JPS61181736U - - Google Patents
Info
- Publication number
- JPS61181736U JPS61181736U JP6541885U JP6541885U JPS61181736U JP S61181736 U JPS61181736 U JP S61181736U JP 6541885 U JP6541885 U JP 6541885U JP 6541885 U JP6541885 U JP 6541885U JP S61181736 U JPS61181736 U JP S61181736U
- Authority
- JP
- Japan
- Prior art keywords
- film
- spacer
- bonded
- flexible board
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000007651 thermal printing Methods 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例に係る熱印字ヘツドの
分解斜視図、第２図はフレキシブル基板の斜視図
、第３図はフレキシブル基板の他の実施例の斜視
図、第４図は要部の拡大断面図、第５図はフレキ
シブル基板の拡大側面図、第６図は従来のフレキ
シブル基板の斜視図である。
図中、符号２は発熱体、３はセラミツク基板、
４はフレキシブル基板、５はフイルム、６は補強
プレート、８はスペーサ、１７は切り欠き。
Fig. 1 is an exploded perspective view of a thermal printing head according to an embodiment of the present invention, Fig. 2 is a perspective view of a flexible substrate, Fig. 3 is a perspective view of another embodiment of the flexible substrate, and Fig. 4 is a main part. FIG. 5 is an enlarged side view of the flexible substrate, and FIG. 6 is a perspective view of the conventional flexible substrate. In the figure, 2 is a heating element, 3 is a ceramic substrate,
4 is a flexible substrate, 5 is a film, 6 is a reinforcing plate, 8 is a spacer, and 17 is a notch.
Claims (1)
フレキシブル基板４の端部を接合して両基板３，
４のプリント回路を接続し、前記フレキシブル基
板４を、プリント回路を備えたプラスチツク製フ
イルム５と、このフイルム５に接着された補強プ
レート６と、フイルム５上に接着されたスペーサ
８とで構成してこのスペーサ８を押さえカバー１
１で押圧するよう構成してある熱印字ヘツドにお
いて、 前記フイルム５またはスペーサ８の少なくとも
いずれかの長手方向中間に、切り欠き１７を形成
してあることを特徴とする熱印字ヘツド。[Claims for Utility Model Registration] At the end of the ceramic substrate 3 equipped with the heating element 2,
By joining the ends of the flexible substrate 4, both substrates 3,
4 is connected to the flexible board 4, and the flexible board 4 is composed of a plastic film 5 having a printed circuit, a reinforcing plate 6 bonded to the film 5, and a spacer 8 bonded to the film 5. Hold down the lever spacer 8 and cover 1
1, the thermal printing head is characterized in that a notch 17 is formed in the longitudinal middle of at least one of the film 5 and the spacer 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065418U JPH0646680Y2 (en) | 1985-04-30 | 1985-04-30 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065418U JPH0646680Y2 (en) | 1985-04-30 | 1985-04-30 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61181736U true JPS61181736U (en) | 1986-11-13 |
| JPH0646680Y2 JPH0646680Y2 (en) | 1994-11-30 |
Family
ID=30597402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985065418U Expired - Lifetime JPH0646680Y2 (en) | 1985-04-30 | 1985-04-30 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0646680Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012200954A (en) * | 2011-03-24 | 2012-10-22 | Toshiba Hokuto Electronics Corp | Thermal print head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5749581A (en) * | 1980-09-11 | 1982-03-23 | Ricoh Co Ltd | Connection between thermal head and heating-energizing circuit |
| JPS5994845U (en) * | 1982-12-15 | 1984-06-27 | 神鋼電機株式会社 | Thermal head heat sink |
-
1985
- 1985-04-30 JP JP1985065418U patent/JPH0646680Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5749581A (en) * | 1980-09-11 | 1982-03-23 | Ricoh Co Ltd | Connection between thermal head and heating-energizing circuit |
| JPS5994845U (en) * | 1982-12-15 | 1984-06-27 | 神鋼電機株式会社 | Thermal head heat sink |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012200954A (en) * | 2011-03-24 | 2012-10-22 | Toshiba Hokuto Electronics Corp | Thermal print head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0646680Y2 (en) | 1994-11-30 |