JPS61193797A - Laser beam processing device - Google Patents

Laser beam processing device

Info

Publication number
JPS61193797A
JPS61193797A JP60032920A JP3292085A JPS61193797A JP S61193797 A JPS61193797 A JP S61193797A JP 60032920 A JP60032920 A JP 60032920A JP 3292085 A JP3292085 A JP 3292085A JP S61193797 A JPS61193797 A JP S61193797A
Authority
JP
Japan
Prior art keywords
laser
beams
laser beam
prism
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60032920A
Other languages
Japanese (ja)
Inventor
Akihiko Niimi
新見 明彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60032920A priority Critical patent/JPS61193797A/en
Publication of JPS61193797A publication Critical patent/JPS61193797A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To make possible the processing of a large area by irradiating adjacently the beams outputted from plural pieces of laser generating sources on a work by using a prim or reflection mirror, etc. CONSTITUTION:The laser beam 5, 6 outputted from two pieces of the laser generating sources are made incident to the slopes of the prism 7 from different routes and are vertically refracted downward by the prism 7, by which the beams are passed through the prism 7. The two beams 5, 6 have consequently one large irradiation pattern 8, 9 by contacting with each other. The energy density of the laser beam having a rectangular section is decreased at the end part. The laser beams are so disposed as to intersect the hypotenuse of a trapezoidal shape in the case of disposing such beams side. The processing to a large area is thus made possible even if a laser generating source of a high output is not used.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ加工装置の改良に関するものである。[Detailed description of the invention] [Industrial application field] The present invention relates to improvements in laser processing equipment.

〔従来の技術〕[Conventional technology]

レーザ光を利用して被加工物に刻印(マーキング)を行
なうためには、従来第4図に示すような方法を用いてい
る。すなわち刻印する形状を切り抜いたマスク(2)に
、正方形または矩形断面を有するレーザビーム(1)を
照射すると、該レーザビームはマスク(2)の切り抜か
れた文字や記号の部分を通過してその下の被加工物(3
)に照射されるので、該レーザビームの熱作用によって
、被加工物(3)の表面にマスク(2)と同様のパター
ンが刻印されるのである。このとき刻印される文字や記
号の大きさは、マスク(2)のそれと同じ場合もあり、
また別の光学部品を用いて縮少あるいは拡大することも
ある。
In order to mark a workpiece using a laser beam, a method as shown in FIG. 4 has conventionally been used. In other words, when a laser beam (1) having a square or rectangular cross section is irradiated onto a mask (2) cut out in the shape to be engraved, the laser beam passes through the cut out part of the mask (2) containing the characters or symbols. Lower workpiece (3
), a pattern similar to that of the mask (2) is imprinted on the surface of the workpiece (3) by the thermal action of the laser beam. The size of the characters and symbols engraved at this time may be the same as that of mask (2),
It may also be reduced or enlarged using another optical component.

さらに該装置に使用されるレーザビーム(1)は、通常
パルスビームであって、1パルスの照射によって被加工
物1個が刻印されることが多い。
Further, the laser beam (1) used in the apparatus is usually a pulsed beam, and one workpiece is often engraved by one pulse of irradiation.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで従来のレーザ加工装置は、上述のように構成さ
れているので、より大きな刻印を行なう場合は、ビーム
を拡大する必要があり、その結果被加工物に到達するビ
ームのエネルギー密度は小さくなる。従って大きな刻印
を行なう場合には、高出力のレーザ発生源を必要とする
のが、この種のレーザ加工装置の一つの問題点であった
By the way, since the conventional laser processing apparatus is configured as described above, when making a larger marking, it is necessary to expand the beam, and as a result, the energy density of the beam reaching the workpiece becomes smaller. Therefore, one problem with this type of laser processing apparatus is that a high-output laser source is required when making a large engraving.

本発明はこの問題点を解消するためになされたもので、
高出力のレーザ発生源を用いないで、面積の大きい刻印
その他の加工が可能な、レーザ加工装置を提供しようと
するものである。
The present invention was made to solve this problem.
It is an object of the present invention to provide a laser processing device that is capable of engraving large areas and other processing without using a high-power laser source.

〔問題点を解決するための手段〕[Means for solving problems]

レーザ加工袋[において、複数個のレーザ発生源を使用
して、正方形または矩形の断面をもつレーザビームを発
生させ、該複数個のレーザビームを相接して被加工物に
照射する。
In the laser processing bag, a plurality of laser sources are used to generate laser beams having a square or rectangular cross section, and the plurality of laser beams are irradiated onto the workpiece in contact with each other.

