JPS61192472A - Globe machining device - Google Patents

Globe machining device

Info

Publication number
JPS61192472A
JPS61192472A JP60030280A JP3028085A JPS61192472A JP S61192472 A JPS61192472 A JP S61192472A JP 60030280 A JP60030280 A JP 60030280A JP 3028085 A JP3028085 A JP 3028085A JP S61192472 A JPS61192472 A JP S61192472A
Authority
JP
Japan
Prior art keywords
lapping
globe
shaped groove
lap
sphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60030280A
Other languages
Japanese (ja)
Inventor
Takashi Miyatani
孝 宮谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60030280A priority Critical patent/JPS61192472A/en
Publication of JPS61192472A publication Critical patent/JPS61192472A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable globe to be machined in high precision for a long period by engraving a V-shaped groove on the surface of a lower lap eccentrically against rotary axis, thereby suppressing abrasion of an upper lap. CONSTITUTION:While lapping powder being fed in the position of a globe 7, upper and lower laps 5, 6 are, respectively, rotated in the direction 10, 11, a V-shaped groove circle 13 on the lower lap 6 is rotated eccentrically against rotary axis line 14. Each of the globes is supported by three points, i.e. the lapping surface 12 of the upper lap 5, and both side walls of the V-shaped groove 13 and moves round by turning. However, since lapping speeds at these three points differ from each other, slipping motion takes place between the globe 7 surface and the upper and lower laps 5, 6, the globe 7 moves along the V-shaped groove 13. The whole surface of the globe 7 is uniformly lap- finished, its specified sphericality is attained, and moreover, abrasive progress of lapping surface 12 is suppressed.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、例えばセラミックスからなる球体の加工に好
適する球体加工装置に関するっ〔発明の技術的背景とそ
の問題点3 球体は各種装置の構成要素として、広く各技術分野に応
用されており、特に、セラミックスからなる球体は、そ
の耐食、#熱、耐摩耗性などを生かした特殊用途への適
用が注目されている。一般に、球体はセラミックスであ
るとないとにかかわらず、真球度のよい所定直径のもの
が要求されるため、それに適応した加工装置を必要とす
る。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a sphere machining device suitable for machining spheres made of ceramics, for example. As such, they are widely applied in various technical fields, and in particular, ceramic spheres are attracting attention for their application to special uses that take advantage of their corrosion resistance, heat resistance, wear resistance, etc. In general, regardless of whether the sphere is made of ceramic or not, it is required to have a certain diameter with good sphericity, so a processing device suitable for this is required.

第3図はその一例であって、鋼製円板状の下ラップ板(
1)に対して、鋼製円板状の上ラップ盤(2)を同軸に
対向させ、これら下ラップ盤(1)と上ラップ盤(21
間に球体被加工物(■を支持する保持板(3)を配置し
たものである。球体被加工物(8)は保持板(3)の同
一円周上に形成された支持部に複数個支持されて、下ラ
ップ盤(1)のV形環状溝(1a)に嵌合し、ラップ盤
(1) 、 (2)の回転と、この上ラップ盤(2)を
介して加えられる加圧力とによって、環状溝(1a)中
を転動し、この間に、外部よりラップ剤が供給されて加
工される。
Figure 3 is an example of this, showing a lower lap plate made of steel disc (
1), a steel disc-shaped upper lapping machine (2) is coaxially opposed to the lower lapping machine (1) and the upper lapping machine (21).
A holding plate (3) that supports a spherical workpiece (■) is placed between them. A plurality of spherical workpieces (8) are mounted on the support part formed on the same circumference of the holding plate (3). It is supported and fitted into the V-shaped annular groove (1a) of the lower lapping machine (1), and the pressure applied through the rotation of the lapping machines (1) and (2) and the upper lapping machine (2) The material rolls in the annular groove (1a), and during this time, a lapping agent is supplied from the outside and processed.

