JPS61195629U - - Google Patents
Info
- Publication number
- JPS61195629U JPS61195629U JP7881585U JP7881585U JPS61195629U JP S61195629 U JPS61195629 U JP S61195629U JP 7881585 U JP7881585 U JP 7881585U JP 7881585 U JP7881585 U JP 7881585U JP S61195629 U JPS61195629 U JP S61195629U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrode lead
- wave device
- barrier portion
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案に係る表面波デバイスの平面図
、第２図は第１図Ａ１―Ａ１線上における断面図
、第３図は従来の表面波デバイスの斜視図である
。
１……基板、２，３……すだれ状電極、４〜７
……電極引出部、８〜１１……リード端子、１４
，１５……障壁部。
FIG. 1 is a plan view of a surface wave device according to the present invention, FIG. 2 is a sectional view taken along line A 1 -A 1 in FIG. 1, and FIG. 3 is a perspective view of a conventional surface wave device. 1... Substrate, 2, 3... Interdigital electrode, 4-7
... Electrode extraction part, 8 to 11 ... Lead terminal, 14
, 15... Barrier section.
Claims (1)
出力側すだれ状電極を間隔をおいて配置すると共
に、一面側の同一辺寄りに前記入力側すだれ状電
極に導通する一対の電極引出部及び前記出力側す
だれ状電極に導通する一対の電極引出部を形成し
、前記電極引出部にリード端子を半田付け固定し
た表面派デバイスにおいて、前記一対の電極引出
部の間に、電極引出部相互間の半田ブリツジを阻
止する絶縁物でなる障壁部を付着形成したことを
特徴とする表面波デバイス。 (2) 前記障壁部は、シリコーン樹脂でなること
を特徴とする実用新案登録請求の範囲第１項に記
載の表面波デバイス。 (3) 前記障壁部は、ガラス質の絶縁物でなるこ
とを特徴とする実用新案登録請求の範囲第１項に
記載の表面波デバイス。[Claims for Utility Model Registration] (1) An input-side interdigital electrode and an output-side interdigital electrode are arranged at intervals on one surface of a substrate, and the input-side interdigital electrode is arranged near the same side of the one surface. In a surface type device, a pair of electrode lead-out parts are formed in which a pair of electrode lead-out parts are electrically connected to the output-side interdigital interdigital electrode, and a lead terminal is fixed to the electrode lead-out parts by soldering. A surface wave device characterized in that a barrier portion made of an insulating material is deposited between the electrode lead-out portions to prevent solder bridging between the electrode lead-out portions. (2) The surface wave device according to claim 1, wherein the barrier portion is made of silicone resin. (3) The surface wave device according to claim 1, wherein the barrier portion is made of a glassy insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7881585U JPS61195629U (en) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7881585U JPS61195629U (en) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195629U true JPS61195629U (en) | 1986-12-05 |
Family
ID=30623144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7881585U Pending JPS61195629U (en) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195629U (en) |
-
1985
- 1985-05-27 JP JP7881585U patent/JPS61195629U/ja active Pending
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