JPS61190148U - - Google Patents

Info

Publication number
JPS61190148U
JPS61190148U JP7551585U JP7551585U JPS61190148U JP S61190148 U JPS61190148 U JP S61190148U JP 7551585 U JP7551585 U JP 7551585U JP 7551585 U JP7551585 U JP 7551585U JP S61190148 U JPS61190148 U JP S61190148U
Authority
JP
Japan
Prior art keywords
base metal
lead frame
frame
frame material
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7551585U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7551585U priority Critical patent/JPS61190148U/ja
Publication of JPS61190148U publication Critical patent/JPS61190148U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7551585U 1985-05-20 1985-05-20 Pending JPS61190148U (US20100056889A1-20100304-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7551585U JPS61190148U (US20100056889A1-20100304-C00004.png) 1985-05-20 1985-05-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7551585U JPS61190148U (US20100056889A1-20100304-C00004.png) 1985-05-20 1985-05-20

Publications (1)

Publication Number Publication Date
JPS61190148U true JPS61190148U (US20100056889A1-20100304-C00004.png) 1986-11-27

Family

ID=30616806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7551585U Pending JPS61190148U (US20100056889A1-20100304-C00004.png) 1985-05-20 1985-05-20

Country Status (1)

Country Link
JP (1) JPS61190148U (US20100056889A1-20100304-C00004.png)

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