しかし、この加工装置は上ラップ盤(2)を介して加え
られる加圧、ラップ剤の供給量、その供給間隔などがラ
ップ量に微妙に影響するばかりでなくV形環状溝(1a
)は、ラップ盤(11、(2)の回転軸線(6)と同軸
に設定されているので、摩耗によシ上ラップ盤(2)に
摩耗溝(4)が形成されることも加わって・適正な加工
を高能率でおこなうことがすこぶる困難である欠点をも
っている。のみならず、製品歩留についても問題があり
、改良を必要としている。
However, in this processing device, not only the pressure applied via the upper lapping machine (2), the amount of lapping agent supplied, and the interval between the lapping agents subtly affect the amount of lapping, but also the V-shaped annular groove (1a
) is set coaxially with the rotation axis (6) of the lapping machine (11, (2)), so a wear groove (4) is formed on the lapping machine (2) due to wear. - It has the disadvantage that it is very difficult to perform proper processing with high efficiency.It also has problems with product yield, and requires improvement.

〔発明の目的〕[Purpose of the invention]

この発明は上記事情を参酌してなされたもので複数の球
体を高精度に加工する球体加工装置を得ることにある。
The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a sphere machining device that can process a plurality of spheres with high precision.

〔発明の概要〕[Summary of the invention]

下ラップ盤に円環をなすV字状溝をその回転軸線に対し
て偏心して刻設したものである。
A V-shaped groove forming an annular ring is carved eccentrically with respect to the rotation axis of the lower lapping plate.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を図面を参照して詳述する。 Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

第1図及び第2図はこの実施例の球体加工装置を示して
いる。この装置は例えば鋼製の円板状上ラップ盤(5)
と、この上ラップ盤(5)下面に対して同軸に対向する
ように配設された例えば鋼製の下ラップ盤(6)と、こ
れら上、下ラップ盤(5) 、 (6)間に介装され真
球にまでラップ仕上げされる例えば5iaN4(窒化珪
素)などのセラミックス製球体(力・・・を等間隔で転
勤自在に保持する保持板(8)と、下ラップ盤(6)Ω
下面に同軸に連結された回転軸(6a)を矢印α1方向
に回転駆動する第1の回転駆動機構(図示せず)と、上
ラップ盤(5)の上面ば同軸に連結された回転軸(5a
)を矢印αD力方向回転駆動する第2の・回転駆動機構
(図示せず)と、下ラップ盤(6)を上ラップ盤(5)
に対して所定の圧力で加圧する加圧機構(図示せず)と
、加工部位にダイヤモンドパウダなどのラップ剤を供給
するラップ剤供給機構(図示せず)とからなっている。
FIGS. 1 and 2 show the sphere processing apparatus of this embodiment. This device is, for example, a steel disc-shaped upper lapping machine (5).
and a lower lapping machine (6) made of steel, for example, disposed coaxially opposite to the lower surface of the upper lapping machine (5), and between these upper and lower lapping machines (5) and (6). A holding plate (8) that removably holds a ceramic sphere (force...) such as 5iaN4 (silicon nitride) that is interposed and lapped to a true sphere, and a lower lapping plate (6) Ω.
A first rotary drive mechanism (not shown) that rotationally drives a rotary shaft (6a) coaxially connected to the lower surface in the direction of arrow α1, and a rotary shaft (6a) coaxially connected to the upper surface of the upper lapping machine (5). 5a
) is rotated in the arrow αD force direction (not shown), and the lower lapping machine (6) is rotated by the upper lapping machine (5).
It consists of a pressure mechanism (not shown) that applies a predetermined pressure to the machined area, and a lapping agent supply mechanism (not shown) that supplies a lapping agent such as diamond powder to the processing area.

しかして、上ラップ盤(5)の下面は、平面をなすラッ
プ面α2となっている。他方、このラップ面a4に平行
に対向する下ラップ盤(6)の上面には円環をなすV字
状溝α謙が刻設されている。この7字状溝0は横断面が
7字をなしている。また、このV字状溝α謙の中心は、
上、下ラップ盤(5) 、 (61の回転軸線αaに対
して偏心量ΔBだけ偏心して設けられている。
Thus, the lower surface of the upper lapping machine (5) is a flat lapping surface α2. On the other hand, on the upper surface of the lower lapping plate (6) facing parallel to the lapping surface a4, a V-shaped groove α-shaped having a circular ring is carved. This 7-shaped groove 0 has a 7-shaped cross section. Also, the center of this V-shaped groove αken is
The upper and lower lapping machines (5) and (61) are provided eccentrically by an eccentric amount ΔB with respect to the rotational axis αa of the lapping machines (61).

