JPS61190816A - Ag-Pb alloy inlay/SUS clad material and its manufacturing method - Google Patents
Ag-Pb alloy inlay/SUS clad material and its manufacturing methodInfo
- Publication number
- JPS61190816A JPS61190816A JP3127885A JP3127885A JPS61190816A JP S61190816 A JPS61190816 A JP S61190816A JP 3127885 A JP3127885 A JP 3127885A JP 3127885 A JP3127885 A JP 3127885A JP S61190816 A JPS61190816 A JP S61190816A
- Authority
- JP
- Japan
- Prior art keywords
- inlay
- alloy
- manufacturing
- sus
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910000978 Pb alloy Inorganic materials 0.000 title description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 12
- 238000005253 cladding Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 229910000963 austenitic stainless steel Inorganic materials 0.000 claims description 6
- 238000005097 cold rolling Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はＡａ−Ｐｄ合金インレイ／ＳＵＳクラッド材、
特にキーボード等のエレクトロニクス関係の接点材に用
いられるインレイクランド材、及びその製造方法に関す
るものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides an Aa-Pd alloy inlay/SUS cladding material,
In particular, the present invention relates to an inlay land material used as a contact material for electronics such as a keyboard, and a method for manufacturing the same.
［従来の技術］
従来、タクトスイッチ、キーボードスイッチ等の接点材
に数多くのインレイクランド材が用いられているが、そ
れは黄銅、燐青銅等のベース材に、Ａａ 、Ａａ−Ｎｉ
合金、又はＡＩＪ−Ｃｔ１合金をインレイ状にクラッド
したものが主体であった。[Prior Art] Conventionally, many inlay land materials have been used for contact materials such as tact switches and keyboard switches.
The main materials used were alloys or AIJ-Ct1 alloys clad in inlay form.
この組合せの場合、ベース材の銅合金中のＣＵ元素が、
インレイクラツド材の製造中、又はスイッチ製造工程中
の熱影響により、インレイ材のＡｇ合金の中に拡散進行
し、接点材の接触抵抗を悪化させることがある。そこで
Ｃｕの拡散防止策としてインレイ材クラッド材の接触す
る面に、Ｎｉめつき又はクラッドを施したものが用いら
れていた。In the case of this combination, the CU element in the copper alloy of the base material is
Due to thermal effects during the manufacture of the inlay cladding material or during the switch manufacturing process, it may diffuse into the Ag alloy of the inlay material and deteriorate the contact resistance of the contact material. Therefore, as a measure to prevent the diffusion of Cu, a material in which the contacting surface of the inlay material cladding material is coated with Ni plating or cladding has been used.
［発明が解決しようとする問題点］
このＣｕ拡散防止策としてＮｉ層を施したものは、それ
なりの工程増に伴う原価高をまねくと同時に小型化にも
問題があった。又、近年スイッチ関係の小型化、長寿命
化の要求の増大に対処することが望まれている。[Problems to be Solved by the Invention] The device in which the Ni layer is applied as a measure to prevent Cu diffusion has a problem in not only increasing the cost due to the increase in the number of steps but also reducing the size of the device. Furthermore, in recent years, it has been desired to meet the increasing demands for smaller switch-related devices and longer life.
本発明の目的は、前記した従来品の欠点を解消し、スイ
ッチの小型化、長寿命化、高品質化、そして原価低減に
寄与できる新規の接点用インレイクランド材と、その製
造方法を提供することにある。The purpose of the present invention is to provide a new inlay land material for contacts, which eliminates the drawbacks of the conventional products described above, and can contribute to miniaturization, longer life, higher quality, and cost reduction of switches, and a method for manufacturing the same. It's about doing.
［問題点を解決するための手段］
本発明の要旨は、ベース材として銅合金を用いることを
やめ、オーステナイト系ステンレス材を用いたことにあ
る。製造方法として冷間圧延圧接法によってインレイ材
をクラッドしたことにある。[Means for Solving the Problems] The gist of the present invention is to stop using a copper alloy as a base material and instead use an austenitic stainless steel material. The manufacturing method is that the inlay material is clad using a cold rolling welding method.
即ち、Ｐｄを１０％以上含んだＡｇ−Ｐｄ合金を、オー
ステナイト系ステンレス鋼からなるベース材に、インレ
イ状にクラッドしたことを特徴とするＡａ−Ｐｂ合金イ
ンレイ／ＳＵＳクラッド材である。That is, this is an Aa-Pb alloy inlay/SUS cladding material, which is characterized in that an Ag-Pd alloy containing 10% or more of Pd is clad in the form of an inlay on a base material made of austenitic stainless steel.
Ｐｄを１０％以上含んだＡ（Ｊ−Ｐｂ合金を、オーステ
ナイト系ステンレス鋼からなるベース材に、冷間圧延圧
着法を用いて、長さ方向に沿って連続的に１条又は多条
にインレイ状にクラッドすることを特徴とするＡａ−Ｐ
ｂ合金インレイ／ＳＵＳクラッド材の製造方法である。A (J-Pb alloy containing 10% or more of Pd) is continuously inlaid in one or multiple strips along the length of a base material made of austenitic stainless steel using a cold rolling compression method. Aa-P characterized by being clad in the shape of
This is a method for manufacturing b-alloy inlay/SUS cladding material.
