JPS61180712U - - Google Patents
Info
- Publication number
- JPS61180712U JPS61180712U JP6347985U JP6347985U JPS61180712U JP S61180712 U JPS61180712 U JP S61180712U JP 6347985 U JP6347985 U JP 6347985U JP 6347985 U JP6347985 U JP 6347985U JP S61180712 U JPS61180712 U JP S61180712U
- Authority
- JP
- Japan
- Prior art keywords
- pot
- runner
- plunger
- protrusion
- runners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985063479U JPH0246987Y2 (el) | 1985-04-27 | 1985-04-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985063479U JPH0246987Y2 (el) | 1985-04-27 | 1985-04-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61180712U true JPS61180712U (el) | 1986-11-11 |
JPH0246987Y2 JPH0246987Y2 (el) | 1990-12-11 |
Family
ID=30593665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985063479U Expired JPH0246987Y2 (el) | 1985-04-27 | 1985-04-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0246987Y2 (el) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07290491A (ja) * | 1994-04-27 | 1995-11-07 | Nec Corp | モールド金型 |
JP2011104799A (ja) * | 2009-11-13 | 2011-06-02 | Sekisui Plastics Co Ltd | 発泡成形品の成形装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601834A (ja) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | 半導体装置用樹脂封止装置 |
-
1985
- 1985-04-27 JP JP1985063479U patent/JPH0246987Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601834A (ja) * | 1983-06-20 | 1985-01-08 | Toshiba Corp | 半導体装置用樹脂封止装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07290491A (ja) * | 1994-04-27 | 1995-11-07 | Nec Corp | モールド金型 |
JP2011104799A (ja) * | 2009-11-13 | 2011-06-02 | Sekisui Plastics Co Ltd | 発泡成形品の成形装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0246987Y2 (el) | 1990-12-11 |