JPS61196219U - - Google Patents
Info
- Publication number
- JPS61196219U JPS61196219U JP7586285U JP7586285U JPS61196219U JP S61196219 U JPS61196219 U JP S61196219U JP 7586285 U JP7586285 U JP 7586285U JP 7586285 U JP7586285 U JP 7586285U JP S61196219 U JPS61196219 U JP S61196219U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- semiconductor chip
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586285U JPS61196219U (pt) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586285U JPS61196219U (pt) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196219U true JPS61196219U (pt) | 1986-12-06 |
Family
ID=30617476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7586285U Pending JPS61196219U (pt) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196219U (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011082471A (ja) * | 2009-10-12 | 2011-04-21 | Samsung Electro-Mechanics Co Ltd | 電子部品内装型プリント基板及びその製造方法 |
-
1985
- 1985-05-22 JP JP7586285U patent/JPS61196219U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011082471A (ja) * | 2009-10-12 | 2011-04-21 | Samsung Electro-Mechanics Co Ltd | 電子部品内装型プリント基板及びその製造方法 |