JPS61188356U - - Google Patents
Info
- Publication number
- JPS61188356U JPS61188356U JP5710186U JP5710186U JPS61188356U JP S61188356 U JPS61188356 U JP S61188356U JP 5710186 U JP5710186 U JP 5710186U JP 5710186 U JP5710186 U JP 5710186U JP S61188356 U JPS61188356 U JP S61188356U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor lead
- claw
- transfer path
- fixing block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
Landscapes
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
- Reciprocating Conveyors (AREA)
Description
第1図は従来の半導体リードフレーム装置の一
例を示す要部斜視図、第2図a,bは10ピンお
よび12ピンリードフレームの一例を示す平面図
、第3図は本考案による半導体リードフレーム送
り装置の一実施例を示す斜視図である。
1,6,7……リードフレーム、2……駆動装
置、3……爪固定ブロツク、5……送り爪、8…
…リード、9,12……ブロツク、13……エア
ーシリンダ、14……シヤフト固定ブロツク、1
5……ストツパ。なお、図中、同一符号は同一又
は相当部分を示す。
Fig. 1 is a perspective view of essential parts showing an example of a conventional semiconductor lead frame device, Fig. 2 a and b are plan views showing an example of a 10-pin and 12-pin lead frame, and Fig. 3 is a semiconductor lead frame according to the present invention. FIG. 2 is a perspective view showing an embodiment of a feeding device. 1, 6, 7... Lead frame, 2... Drive device, 3... Claw fixing block, 5... Feed claw, 8...
...Lead, 9, 12...Block, 13...Air cylinder, 14...Shaft fixing block, 1
5...Stotsupa. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ツクス運動させる駆動装置と、前記爪固定ブロツ
クに固定されてその先端が移送路上の半導体リー
ドフレームに係合する送り爪とを備えた半導体リ
ードフレーム送り装置において、前記駆動装置を
移送路の移送方向に対して直交する方向に移動さ
せて半導体リードフレームと送り爪との位置合せ
を行なう位置調整機構を設けたことを特徴とする
半導体リードフレーム送り装置。 A semiconductor lead frame feeder comprising: a drive device that moves a claw fixing block in a box along the transfer direction of a transfer path; and a feed claw fixed to the claw fixing block and whose tip engages with a semiconductor lead frame on the transfer path. A semiconductor lead frame feeding device, characterized in that the device is provided with a position adjustment mechanism for aligning the semiconductor lead frame and the feeding claw by moving the drive device in a direction perpendicular to the transfer direction of the transfer path. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5710186U JPH0214200Y2 (en) | 1986-04-16 | 1986-04-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5710186U JPH0214200Y2 (en) | 1986-04-16 | 1986-04-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61188356U true JPS61188356U (en) | 1986-11-25 |
JPH0214200Y2 JPH0214200Y2 (en) | 1990-04-18 |
Family
ID=30581315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5710186U Expired JPH0214200Y2 (en) | 1986-04-16 | 1986-04-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0214200Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013026270A (en) * | 2011-07-15 | 2013-02-04 | Hitachi High-Tech Instruments Co Ltd | Frame supply apparatus and frame supply method |
-
1986
- 1986-04-16 JP JP5710186U patent/JPH0214200Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013026270A (en) * | 2011-07-15 | 2013-02-04 | Hitachi High-Tech Instruments Co Ltd | Frame supply apparatus and frame supply method |
KR101328806B1 (en) * | 2011-07-15 | 2013-11-20 | 가부시끼가이샤 히다찌 하이테크 인스트루먼츠 | Frame feeding apparatus and frame feeding method |
Also Published As
Publication number | Publication date |
---|---|
JPH0214200Y2 (en) | 1990-04-18 |
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