JPS6119644A - Linear, low-density polyethylene resin composition - Google Patents
Linear, low-density polyethylene resin compositionInfo
- Publication number
- JPS6119644A JPS6119644A JP13909884A JP13909884A JPS6119644A JP S6119644 A JPS6119644 A JP S6119644A JP 13909884 A JP13909884 A JP 13909884A JP 13909884 A JP13909884 A JP 13909884A JP S6119644 A JPS6119644 A JP S6119644A
- Authority
- JP
- Japan
- Prior art keywords
- acid amide
- density polyethylene
- resin composition
- silica gel
- linear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は線状低密度ポリエチレン樹脂組成物に関し、詳
しくは滑り、ブロッキング性あるいは二次加工時のしわ
の防止効果等の向上した線状低密度ポリエチレン樹脂組
成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a linear low-density polyethylene resin composition, and more particularly to a linear low-density polyethylene resin composition with improved slippage, blocking properties, and wrinkle prevention effect during secondary processing.
線状低密度ポリエチレンは優れた機械的特性。Linear low density polyethylene has excellent mechanical properties.
透明性、ヒートシール性等を有するため、包装資材、農
業用などのフィルムとしての使用が期待されている。Due to its transparency and heat-sealability, it is expected to be used as packaging materials and agricultural films.
しかしながら、線状低密度ポリエチレンをフィルムとし
て使用した場合、滑りが悪く、またブロッキング性も不
充分なものとなり、上記用途への適用が困難であった。However, when linear low-density polyethylene is used as a film, it has poor slippage and insufficient blocking properties, making it difficult to apply it to the above-mentioned uses.
そこで、本発明者らは線状低密度ポリエチレンが本来的
に有する良好な機械的特性、透明性、ヒートシール性を
損うことなく、滑り、ブロッキング性等を改良すべく鋭
意検討した結果、所定の脂肪酸アミドおよび/または所
定のシリカゲルとを所定量配合することにより、上記物
性を改善向上した線状低密度ポリエチレン樹脂組成物が
得られることを見い出し、゛この知見に基づいて本発明
を完成した。Therefore, the present inventors conducted extensive studies to improve the slippage, blocking properties, etc. of linear low-density polyethylene without impairing its inherent good mechanical properties, transparency, and heat sealability. We have discovered that a linear low-density polyethylene resin composition with improved physical properties can be obtained by blending a predetermined amount of a fatty acid amide and/or a predetermined silica gel, and based on this knowledge, we have completed the present invention. .
すなわち本発明はω線状低密度ポリエチレン(以下、(
a)成分という。)100重量部に(b)融点60〜1
20℃の脂肪酸アミドおよび/または平均粒子径1〜2
0μで、かつ細孔容積2.0 M1777以下のシリカ
ゲル(以下、(b)成分という。)0.1〜1.5重量
部を配合した線状低密度ポリエチレン樹脂組成物である
。That is, the present invention uses ω linear low density polyethylene (hereinafter, (
a) It is called a component. ) 100 parts by weight (b) melting point 60-1
Fatty acid amide at 20°C and/or average particle size 1-2
This is a linear low-density polyethylene resin composition containing 0.1 to 1.5 parts by weight of silica gel (hereinafter referred to as component (b)) having a diameter of 0 μm and a pore volume of 2.0 M1777 or less.
本発明の(a)成分である線状低密度ポリエチレンは本
発明の樹脂組成物のベースとなるものである。The linear low density polyethylene which is the component (a) of the present invention serves as the base of the resin composition of the present invention.
