed order and arrangement.
したがって、かかる一連のコード3が集積回路を特定す
る記号としての識別機能を有することになる。Therefore, the series of codes 3 has an identification function as a symbol for specifying the integrated circuit.
かかる構成になる集積回路構造物では、この太い線の色
コードを読み取ることによって集積回路の例えば最大出
力、入力電圧などの特性や特徴例えば電源用ピンの位置
、その他を容易かつ迅速に判定できるものであり、仮に
上記表示2が摩滅などによって認識できなくなっても、
その色コード全体が失われることはないので、この色コ
ードもとづいて長年に亘って集積回路の特定が容易にで
きることになる。In an integrated circuit structure having such a configuration, by reading the color code of the thick line, characteristics and characteristics of the integrated circuit such as maximum output, input voltage, etc., such as the position of the power supply pin, etc. can be easily and quickly determined. Therefore, even if the above display 2 becomes unrecognizable due to wear and tear,
Since the entire color code is not lost, integrated circuits can be easily identified on the basis of this color code over many years.
なお、上記実施例では、コードとして色コードを用いた
例について説明したが、このほかに光学的、磁気的、化
学的、電気的あるいはこれらに類似した方法で判読でき
るコードを用いることによって、同様の効果を得ること
ができるものである。In the above embodiment, a color code is used as the code. It is possible to obtain the following effects.
以上のように、この発明によれば、集積回路を特定する
名称などを構成物本体の表面にコード化して設は九こと
によって、従来の文字印刷によるものよりも、耐用性に
富む表示が可能になるほか、その表示の判読を誤りなく
しかも迅速に行えるという効果がある。As described above, according to the present invention, by coding and setting the name, etc. that identifies the integrated circuit on the surface of the main body of the component, it is possible to provide a display with greater durability than conventional text printing. In addition to this, there is an effect that the display can be read quickly and without error.
第1図はこの発明の一実施例による集積回路構成物の平
面図、第2図は従来の集積回路構成物の平面図である。
1は構造物本体、3はコード。
なお、図中、同一符号は同一または相当部分を示す。FIG. 1 is a plan view of an integrated circuit structure according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional integrated circuit structure. 1 is the structure body, 3 is the code. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
、構成物本体の表面に上記集積回路を特定する名称等の
表示をコード化して設けたことを特徴とする集積回路構
成物。1. An integrated circuit component in which an integrated circuit is packaged, characterized in that an indication such as a name for specifying the integrated circuit is provided in a coded manner on the surface of the component body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60037927A JPS61196556A (en) | 1985-02-26 | 1985-02-26 | Structure of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60037927A JPS61196556A (en) | 1985-02-26 | 1985-02-26 | Structure of integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61196556A true JPS61196556A (en) | 1986-08-30 |
Family
ID=12511184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60037927A Pending JPS61196556A (en) | 1985-02-26 | 1985-02-26 | Structure of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61196556A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011100707A (en) * | 2009-10-06 | 2011-05-19 | Ccs Inc | Light irradiation device |
-
1985
- 1985-02-26 JP JP60037927A patent/JPS61196556A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011100707A (en) * | 2009-10-06 | 2011-05-19 | Ccs Inc | Light irradiation device |
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