〔作 用〕[For production]

複数個のレーザビームを、同時に相接して被加工物にパ
ルス状または連続的に照射するので、夫々レーザビーム
の出力が小さくても、大きい面積の加工が可能となる。
Since a plurality of laser beams are simultaneously irradiated onto the workpiece in a pulsed or continuous manner, it is possible to process a large area even if the output of each laser beam is small.

〔発明の実施例〕[Embodiments of the invention]

第1図は本発明の一実施例を示す斜視図、第2図はその
一面図である。図中(3)は被加工物、(5)、(6)
は2個のレーザ発生源より出力した2個の正方形または
矩形の断面をもつレーザビーム、(7)はプリズム、(
8)はレーザビーム(5)による照射パターン(9)は
レーザビーム(6)によるそれである。
FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a side view thereof. In the figure, (3) is the workpiece, (5), (6)
are two laser beams with square or rectangular cross sections output from two laser sources, (7) is a prism, (
In 8), the irradiation pattern (9) by the laser beam (5) is that by the laser beam (6).

図において2個のレーザ発生源より出力されたレーザビ
ーム(5)、+6>は、異なった径路によりプリズム(
1)の斜面に入射し、プリズム(7)によって垂直下方
に屈折してプリズム(7)を出る。このため2個のレー
ザビーム(5)、(6)は相接して1個の大きい照射パ
ターンf8)、(9)を有することになり被加工物(3
)に対し2倍の照射面積を得ることとなる。前記2個の
レーザ発生源の夫々の出力が製作可能な最大のものであ
る場合、同一エネルギー密度を用いて2倍の面積の加工
を行なう場合は、2倍の出力を有するレーザ発生源を新
しく開発する必要があったが、本発明は従来のレーザビ
ームを2個並列に並べて同時に照射することにより、上
記大出力レーザ発生源開発の必要性を消失せしめたもの
である。
In the figure, laser beams (5), +6> output from two laser sources pass through a prism (
1), is refracted vertically downward by the prism (7), and exits the prism (7). Therefore, the two laser beams (5) and (6) have one large irradiation pattern f8) and (9) adjacent to each other, and the workpiece (3) has one large irradiation pattern f8) and (9).
), the irradiation area is twice as large as that of If the output of each of the two laser sources is the maximum that can be manufactured, and when processing twice the area using the same energy density, a new laser source with twice the output is required. However, the present invention eliminates the need to develop a high-output laser source by irradiating two conventional laser beams in parallel.

第3図は上記実施例を更に改良した他の実施例を示すも
のである。従来の矩形断面をもつレーザビームのエネル
ギー密度は、(a)に示すように端部では減少し、台形
に近いエネルギー密度分布となる。このレーザビームを
2個並べる際、台形の斜辺を途中で交わるように配置す
ることにより、第6図(b)に示すように、全体に平均
したエネルギー密度が得られるのである。
FIG. 3 shows another embodiment which is a further improvement of the above embodiment. The energy density of a conventional laser beam with a rectangular cross section decreases at the ends, as shown in (a), resulting in an energy density distribution close to a trapezoid. By arranging the two laser beams so that the hypotenuses of the trapezoid intersect in the middle, an average energy density can be obtained over the entire beam, as shown in FIG. 6(b).

また上記実施例は、レーザビーム2個の例であるが、6
個以上であってもよい。
Furthermore, although the above embodiment is an example of two laser beams, six laser beams are used.
It may be more than one.

さらに上記例は刻印を目的とする加工装置の例であるが
、露光、エツチング、CvDなどの光化学反応で広い面
積を同時に加工する場合すべてに有効である。
Further, although the above example is an example of a processing apparatus for the purpose of marking, it is effective in all cases where a wide area is simultaneously processed by photochemical reactions such as exposure, etching, and CvD.