線状低密度ポリエチレンは、いわゆるLLDPEと称さ
れるもので、エチレンと少量(0,2〜20モル%程度
)の他のα−オレフィン、例えばプロピレン、ブテン−
1,ペンテンー1.ヘキセン−1゜4−メチルペンテン
−1,オクテン−1,デセン−1などを液相または気相
にて従来の高密度ポリエチレン(HDPFi)の製造の
際の条件と類似の条件下で共重合することにより製造さ
れるものである。この線状低密度ポリエチレンの密度は
通常0.910〜0.9609/、薗8程度のものであ
り、鎖中の炭素原子1000個中に1〜60個の短脂肪
族分鮭を含有するものである。Linear low density polyethylene is so-called LLDPE, and is composed of ethylene and a small amount (about 0.2 to 20 mol%) of other α-olefins, such as propylene and butene.
1, Penten-1. Hexene-1゜4-methylpentene-1, octene-1, decene-1, etc. are copolymerized in the liquid phase or gas phase under conditions similar to those used in the production of conventional high-density polyethylene (HDPFi). It is manufactured by The density of this linear low-density polyethylene is usually 0.910 to 0.9609/about 8, and contains 1 to 60 short aliphatic fractions per 1000 carbon atoms in the chain. It is.
次に(1−、)成分は、融点60〜120℃の脂肪酸ア
ミドおよび/または平均粒子径1〜20μで、かつ細孔
容積2.01d19以下のシリカゲルである。Next, the component (1-,) is a fatty acid amide having a melting point of 60 to 120°C and/or a silica gel having an average particle size of 1 to 20 μm and a pore volume of 2.01 d19 or less.
ここで、脂肪酸アミドとしては融点60〜120℃、好
ましくは70〜90℃の脂肪酸アミドであれば良く、他
に特に制限はない。ここで用いる脂肪酸アミドの融点が
60℃未満であると、得られる組成物のフィルムのヘイ
ズが上昇し、透明性を阻害し、また融点が120℃を超
−えるものであると、フィルムのブロッキング性が著し
く高(なるため、好ましくない。Here, the fatty acid amide may be any fatty acid amide having a melting point of 60 to 120°C, preferably 70 to 90°C, and is not particularly limited. If the melting point of the fatty acid amide used here is less than 60°C, the haze of the film of the resulting composition will increase and the transparency will be impaired, and if the melting point exceeds 120°C, blocking of the film will occur. This is not desirable because the
融点60〜120℃の脂肪酸アミドの具体例としては、
エルカ酸アミド、ステアリン酸アミド。Specific examples of fatty acid amides with a melting point of 60 to 120°C include:
Erucic acid amide, stearic acid amide.
オレイン酸アミド°、ベヘニン酸アミド、N−ステアリ
ン酪酸アミド、N−ステアリルカプリル酸アミド、N−
ステアリルラウリン酸アミド、N−ステアリルステアリ
ン酸、N−ステアリルベヘニン酸アミド、N−オレイル
オレイン酸アミド、N−ゞオレインベヘニン酸アミド、
N−ブチルエルカ酸アミド、N−オクチルエルカ酸アミ
ド、N−ラウリルエルカ酸アミドなどが挙げられる。Oleic acid amide °, Behenic acid amide, N-Stearic acid amide, N-Stearyl caprylic acid amide, N-
Stearyl lauric acid amide, N-stearyl stearic acid, N-stearyl behenic acid amide, N-oleyl oleic acid amide, N-oleic behenic acid amide,
Examples include N-butyl erucamide, N-octyl erucamide, and N-lauryl erucamide.
また、シリカゲルとしては平均粒子径が1〜20μ、好
ましくは3〜10μのものであり、かつ細孔容積が2.
0ゴ/g以下、好ましくは(L3〜1.7Ill/11
のものが用いられる。平均粒子径が1μ未満であると、
シリカゲルの分散性が不充分であり、20μを超えると
、ヘイズが上昇して透明性が阻害されるため、実用性が
乏しい。また、細孔容積が2.0 ml/f!を超える
ものを用いると、シリカゲルの分散性が低下するため好
ましくない。なお、細孔容積の値はBET法により測定
したものである。The silica gel has an average particle diameter of 1 to 20 μm, preferably 3 to 10 μm, and a pore volume of 2.0 μm.