しかして、上記構成の球体加工装置において、保持板(
8)によシ球体(7)・・・を゛V字状溝α■の一定位
置に配置する。ついで、加圧機構KJ:、9上ラップ盤
(5)を矢印α四方向に下降させ、球体(7)・・・を
上、下ラップ盤(5) 、 (61により挟圧する。つ
いで球体(力・・・部位にラップ剤を供給しながら、上
、下ラップ盤(5)。
However, in the sphere processing apparatus having the above configuration, the holding plate (
8) Place the sphere (7)... at a certain position in the V-shaped groove α■. Next, the pressure mechanism KJ:, 9 upper lapping machine (5) is lowered in the four directions of the arrow α, and the sphere (7)... is compressed by the upper and lower lapping machines (5), (61). Power: Upper and lower lapping machines (5) while supplying lapping agent to the area.

(6)をそれぞれ矢印αG 、 (1i1方向に回転さ
せる。これにより、V字状溝α漕は回転軸線(L4)に
対して偏心して回転する。このとき、球体(力・・・は
、上ラップ盤(5)のラップ面(Iりの帯状領域を均一
に転動する。
(6) are rotated in the directions of arrows αG and (1i1), respectively. As a result, the V-shaped groove α rotates eccentrically with respect to the rotation axis (L4). At this time, the sphere (force... It rolls uniformly on the lapping surface (I) of the lapping machine (5).

かくして、各球体(力・・・はそれぞれラップ面(13
と7字状溝0の両側壁面との3点にて支持されながら転
動する。しかし、上記3点におけるラップ速度が違って
くるために、球体(7)・・・表面と、上、下ラップ盤
(5) 、 (6)との間には滑り運動を生じてラップ
仕上げが行われる。また同時に、球体(7)・・・は。
Thus, each sphere (force...) has a wrap surface (13
It rolls while being supported at three points: and the both side wall surfaces of the 7-shaped groove 0. However, since the lapping speeds at the three points above are different, sliding motion occurs between the surface of the sphere (7) and the upper and lower lapping machines (5) and (6), resulting in poor lapping. It will be done. At the same time, the sphere (7)... is...

V字状溝u3の中で回転軸が移動する。よって、球体(
力・・・は、全面が一様にラップ仕上げされ所望の真球
度を得ることができるっさらに、上記球体(力・・・は
、ラップ面α2の帯状領域を均一に転動するので、ラッ
プ面α2の摩耗の進行が抑制され、ラップ面α2は一定
の平面度を長期間にわたって維持することができるので
、球体(力・・・の加工精度を一定レベルに維持するこ
とができる。
The rotating shaft moves within the V-shaped groove u3. Therefore, the sphere (
The force... can uniformly lap the entire surface and obtain the desired sphericity.Furthermore, the above-mentioned sphere (force...) rolls uniformly on the band-shaped area of the lap surface α2, so Since the progress of wear on the lapped surface α2 is suppressed and the lapped surface α2 can maintain a constant flatness over a long period of time, the machining accuracy of the sphere (force...) can be maintained at a constant level.

なお、上記実施例において、上ラップ盤(5)の回転を
停止し、下ラップ盤(6)のみ回転させるようにしても
よい。さらに、上、下ラップ盤(5) 、 (6)を互
に偏心して配設してもよい。また、V字状溝lについて
も、正確に7字でなく横断面が逆台形の溝でもよい。さ
らK、第3図に示すようく、下ラップ盤(6)に、回転
軸線Iをはさんだ左右対称位置に偏心量ΔRだけ偏心し
た円環をなす一対のV字状溝ue、αηを刻設してもよ
い。この場合、加工できる球体(力・・・の数が倍化し
、加工能率が向上する。
In the above embodiment, the rotation of the upper lapping machine (5) may be stopped and only the lower lapping machine (6) may be rotated. Furthermore, the upper and lower lapping machines (5) and (6) may be arranged eccentrically from each other. Furthermore, the V-shaped groove 1 may also be a groove with an inverted trapezoidal cross section instead of an exact 7-shaped groove. Furthermore, as shown in Fig. 3, a pair of V-shaped grooves ue, αη forming a ring eccentric by an eccentric amount ΔR are carved in the lower lapping machine (6) at symmetrical positions across the rotational axis I. may be set. In this case, the number of spheres (forces...) that can be processed is doubled, improving processing efficiency.

