JPS61192483U - - Google Patents
Info
- Publication number
- JPS61192483U JPS61192483U JP7613985U JP7613985U JPS61192483U JP S61192483 U JPS61192483 U JP S61192483U JP 7613985 U JP7613985 U JP 7613985U JP 7613985 U JP7613985 U JP 7613985U JP S61192483 U JPS61192483 U JP S61192483U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- multilayer printed
- pad surface
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7613985U JPS61192483U (is) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7613985U JPS61192483U (is) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192483U true JPS61192483U (is) | 1986-11-29 |
Family
ID=30618006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7613985U Pending JPS61192483U (is) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192483U (is) |
-
1985
- 1985-05-22 JP JP7613985U patent/JPS61192483U/ja active Pending