JPS61183575U - - Google Patents

Info

Publication number
JPS61183575U
JPS61183575U JP6712085U JP6712085U JPS61183575U JP S61183575 U JPS61183575 U JP S61183575U JP 6712085 U JP6712085 U JP 6712085U JP 6712085 U JP6712085 U JP 6712085U JP S61183575 U JPS61183575 U JP S61183575U
Authority
JP
Japan
Prior art keywords
electronic component
filler
component device
circuit board
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6712085U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6712085U priority Critical patent/JPS61183575U/ja
Publication of JPS61183575U publication Critical patent/JPS61183575U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP6712085U 1985-05-07 1985-05-07 Pending JPS61183575U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6712085U JPS61183575U (enExample) 1985-05-07 1985-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6712085U JPS61183575U (enExample) 1985-05-07 1985-05-07

Publications (1)

Publication Number Publication Date
JPS61183575U true JPS61183575U (enExample) 1986-11-15

Family

ID=30600646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6712085U Pending JPS61183575U (enExample) 1985-05-07 1985-05-07

Country Status (1)

Country Link
JP (1) JPS61183575U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007739A (ja) * 2001-06-19 2003-01-10 Rohm Co Ltd 半導体部品の実装密封構造及びその実装密封方法
WO2007043107A1 (ja) * 2005-09-30 2007-04-19 Matsushita Electric Industrial Co., Ltd. 基板構造およびパッケージ部品
JP2008300588A (ja) * 2007-05-31 2008-12-11 Renesas Technology Corp 電子装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007739A (ja) * 2001-06-19 2003-01-10 Rohm Co Ltd 半導体部品の実装密封構造及びその実装密封方法
WO2007043107A1 (ja) * 2005-09-30 2007-04-19 Matsushita Electric Industrial Co., Ltd. 基板構造およびパッケージ部品
JP2008300588A (ja) * 2007-05-31 2008-12-11 Renesas Technology Corp 電子装置及びその製造方法

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