JPS61195056U - - Google Patents

Info

Publication number
JPS61195056U
JPS61195056U JP7820485U JP7820485U JPS61195056U JP S61195056 U JPS61195056 U JP S61195056U JP 7820485 U JP7820485 U JP 7820485U JP 7820485 U JP7820485 U JP 7820485U JP S61195056 U JPS61195056 U JP S61195056U
Authority
JP
Japan
Prior art keywords
terminal parts
pin
mounting
semiconductor chip
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7820485U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7820485U priority Critical patent/JPS61195056U/ja
Publication of JPS61195056U publication Critical patent/JPS61195056U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP7820485U 1985-05-25 1985-05-25 Pending JPS61195056U (US06623731-20030923-C00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7820485U JPS61195056U (US06623731-20030923-C00012.png) 1985-05-25 1985-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7820485U JPS61195056U (US06623731-20030923-C00012.png) 1985-05-25 1985-05-25

Publications (1)

Publication Number Publication Date
JPS61195056U true JPS61195056U (US06623731-20030923-C00012.png) 1986-12-04

Family

ID=30621974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7820485U Pending JPS61195056U (US06623731-20030923-C00012.png) 1985-05-25 1985-05-25

Country Status (1)

Country Link
JP (1) JPS61195056U (US06623731-20030923-C00012.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139976A (en) * 1977-05-13 1978-12-06 Seiko Epson Corp Packaging method of semiconductor chips
JPS601838A (ja) * 1983-06-17 1985-01-08 Matsushita Electric Ind Co Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139976A (en) * 1977-05-13 1978-12-06 Seiko Epson Corp Packaging method of semiconductor chips
JPS601838A (ja) * 1983-06-17 1985-01-08 Matsushita Electric Ind Co Ltd 半導体装置

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