JPH0238472U - - Google Patents

Info

Publication number
JPH0238472U
JPH0238472U JP11389988U JP11389988U JPH0238472U JP H0238472 U JPH0238472 U JP H0238472U JP 11389988 U JP11389988 U JP 11389988U JP 11389988 U JP11389988 U JP 11389988U JP H0238472 U JPH0238472 U JP H0238472U
Authority
JP
Japan
Prior art keywords
wafer
plating solution
contact
cathode
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11389988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11389988U priority Critical patent/JPH0238472U/ja
Publication of JPH0238472U publication Critical patent/JPH0238472U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11389988U 1988-08-30 1988-08-30 Pending JPH0238472U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11389988U JPH0238472U (ko) 1988-08-30 1988-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11389988U JPH0238472U (ko) 1988-08-30 1988-08-30

Publications (1)

Publication Number Publication Date
JPH0238472U true JPH0238472U (ko) 1990-03-14

Family

ID=31354157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11389988U Pending JPH0238472U (ko) 1988-08-30 1988-08-30

Country Status (1)

Country Link
JP (1) JPH0238472U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04280992A (ja) * 1991-03-11 1992-10-06 Electroplating Eng Of Japan Co ウエーハ用メッキ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04280992A (ja) * 1991-03-11 1992-10-06 Electroplating Eng Of Japan Co ウエーハ用メッキ装置

Similar Documents

Publication Publication Date Title
JPH0238472U (ko)
JPS61191467U (ko)
JPS6347078U (ko)
JPS6410069U (ko)
JPS61187379U (ko)
JPH0233265U (ko)
JPS6219735U (ko)
JPH03100028U (ko)
JPS63111662U (ko)
JPS6324273U (ko)
JPS6236529U (ko)
JPH0437262U (ko)
JPS61116029U (ko)
JPS60172768U (ja) リ−ドフレ−ムの部分メツキ装置
JPH0269964U (ko)
JPS63162539U (ko)
JPS61171244U (ko)
JPH0474454U (ko)
JPS6235391U (ko)
JPS6314570U (ko)
JPS633626U (ko)
JPS6165629U (ko)
JPH0299970U (ko)
JPH0353564U (ko)
JPS5974630U (ja) スイツチ