JPS61183575U - - Google Patents
Info
- Publication number
- JPS61183575U JPS61183575U JP6712085U JP6712085U JPS61183575U JP S61183575 U JPS61183575 U JP S61183575U JP 6712085 U JP6712085 U JP 6712085U JP 6712085 U JP6712085 U JP 6712085U JP S61183575 U JPS61183575 U JP S61183575U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- filler
- component device
- circuit board
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6712085U JPS61183575U (he) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6712085U JPS61183575U (he) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183575U true JPS61183575U (he) | 1986-11-15 |
Family
ID=30600646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6712085U Pending JPS61183575U (he) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183575U (he) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007739A (ja) * | 2001-06-19 | 2003-01-10 | Rohm Co Ltd | 半導体部品の実装密封構造及びその実装密封方法 |
| WO2007043107A1 (ja) * | 2005-09-30 | 2007-04-19 | Matsushita Electric Industrial Co., Ltd. | 基板構造およびパッケージ部品 |
| JP2008300588A (ja) * | 2007-05-31 | 2008-12-11 | Renesas Technology Corp | 電子装置及びその製造方法 |
-
1985
- 1985-05-07 JP JP6712085U patent/JPS61183575U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007739A (ja) * | 2001-06-19 | 2003-01-10 | Rohm Co Ltd | 半導体部品の実装密封構造及びその実装密封方法 |
| WO2007043107A1 (ja) * | 2005-09-30 | 2007-04-19 | Matsushita Electric Industrial Co., Ltd. | 基板構造およびパッケージ部品 |
| JP2008300588A (ja) * | 2007-05-31 | 2008-12-11 | Renesas Technology Corp | 電子装置及びその製造方法 |
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