JPS61186474A - Multi-source vapor deposition device - Google Patents

Abstract

PURPOSE:To detect an evaporation rate without the invasion from the other vapor source by shielding the sides of the prescribed vapor source out of the plural vapor sources and a film thickness detector for said source and providing a heater between a shielding member for the same and a material to be deposited by evaporation. CONSTITUTION:The sides of one vapor deposition source 2 and film thickness detector 4 are covered by the cylindrical shielding member 9 in a 2-source vapor deposition device for ZnS and Mn, etc. A heater 10 in a meshed state, etc. is provided to the top end of the member 9. The direct invasion of the ZnS, etc. evaporated from the source 1 to the detector 4 is thus obviated in the stage of vapor deposition. The material reflected from the substrate is reevaporated by the heater 10. The detector 4 is therefore capable of detecting exactly the evaporating material of Mn, etc. from the vapor source 2 without being affected by the source 1. The heater temp. is preferably kept at >=300 deg.C.

Description

[Detailed Description of the Invention] [Summary] In a multi-source evaporation apparatus, especially when it includes an evaporation source of a sublimable substance, the evaporation material from the evaporation source is routed to other evaporation sources and the corresponding film thickness detector. Therefore, a shield member is provided to cover the sides of a predetermined evaporation source and the film thickness detector corresponding to the evaporation source to prevent direct evaporation. A heater is provided between the shielding member and the member to be deposited to reevaporate the reflective material from the member.

[Industrial application field]

The present invention relates to a multi-source vapor deposition apparatus.

When performing multi-source evaporation on the surface of a member to be evaporated such as a substrate by a multi-source evaporation method, a plurality of evaporation sources are provided in a predetermined arrangement, and the evaporated substance of each evaporation source is evaporated and transferred to the surface of the member to be evaporated. It is vapor-deposited.

[Conventional technology]

In this case, conventionally, a film thickness detector such as a crystal oscillator type is provided for each evaporation source, and the evaporation rate of the corresponding evaporation source is controlled by each film thickness detector.

[Problem that the invention seeks to solve]

However, with this conventional structure, the evaporated material from one evaporation source flows into the film thickness detector of another evaporation source, making accurate detection impossible. In addition, this double bleed is particularly problematic for substances that evaporate by sublimation, such as ZnS, because in addition to the direct double bleed, there are many reflections from the member to be evaporated and re-evaporation due to heat from other evaporation sources. . It is also possible to use a ring absorption method that detects externally as a film thickness detector.
This is not a good idea as it has the disadvantage that it is inferior to the crystal oscillator type in terms of accuracy and can only detect metal elements.

[Means for solving problems]

The present invention provides a multi-source vapor deposition apparatus capable of solving the above-mentioned problems, and is equipped with a shielding member 9 and a heater 10, as shown in the drawings.

The shield member 9 covers the sides of a predetermined evaporation source 2 and the film thickness detector 4 corresponding to the evaporation source 2, and the heater 10
and the member 7 to be vapor-deposited.

[For production]

Since the shielding member 9 covers the sides of the evaporation source 2 and the film thickness detector 4, the substance evaporated from the evaporation source 1 does not directly flow into the film thickness detector 4. Further, since the heater 10 is provided between the shielding member 9 and the member to be evaporated 70, even if the evaporated substance from the evaporation source 1 is evaporated on the member to be evaporated 7, it is not the heater 1? The film thickness detector 4
It never gets stuck.

〔Example〕

The invention will now be described in detail in conjunction with the drawings.

The drawing shows KL with ZnS and Mn deposited on the surface of the substrate.
This is a schematic front view of a multi-source vapor deposition apparatus that forms a light-emitting layer.

In the figure, 1 is a ZnS evaporation source, 2 is a Mn evaporation source, 3 is a film thickness detector corresponding to evaporation source 1, and 4 is a film thickness detector corresponding to evaporation source 2, which are installed in chamber 5. It is provided. 6 is an exhaust port of the chamber 5. A substrate 7, which is a member to be evaporated, is set in the chamber 5 as shown in the figure, and heated by a substrate heating source 8.

In the present invention, a cylindrical shielding member 9 that covers the sides of the evaporation source 2 and the film thickness detector 4 is provided, and the shielding member 9
A heater 10 is provided at the upper end (generally between the shield member 9 and the substrate 7). The heater 10 has a mesh shape and is connected to the source by a lead wire 11. In this way, the evaporation source 2 and the film thickness detector 4 corresponding to the evaporation source 2 are connected to each other by the shield member 9. Since the sides are covered, the material (Zn) that evaporates from the evaporation source 1 during vapor deposition and flies out
S) does not directly enter the film thickness detector. Also,
Since the ZnS that jumps out around this is a sublimable substance, when the substrate 7 is heated by the substrate heating source 8, the sublimable substance is reflected from the substrate 7, but this reflected substance is absorbed by the heater 10. It is re-evaporated by Therefore, the film thickness detector 4 can accurately detect the evaporated matter (Mn) from the evaporation source 2 without being influenced by the evaporation source 1. This detection is particularly effective when the evaporation rate of the evaporation source 2 is low and requires accurate detection. Furthermore, by forming the heater IO in a mesh shape as in this example, the effect of limiting the evaporation rate can be obtained. In addition, when using a mesh-like heater, it is desirable that the temperature of the mesh-like heater is 300° C. or higher. This is because, in the case of ZnS, the deposition rate on the substrate decreases significantly when the substrate temperature is 300° C. or higher, and it hardly adheres when the substrate temperature is 400° C. or higher. Furthermore, as in this example, in the case of two raw materials of ZnS and Mn, Mn
A shielding member 9 is placed on the side of the evaporation source 2. If the motor 10 is provided,
The effect of stabilizing the evaporation rate of the calm by preventing Mu from being sulfurized can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, even if there is a substance that is evaporated by reducing the evaporation rate during multi-source evaporation, the evaporation rate can be detected by eliminating recirculation from other evaporation sources. It is possible to form a deposited film with good reproducibility.

[Brief explanation of drawings]

The drawing is a front view showing an outline of a multi-source vapor deposition apparatus according to an embodiment of the present invention. In the figure, 1.2 is an evaporation source 3.4 is a film thickness detector 5, a chamber 7 is a substrate (a member to be evaporated), 8 is a substrate heating source 9, and an armpit member 10 is a heater.

Claims (3)

[Claims] (1) An apparatus configured to perform multi-source evaporation on a member to be evaporated using a plurality of evaporation sources, and having a film thickness detector for controlling evaporation rate corresponding to each of the evaporation sources, the apparatus comprising: A shielding member that covers the side of a predetermined evaporation source and the film thickness detector corresponding to the evaporation source, and a heater provided between the shielding member and the member to be deposited. A multi-source evaporation device featuring: (2) The multi-source vapor deposition apparatus according to claim 1, wherein the heater has a mesh shape. (3) The multi-source vapor deposition apparatus according to claim 2, wherein the set temperature of the mesh heater is 300° C. or higher.