〔発明の効果〕〔Effect of the invention〕

本発明はレーザ加工装置において、複数個のレーザ発生
源から出力した複数個の正方形または矩形断面のレーザ
ビームを相接して被加工物に照射するように構成しての
で、高出力のレーザ発生源を用いなくても面積の大きい
加工を可能ならしめるという優れた効果を上げることと
なった。
The present invention is a laser processing apparatus that is configured to irradiate a workpiece with a plurality of square or rectangular cross-section laser beams output from a plurality of laser sources, so that a high-power laser is generated. This resulted in the excellent effect of making it possible to process large areas without using a source.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す斜視図、第2図はその
側面図、第6図は2個のレーザビームの端部と重ね、合
成したビームのエネルギー密度を一定にさせる方法の説
明図、第4図は従来装置による刻印加工の説明図である
。 図中(3)は被加工物、(5) 、 (6)はレーザビ
ーム、(力はプリズム、(8) 、 (9)は被加工物
への照射パターンである。 なお各図中、同一符号は同−又は相当部分を示す。 代理人 弁理士  木 村 三 朗 第2図 第3図 (Q)       (b) 第4図 丁 続 hli  正 書 (自発) 昭和60イト9月24日 持1.’l’ I−’+長官)股 1、−111′1の表示   特願昭 60−3292
0号2、発明の名称 レーザ加工装置 3、?+li止をする者 ゎqrogs。 /   1 6゜補正の内容 (1)明細書の「特許請求の範囲」を別紙のとおり補正
する。 (2)明細書第5頁第7行の「得られるのである。」の
後に次のものを加入する。 「第1図、第2図ではプリズムを用いた例を示したが、
代わりに反射鏡やレンズを用いてもよい。」以   上 特許請求の範囲 (補正) [(1)正方形または矩形の断面形状を有するレーザビ
ームを被加工物に照射するレーザ加工装置において、複
数個のレーザ発生源と、該発生源より出力されたレーザ
ビームを相接して被加工物に照射せしめるプリズムまた
は反射鏡またはレンズを備えたことを特徴とするレーザ
加工装置。 (2)上記複数個のレーザ発生源より出力された正方形
または矩形の断面形状を有するレーザビームを、互いに
一部分が重なるように照射せしめる乙とを特徴とする特
許請求の範囲第1項レーザ加工装置。」
Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a side view thereof, and Fig. 6 shows a method of overlapping the ends of two laser beams to make the energy density of the combined beam constant. An explanatory diagram, FIG. 4, is an explanatory diagram of stamping processing using a conventional device. In the figure, (3) is the workpiece, (5) and (6) are the laser beams (the force is the prism, and (8) and (9) are the irradiation patterns on the workpiece. Symbols indicate the same or equivalent parts. Agent Patent Attorney Sanro Kimura Figure 2 Figure 3 (Q) (b) Figure 4 Continued hli Author (self-proposal) September 24, 1985, 1 .'l'I-'+Director) crotch 1, -111'1 indication Patent application Sho 60-3292
No. 0 2, Name of invention Laser processing device 3, ? Those who stop +li ゎqrogs. / 1 6゜Contents of amendment (1) The "Claims" of the specification will be amended as shown in the attached sheet. (2) The following is added after "obtained." on page 5, line 7 of the specification. "Figures 1 and 2 show examples using prisms, but
A reflective mirror or lens may be used instead. Claims (Amendment) [(1) A laser processing device that irradiates a workpiece with a laser beam having a square or rectangular cross-sectional shape, including a plurality of laser generation sources and a laser beam outputted from the generation sources. What is claimed is: 1. A laser processing device comprising a prism, a reflecting mirror, or a lens for irradiating a workpiece with a laser beam that contacts the workpiece. (2) A laser processing apparatus as claimed in claim 1, characterized in that (B) irradiates laser beams having a square or rectangular cross-sectional shape outputted from the plurality of laser sources so as to partially overlap each other. . ”

Claims (2)

【特許請求の範囲】[Claims] (1)正方形または矩形の断面形状を有するレーザビー
ムを被加工物に照射するレーザ加工装置において、複数
個のレーザ発生源と、該発生源より出力されたレーザビ
ームを相接して被加工物に照射せしめるプリズムとを備
えたことを特徴とするレーザ加工装置。
(1) In a laser processing device that irradiates a workpiece with a laser beam having a square or rectangular cross-sectional shape, the workpiece is A laser processing device characterized by comprising: a prism that irradiates the laser beam.
(2)上記複数個のレーザ発生源より出力された正方形
または矩形の断面形状を有するレーザビームを、互いに
一部分が重なるように照射せしめることを特徴とする特
許請求の範囲第1項記載のレーザ加工装置。
(2) Laser processing according to claim 1, characterized in that the laser beams having a square or rectangular cross-sectional shape output from the plurality of laser sources are irradiated so as to partially overlap with each other. Device.
JP60032920A 1985-02-22 1985-02-22 Laser beam processing device Pending JPS61193797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60032920A JPS61193797A (en) 1985-02-22 1985-02-22 Laser beam processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60032920A JPS61193797A (en) 1985-02-22 1985-02-22 Laser beam processing device

Publications (1)

Publication Number Publication Date
JPS61193797A true JPS61193797A (en) 1986-08-28

Family

ID=12372333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60032920A Pending JPS61193797A (en) 1985-02-22 1985-02-22 Laser beam processing device

Country Status (1)

Country Link
JP (1) JPS61193797A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014151346A (en) * 2013-02-08 2014-08-25 Nidec Copal Corp Laser marker

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014151346A (en) * 2013-02-08 2014-08-25 Nidec Copal Corp Laser marker

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