JPS61180610A - Method of passing tip of thin metallic wire through die for wire drawing - Google Patents

Abstract

PURPOSE:To suck and pass the tip of a thin wire through the hole of a die uniformly through liquid by dropping and filling liquid in the die hole when passing the tip of the thin wire through the die hole by suction of a vacuum pump. CONSTITUTION:A die 9 for wire drawing is placed on a die rest 6 through a rubber packing 10. When inside of a die holding fitting 5 is evacuated by a vacuum pump 1, inside of the die holding fitting 5 reaches low vacuum state causing slight leaking from a die hole 8, and the die 9 comes into close contact with the die rest 6. Then, the tip of a thin wire 11 having thinned tip is brought into contact with the die hole 8 sucking air, and at the same time, liquid such as water etc. is dropped from a supply port 12 to the die hole 8 to fill the die hole with the liquid. Then, the liquid is sucked in the die hole, and at the same time, the tip of the thin wire passes through the die hole.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for easily passing the tip of a thin metal wire through a drawing die in drawing a thin metal wire.

[Conventional technology]

When drawing thin metal wire, the process of thinning the tip of the thin wire to be drawn and passing that thin portion through a drawing die was traditionally done by hand by the operator, so it required good eyesight, dexterity, and skill. required.

As a way to simplify this difficult task,
A device described in Japanese Patent No. 57146, which penetrates a die hole using the suction force of a vacuum pump, has been proposed.

That is, a die holding jig is provided at the air inlet end of a vacuum hose connected to a vacuum pump, and the die holding jig has a ventilation cavity capable of holding the die and sucking outside air only from the die hole. , and is characterized by being equipped with a detection section that can confirm that the thin metal wire has penetrated the die section.

[Problem that the invention seeks to solve]

However, even with this improved device, when drawing a thin metal wire, if the outer diameter of the thin end of the thin wire to be drawn is not appropriate, air will pass through the die hole due to the suction force of the vacuum pump. The amount of wire changes, making it difficult to penetrate the tip of the thin wire into the die hole, requiring dexterity and skill, just like traditional manual work.

[Means for solving problems]

The present invention has been made to solve the above-mentioned problems, and provides a method for easily and reliably passing the tip of a thin wire through a wire drawing die.

To explain the present invention based on the drawings, a 1Fi vacuum pump,
A vacuum hose 4 with a liquid trap 2 and a pressure gauge 3 is connected to the vacuum pump 1 .

The other end of the vacuum hose 4 is connected to a cylindrical die support fitting 5. The die support fitting 5 is provided with a die pedestal 6 and a leak pulp 7 having a through hole for ventilation at a position corresponding to the hole of the line drawing die.

A line drawing die 9 having a through hole 8 in the center thereof is placed on the die pedestal 6 via a rubber backing 10 having a through hole at a position corresponding to the hole of the line drawing die. In order to facilitate the removal of the die 9, the die holder 6 is positioned so that when the die 9 is placed, about half of the die thickness is exposed from the upper edge of the die support fitting 5. Reference numeral 11 denotes a drawn thin line with a thin tip.

Now, what about line quotation dice? is placed on the die pedestal 61C via the rubber backing 10, and when the inside of the die support fitting 5 is evacuated by the vacuum pump 1, some leakage occurs from the hole 8 of the die, but the inside of the die support fitting 5 is in a steady state at a low vacuum. The die 9 comes into close contact with the pedestal 6. Here, in order to eliminate the above-mentioned drawbacks, the present invention provides a thin drawn wire 1 with a thin tip.
The tip of the die hole 8 is placed in contact with the die hole 8 sucking air, and a liquid such as water is dropped into the die hole 8 to fill the die hole 8 with the liquid. 12 is this liquid supply port. By filling the die hole 8 with a liquid, the liquid is sucked into the die hole 8, and at the same time, the thin wire tip is drawn through the die hole 8.

〔Example〕

When a line drawing die with a through hole of αozms$ is placed on a die support fitting together with a rubber backing, and the inside of the die support fitting is evacuated by a vacuum pump, a vacuum level of 4 II n,... s degrees is reached with a slight leakage from the die hole. A low vacuum is created. Then, a thin metal wire with a diameter of 0.5 cm was brought into contact with the die hole, and a thin metal wire with a diameter of 0.5 cm was made by electrolytic polishing to make the tip part about 5 cm thin with a 0.018 to 0.0171 barb. When water is dripped into the die hole from the water supply port of the die and the die hole is filled with water, the thin wire to be wired is drawn into the die hole at the same time as the water filling the die hole is sucked, and the thin wire slides into the die. penetrate. After leaving it until the pressure gauge reached approximately Is Hp, the leak pulp attached to the die support was opened, and the die with which the thin wire to be drawn was penetrated was taken out and a wire drawing operation was performed.

[Action/effect of the invention]

According to the present invention, when the thin wire tip is passed through the die hole by the suction force of the vacuum pump, liquid is dropped into the die hole to fill the die hole with the liquid, so that the droplet is sucked into the die hole. At the same time, the tip of the thin wire is drawn in and penetrates the die hole. In this way, in the present invention, the thin wire tip is suctioned by a uniform suction force through the liquid filled in the die hole, and can immediately penetrate the die hole, without requiring the same dexterity and skill as in the past. Work can be done easily.

[Brief explanation of drawings]

The figure is a sectional view of an apparatus for explaining the invention in detail. 1... Vacuum pump, 5... Dice support fitting, 6...
・Dice holder, 7...Leak pulp, 8--Dice hole, 9...Dice, 10...Rubber backing, 11
...Thin wire to be wired, 12-...Liquid supply port.

Claims (1)

[Claims] In this method, the tip of the thin metal wire 11 to be drawn is brought close to the die hole 8 sucking air, and the tip of the thin wire is passed through the die hole 8 by the suction force. Die hole 8 of line reference die 9 to be penetrated
is filled with liquid, and the filled liquid and thin metal wire to be drawn 1
A method for passing the tip of a fine metal wire through a wire drawing die, characterized in that the tip of the thin metal wire is passed through the die hole 8 by suction at the same time.