JPS61187379U - - Google Patents
Info
- Publication number
- JPS61187379U JPS61187379U JP7168185U JP7168185U JPS61187379U JP S61187379 U JPS61187379 U JP S61187379U JP 7168185 U JP7168185 U JP 7168185U JP 7168185 U JP7168185 U JP 7168185U JP S61187379 U JPS61187379 U JP S61187379U
- Authority
- JP
- Japan
- Prior art keywords
- tip support
- support portion
- plated
- holding
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7168185U JPS61187379U (ko) | 1985-05-13 | 1985-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7168185U JPS61187379U (ko) | 1985-05-13 | 1985-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61187379U true JPS61187379U (ko) | 1986-11-21 |
Family
ID=30609394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7168185U Pending JPS61187379U (ko) | 1985-05-13 | 1985-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61187379U (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999035309A1 (en) * | 1998-01-12 | 1999-07-15 | Ebara Corporation | Plating jig of wafer |
| JP2009209390A (ja) * | 2008-03-03 | 2009-09-17 | Nec Corp | めっき給電治具 |
-
1985
- 1985-05-13 JP JP7168185U patent/JPS61187379U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999035309A1 (en) * | 1998-01-12 | 1999-07-15 | Ebara Corporation | Plating jig of wafer |
| JP2009209390A (ja) * | 2008-03-03 | 2009-09-17 | Nec Corp | めっき給電治具 |
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