のみならず、このようなV字状溝は、一対に限ることな
く、例えば3〜5個設けてもよい。
Furthermore, the number of such V-shaped grooves is not limited to one pair, and for example, three to five V-shaped grooves may be provided.

〔発明の効果〕〔Effect of the invention〕

本発明の球体加工装置は、下ラップ盤にV字状溝を回転
軸線に対して偏心させて刻設したので、上ラップ盤の摩
耗を抑制することができる。よって長期間にわたって球
体を高精度で加工することができるとともに、上ラップ
盤の交換頻度が小さくなるので、経済的になる。ことに
硬脆部材であるセラミックスの球体加工に本発明を適用
した場合に顕著な効果を奏する。
In the sphere machining apparatus of the present invention, the V-shaped groove is carved eccentrically with respect to the axis of rotation in the lower lapping machine, so that wear of the upper lapping machine can be suppressed. Therefore, the sphere can be processed with high precision over a long period of time, and the upper lapping machine can be replaced less frequently, making it more economical. Particularly, when the present invention is applied to spherical processing of ceramics, which are hard and brittle members, remarkable effects are achieved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の球体加工装置の構成図、第
2図は第1図の下ラップ盤の平面図、第3図は本発明の
他の実施例における下ラップ盤の平面図、第4図は従来
の球体加工装置の構成図である0 (5)・・・上ラップ盤、    (6)・・・下ラッ
プ盤、aり・・・ラップ面、    a3・・・V字状
溝。 a4・・・回転軸線。 代理人 弁理士  則 近 憲 佑 (ほか1名) 第1図 第2図
FIG. 1 is a block diagram of a sphere processing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the lower lapping machine of FIG. 1, and FIG. 3 is a plan view of the lower lapping machine of another embodiment of the present invention. Fig. 4 is a configuration diagram of a conventional sphere machining device. gutter groove. a4...Rotation axis line. Agent: Patent attorney Noriyuki Chika (and 1 other person) Figure 1 Figure 2

Claims (2)

【特許請求の範囲】[Claims] (1)一方の端面に平面をなすラップ面が形成された上
ラップ盤と、上記ラップ面に平行に対向する対向面を有
してこの対向面に直交する回転軸線のまわりに回転駆動
され且つ上記対向面には円環をなすV字状溝が上記回転
軸線に対して偏心して刻設されている下ラップ盤とを具
備することを特徴とする球体加工装置。
(1) An upper lapping machine having a flat lapping surface formed on one end surface, and an opposing surface facing parallel to the lapping surface, and is driven to rotate around a rotation axis perpendicular to the opposing surface, and A sphere machining device characterized in that it comprises a lower lapping machine in which a circular V-shaped groove is carved eccentrically with respect to the rotational axis on the opposing surface.
(2)V字状溝は複数本刻設されていることを特徴とす
る特許請求の範囲第1項記載の球体加工装置。
(2) The sphere machining device according to claim 1, wherein a plurality of V-shaped grooves are carved.
JP60030280A 1985-02-20 1985-02-20 Globe machining device Pending JPS61192472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60030280A JPS61192472A (en) 1985-02-20 1985-02-20 Globe machining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60030280A JPS61192472A (en) 1985-02-20 1985-02-20 Globe machining device

Publications (1)

Publication Number Publication Date
JPS61192472A true JPS61192472A (en) 1986-08-27

Family

ID=12299302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60030280A Pending JPS61192472A (en) 1985-02-20 1985-02-20 Globe machining device

Country Status (1)

Country Link
JP (1) JPS61192472A (en)

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