［作用］
ベース材を従来の銅合金からオーステナイト系ステンレ
ス、例えば５ＵＳ３０４，５ＵＳ３１６等に変更するこ
とにより、Ａ１１ｌ接点材中にＣｕ元素の拡散はなくな
り、従ってＮ１メッキ又はクラッドの工程は不要となっ
た。又ベース材の強度があがった為小型化が容易になっ
た。[Function] By changing the base material from the conventional copper alloy to austenitic stainless steel, such as 5US304, 5US316, etc., the diffusion of Cu elements into the A11L contact material is eliminated, and therefore the N1 plating or cladding process is no longer necessary. . Also, the increased strength of the base material makes it easier to downsize.
インレイ材をＡａ−Ｐｂ合金とすることに依り、接点の
耐摩耗性、耐硫化性を付与し、長寿命化を計った。Ｐｄ
の含有率は、冷間圧延圧接後の拡散加熱、及び中間焼鈍
の温度条件（ＳＬＩＳ３０４の場合的１０５０℃）を考
慮し、ＰｄｌＯ％以上＜Ａｇ−Ｐｄ １０％の融点１０
６０℃）とした。By using an Aa-Pb alloy as the inlay material, the contact has wear resistance and sulfidation resistance, and has a long service life. Pd
Considering the diffusion heating after cold rolling welding and the temperature conditions of intermediate annealing (1050°C in the case of SLIS304), the content of
60°C).
［実施例］
インレイクランド材の接点材の寸法が０．２０Ｍ厚×５
１ｊＩＩｌ巾、との０．０８Ｊ１１１厚Ｘ２７ｍ＋巾で
、２条のＡａ −Ｐｄ ３０％合金合金インレイＬＪＳ
３０４Ｌクラッド材の実施例を説明する。[Example] Dimensions of contact material made of inlay land material are 0.20M thick x 5
1JIIl width, 0.08J111 thickness x 27m + width, 2 strips of Aa-Pd 30% alloy alloy inlay LJS
An example of 304L clad material will be described.
第１図は本発明のＡ（］−Ｐｄ合金インレイ／ＳＵＳク
ラッド材の一実施例で、２条のインレイの場杏を示す断
面図である。１はベース材（ＳＵＳ３０４Ｌ）、２はイ
ンレイ材（Ａ（Ｊ −Ｐｄ ３０％合金合金第２図は本
発明の製造方法の一実施例を示す工程図である。Figure 1 is an embodiment of the A(]-Pd alloy inlay/SUS cladding material of the present invention, and is a sectional view showing two inlays. 1 is the base material (SUS304L), 2 is the inlay material (A(J-Pd 30% Alloy Alloy) Figure 2 is a process diagram showing one embodiment of the manufacturing method of the present invention.
インレイ材Ａ（＋−３０％Ｐｄ合金厚さ８０μ、クラツ
ド材５（ＪＳ３０４Ｌ厚さ１．５ｍｍの素材を前処理を
すませて冷間圧延圧接を行いインレイ材を２条長さ方向
に沿ってインレイ状にクラッドした。Inlay material A (+-30%Pd alloy thickness 80μ, clad material 5 (JS304L thickness 1.5mm) is pretreated and cold rolled and welded, and inlay material is inlaid along the length direction of two strips. It was clad in a shape.
これによって圧延後の板厚さ０．５〜０６８＃のインレ
イクラツド材が出来た。これを横型連続炉で温度１０４
５℃で拡散加熱を行い、表面研磨をした後、再び圧延を
行い０．２ｍ厚みにし、これを５１１ｎ！Ｒ幅にスリッ
トして、０．２４ＩＩ１１厚みＸ５１Ｍ幅のインレフラ
ッド材を完成させた。又、０．２ｍｔｓ厚みに圧延した
中間製品の一部を更に温度１０４５℃で焼鈍し、ついで
圧延を行ない０’、０８ｍ厚みにした。これを幅２７ｍ
にスリットして０．０８５１１１１厚み２７８幅のイン
レイクラツド材を完成させた。この様にして製作したイ
ンレイクラツド材の特性を表で示す。As a result, an inlay clad material having a plate thickness of 0.5 to 068 # after rolling was produced. This is heated in a horizontal continuous furnace at a temperature of 104
After performing diffusion heating at 5°C and polishing the surface, it was rolled again to a thickness of 0.2m, and this was 511n! A slit was made to the R width to complete an inreflat material of 0.24II11 thickness x 51M width. Further, a part of the intermediate product rolled to a thickness of 0.2 mts was further annealed at a temperature of 1045°C, and then rolled to a thickness of 0'08 m. This is 27m wide
By slitting it, we completed an inlaid material with a thickness of 0.0851111 mm and a width of 278 mm. The properties of the inlay clad material produced in this way are shown in a table.
Ａａ−３０％Ｐｄ合金を２条インレイとしたが、各々の
インレイ部とも寸法は同等であった。Two inlays were made of Aa-30%Pd alloy, and the dimensions of each inlay were the same.