0 Go/g or less, preferably (L3 to 1.7 Ill/11
are used. When the average particle diameter is less than 1μ,
The dispersibility of silica gel is insufficient, and if it exceeds 20μ, haze increases and transparency is impaired, resulting in poor practicality. Also, the pore volume is 2.0 ml/f! It is not preferable to use a substance exceeding 100% because the dispersibility of the silica gel decreases. Note that the value of pore volume was measured by the BET method.
本発明において(b)成分は上記脂肪酸アミドとシリカ
ゲルのいずれか一方あるいは両者を組み合せたものであ
れば良い。In the present invention, the component (b) may be any one of the above-mentioned fatty acid amide and silica gel, or a combination of both.
本発明のも)成分と(b)成分の配合割合は、(a)成
分100重量部に対して(b)成分を0.1〜1.5重
量部、好ましくは0.2〜0.8重量部とすべきである
。(b)成分の配合割合を0.1重量部未満とすると、
組成物のフィルムの滑り、アンチブロッキング性が不充
分となり、また1、5重量部を超えると、フィルムの透
明性、ヒートシール性が低下するため好ましくない。な
お、(b)成分として脂肪酸アミドおよびシリカゲルの
二成分を用いる場合、配合割合は前者:後者=1:3〜
3:1とすればよく、等量程度の使用が特に好適である
。The blending ratio of component) and component (b) in the present invention is 0.1 to 1.5 parts by weight, preferably 0.2 to 0.8 parts by weight of component (b) per 100 parts by weight of component (a). Should be parts by weight. (b) When the blending ratio of component is less than 0.1 part by weight,
The slip and anti-blocking properties of the film of the composition will be insufficient, and if it exceeds 1.5 parts by weight, the transparency and heat-sealing properties of the film will decrease, which is not preferable. In addition, when using two components of fatty acid amide and silica gel as component (b), the blending ratio is the former: the latter = 1:3 ~
The ratio may be 3:1, and it is particularly preferable to use approximately the same amount.
本発明の樹脂組成物は上記(a)および(b)成分より
なるものであるが、さらに必要によりステアリン酸カル
シウム、ステアリン酸亜鉛等の金属酸化物;帯電防止剤
;耐候剤1発泡剤;顔料等の他の添加剤を配合してもよ
い。The resin composition of the present invention consists of the above-mentioned components (a) and (b), and further contains metal oxides such as calcium stearate and zinc stearate; an antistatic agent; a weathering agent; a blowing agent; a pigment, etc. Other additives may also be blended.
本発明の樹脂組成物は上記各成分の所定量を配合し、乾
湿・融混併用法、多段溶融混合法、単純溶融混合法等に
より充分に混練することによって得ることができる。な
お、混線はバンバリーミキサ−、コニーダー、押出機、
二軸混練機等を用いて行なうことができる。The resin composition of the present invention can be obtained by blending predetermined amounts of each of the above-mentioned components and thoroughly kneading the mixture by a combined dry/wet/melt mixing method, a multistage melt mixing method, a simple melt mixing method, or the like. In addition, the crosstalk is Banbury mixer, co-kneader, extruder,
This can be carried out using a twin-screw kneader or the like.
このようにして得られる本発明の樹脂組成物は押出成形
、射出成形など各種成形法により適宜形状例えば、−フ
ィルムなどに成形して用いられる。The resin composition of the present invention thus obtained is used after being molded into an appropriate shape, such as a film, by various molding methods such as extrusion molding and injection molding.
本発明の樹脂組成物より成形されるフィルムは滑り、ブ
ロッキング性等に優れたものであり、また、透明性、ヒ
ートシール性1機械的物性等も良好である。さらに、フ
ィルム製造時の印刷、スリッター、製袋などの二次加工
の際に、しわの発生もほとんどなく生産性が高い。A film formed from the resin composition of the present invention has excellent sliding properties, blocking properties, etc., and also has good transparency, heat sealability, mechanical properties, etc. Furthermore, there is almost no wrinkles during secondary processing such as printing, slitting, and bag making during film production, resulting in high productivity.