また、×２００顕微鏡で断面を見たところ、インレイ材
Ａ！１１−３０％Ｐｄ合金とベース材５ＵＳ３０４ Ｌ
との剥離は全くなく、良質の接点材が得られた。Also, when I looked at the cross section with a x200 microscope, I found that it was inlay material A! 11-30% Pd alloy and base material 5US304L
There was no peeling at all, and a contact material of good quality was obtained.
［発明の効果コ
本発明により、従来の銅合金のベース材を用いた接点材
に比べ、強度的にすぐれ、板厚が薄くて良い例えばキー
ボードスイッチ等にはｏ、１１ｍ厚の燐青銅ベースの接
点材がオーステナイト系ステンレスでは０．０８ｊｗ＋
厚でよい。又Ａｇ−Ｐｄ合金の使用により接点部の長寿
命化が計られ、これらのことにより、エレクトロニツク
ス関連スイッチ類として、小型化、長寿命化、高品質化
、そして原価低減に寄与し、その産業上の効果は大であ
る。[Effects of the invention] According to the present invention, a phosphor bronze base material with a thickness of 11 m is used for keyboard switches, etc., which has superior strength and is thinner than conventional contact materials using copper alloy base materials. If the contact material is austenitic stainless steel, it is 0.08jw+
Thick is fine. In addition, the use of Ag-Pd alloys allows for longer lifespans of the contacts, which contributes to miniaturization, longer lifespan, higher quality, and cost reduction for electronics-related switches. The industrial effects are significant.
第１図は本発明のＡ（Ｊ−Ｐｄ合金インレイ／ＳＵＳク
ラッド材の２条インレイの場合の一実施例を示す断面図
である。
第２図は本発明の製造方法の一実施例を示す工程図であ
る。
１：ベース材、２：インレイ材。
代理人 弁理士 佐 藤 不二雄
晃 １ 図FIG. 1 is a sectional view showing an embodiment of the present invention A (J-Pd alloy inlay/two-striped inlay of SUS cladding material). FIG. 2 is a sectional view showing an embodiment of the manufacturing method of the present invention. This is a process diagram. 1: Base material, 2: Inlay material. Agent: Patent attorney Akira Fujio Sato 1 Figure
Claims (2)
テナイト系ステンレス鋼からなるベース材にインレイ状
にクラッドしたことを特徴とするＡｇ−Ｐｄ合金インレ
イ／ＳＵＳクラッド材。(1) An Ag-Pd alloy inlay/SUS cladding material, characterized in that an Ag-Pd alloy containing 10% or more of Pd is clad in the form of an inlay on a base material made of austenitic stainless steel.
テナイト系スンテレス鋼からなるベース材に、冷間圧延
圧接法を用いて、長さ方向に沿つて連続的に１条又は多
条にインレイ状にクラッドすることを特徴とするＡｇ−
Ｐｄ合金インレイ／ＳＵＳクラッド材の製造方法。(2) Ag-Pd alloy containing 10% or more of Pd is continuously inlaid in one or multiple strips along the length of a base material made of austenitic Sunteres steel using cold rolling welding. Ag- characterized by being clad in the shape of
Method for manufacturing Pd alloy inlay/SUS cladding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3127885A JPS61190816A (en) | 1985-02-19 | 1985-02-19 | Ag-Pb alloy inlay/SUS clad material and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3127885A JPS61190816A (en) | 1985-02-19 | 1985-02-19 | Ag-Pb alloy inlay/SUS clad material and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190816A true JPS61190816A (en) | 1986-08-25 |
Family
ID=12326851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3127885A Pending JPS61190816A (en) | 1985-02-19 | 1985-02-19 | Ag-Pb alloy inlay/SUS clad material and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190816A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141733A (en) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | Clad board |
| JPH01178391A (en) * | 1988-01-08 | 1989-07-14 | Tanaka Kikinzoku Kogyo Kk | Ag-pd alloy inlay/fe-ni clad stock and its manufacture |
| JPWO2007111017A1 (en) * | 2006-03-24 | 2009-08-06 | ウチヤ・サーモスタット株式会社 | Clad contact material and method for mounting the clad contact |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531856A (en) * | 1976-06-29 | 1978-01-10 | Tanaka Precious Metal Ind | Method of manufacturing electric contact material |
-
1985
- 1985-02-19 JP JP3127885A patent/JPS61190816A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531856A (en) * | 1976-06-29 | 1978-01-10 | Tanaka Precious Metal Ind | Method of manufacturing electric contact material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63141733A (en) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | Clad board |
| JPH01178391A (en) * | 1988-01-08 | 1989-07-14 | Tanaka Kikinzoku Kogyo Kk | Ag-pd alloy inlay/fe-ni clad stock and its manufacture |
| JPWO2007111017A1 (en) * | 2006-03-24 | 2009-08-06 | ウチヤ・サーモスタット株式会社 | Clad contact material and method for mounting the clad contact |
| JP4690454B2 (en) * | 2006-03-24 | 2011-06-01 | ウチヤ・サーモスタット株式会社 | Clad contact material and method for mounting the clad contact |
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