このように、本発明の線状低密度ポリエチレン樹脂組成
物は種々の用途、特に包装袋などの包装用資材として、
あるいは農業用フィルム等として有効に使用され得る。As described above, the linear low-density polyethylene resin composition of the present invention has various uses, particularly as packaging materials such as packaging bags.
Alternatively, it can be effectively used as an agricultural film.
次に、本発明を実施例により詳しく説明する。Next, the present invention will be explained in detail with reference to examples.
実施例1〜7および比較例1〜7
第1表に示す各成分を所定量配合し、二軸混練機にて2
00℃で混練し、線状低密度ポリエチレン樹脂組成物を
得た。Examples 1 to 7 and Comparative Examples 1 to 7 Each component shown in Table 1 was blended in a predetermined amount, and mixed in a twin-screw kneader for 2 hours.
The mixture was kneaded at 00°C to obtain a linear low density polyethylene resin composition.
得られた樹脂組成物を押出機(50露φ)を用いて押出
温度190℃にてダイ(ダイ9フプ120mφ、リップ
クリアランス2.0m)から管状に押出し、厚み30μ
のフィルムを作製し、このものについてヘイズ、滑り、
ブロッキング性、ヒートシール強度を測定した。結果を
第1表に示す。The obtained resin composition was extruded into a tubular shape through a die (9 die 120 mφ, lip clearance 2.0 m) at an extrusion temperature of 190°C using an extruder (50 mm φ) to a thickness of 30 μm.
Make a film of this thing about haze, slippage,
Blocking property and heat seal strength were measured. The results are shown in Table 1.
なお、各測定は以下の方法によった。Note that each measurement was performed using the following method.
111ヘイズ
ASTM D 1003に準拠
(2)滑り
ASTM D 1894に準拠
(3)ブロッキング性
上下剥離法を適用し、フィルム表面に9に9の荷重を加
えて60℃の温度で3時間放置した後、ブロッキング測
定用チャックにセットして、オートグラフにより剥離(
引張速度200 X 1/10”π7分)されたときの
最大値を測定
(4)ヒートシール強度
4x20cmの試験片をI X 2.5cmFのヒート
シール幅をヒートシール条件2kg/cm”で圧着、1
秒間シールした後、30分放置した。その後、引張強度
(g/2.5確)を測定
* l : P E−1”’密度0.9209/crn
3、共重合物オクテン−1、分岐数14の線状低密度ポ
リエチレン
:PE−2−・−密度帆935g/儂3、共重合物ヘキ
セン−1、分岐数6の線状低密度ポリ
エチレン
*2:ム−1・・・融点79〜83℃のエルカ酸アミト
ム−2−・・融点72〜77℃のオレイン酸アミドA−
3・・・融点100〜105℃のステアリン酸アミド
A−4・@点140℃以上のエチレンビスステアリン酸
アミド
*3:B−1・・・平均粒子径4.0μ、細孔容積0,
44ゴ/g
B−2・・・平均粒子径3.5μ、細孔容積0.44ゴ
/9111 Haze Compliant with ASTM D 1003 (2) Sliding Compliant with ASTM D 1894 (3) Blocking property After applying the top and bottom peeling method and applying a load of 9 to 9 on the film surface and leaving it at a temperature of 60 ° C for 3 hours, Place it in the blocking measurement chuck and peel it off using an autograph (
Measure the maximum value when the tensile speed is 200 x 1/10" 7 minutes) (4) Heat seal strength 4 x 20 cm test piece is crimped with heat seal width of I x 2.5 cm F under heat seal condition 2 kg/cm", 1
After sealing for seconds, it was left for 30 minutes. Then, measure the tensile strength (g/2.5cm) *l: P E-1'' Density 0.9209/crn
3. Copolymer octene-1, linear low-density polyethylene with 14 branches: PE-2--density 935g/me 3, copolymer hexene-1, linear low-density polyethylene with 6 branches *2 : Mu-1... Erucic acid amide A with a melting point of 79-83°C -2-... Oleic acid amide A- with a melting point of 72-77°C
3... Stearic acid amide with a melting point of 100 to 105°C A-4 @ Ethylene bisstearic acid amide with a point of 140°C or higher *3: B-1... Average particle diameter 4.0 μ, pore volume 0,
44 go/g B-2...Average particle size 3.5μ, pore volume 0.44 go/9
Claims (3)
〜120℃の脂肪酸アミドおよび/または平均粒子径1
〜20μで、かつ細孔容積2.0ml/g以下のシリカ
ゲル0.1〜1.5重量部を配合した線状低密度ポリエ
チレン樹脂組成物。(1) Melting point 60 in 100 parts by weight of linear low density polyethylene
~120°C fatty acid amide and/or average particle size 1
A linear low-density polyethylene resin composition containing 0.1 to 1.5 parts by weight of silica gel having a pore volume of ~20 μ and a pore volume of 2.0 ml/g or less.
ド、ステアリン酸アミド、ベヘニン酸アミドまたはこれ
らの誘導体である特許請求の範囲第1項記載の樹脂組成
物。(2) The resin composition according to claim 1, wherein the fatty acid amide is erucic acid amide, oleic acid amide, stearic acid amide, behenic acid amide, or a derivative thereof.
細孔容積が0.3〜1.7ml/gのものである特許請
求の範囲第1項記載の樹脂組成物。(3) The resin composition according to claim 1, wherein the silica gel has an average particle diameter of 3 to 10 μm and a pore volume of 0.3 to 1.7 ml/g.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13909884A JPS6119644A (en) | 1984-07-06 | 1984-07-06 | Linear, low-density polyethylene resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13909884A JPS6119644A (en) | 1984-07-06 | 1984-07-06 | Linear, low-density polyethylene resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6119644A true JPS6119644A (en) | 1986-01-28 |
Family
ID=15237441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13909884A Pending JPS6119644A (en) | 1984-07-06 | 1984-07-06 | Linear, low-density polyethylene resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6119644A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61214254A (en) * | 1985-03-20 | 1986-09-24 | Hitachi Ltd | Photomagnetic recording material |
JPS636038A (en) * | 1986-06-26 | 1988-01-12 | Idemitsu Petrochem Co Ltd | Polyethylene resin composition |
EP0398714A2 (en) * | 1989-05-18 | 1990-11-22 | Mitsubishi Chemical Corporation | Read-only optical disk |
JPH04220443A (en) * | 1990-12-21 | 1992-08-11 | Sumitomo Chem Co Ltd | Polyolefin resin composition for film |
JP2002020556A (en) * | 2000-07-06 | 2002-01-23 | Japan Polychem Corp | Polyethylene-based resin composition for film and film by forming the same |
-
1984
- 1984-07-06 JP JP13909884A patent/JPS6119644A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61214254A (en) * | 1985-03-20 | 1986-09-24 | Hitachi Ltd | Photomagnetic recording material |
JPS636038A (en) * | 1986-06-26 | 1988-01-12 | Idemitsu Petrochem Co Ltd | Polyethylene resin composition |
EP0398714A2 (en) * | 1989-05-18 | 1990-11-22 | Mitsubishi Chemical Corporation | Read-only optical disk |
JPH04220443A (en) * | 1990-12-21 | 1992-08-11 | Sumitomo Chem Co Ltd | Polyolefin resin composition for film |
JP2002020556A (en) * | 2000-07-06 | 2002-01-23 | Japan Polychem Corp | Polyethylene-based resin composition for film and film by forming the same |
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