JPS61179750U - - Google Patents
Info
- Publication number
- JPS61179750U JPS61179750U JP6431485U JP6431485U JPS61179750U JP S61179750 U JPS61179750 U JP S61179750U JP 6431485 U JP6431485 U JP 6431485U JP 6431485 U JP6431485 U JP 6431485U JP S61179750 U JPS61179750 U JP S61179750U
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- semiconductor wafer
- adhesive
- breaking
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000005192 partition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Description
第１図はロール状ブレーキング用シートの斜視
図、第２図は粘着シート付き半導体ウエハの斜視
図、第３図はウエハブレーキング装置の斜視図で
ある。第４図乃至第６図は従来の半導体ペレツト
の製造手段を示し、第４図は一部破断斜視図、第
５図及び第６図は側面図である。
２……半導体ウエハ、３……粘着シート、３Ａ
……シート基材、３Ｂ……粘着剤、４……ブレー
キング用シート、４Ａ……シート基材、４Ｂ……
粘着剤。
FIG. 1 is a perspective view of a rolled breaking sheet, FIG. 2 is a perspective view of a semiconductor wafer with an adhesive sheet, and FIG. 3 is a perspective view of a wafer braking device. 4 to 6 show conventional semiconductor pellet manufacturing means, with FIG. 4 being a partially cutaway perspective view, and FIGS. 5 and 6 being side views. 2...Semiconductor wafer, 3...Adhesive sheet, 3A
...sheet base material, 3B...adhesive, 4...braking sheet, 4A...sheet base material, 4B...
adhesive.
Claims (1)
るように罫書かれた半導体ウエハをブレーキング
する際に半導体ウエハを貼着支持する半導体ウエ
ハブレーキング用シートであつて、 伸展性の劣るシート基材に前記粘着シートの粘
着性より劣る粘着剤の層を形成して成ることを特
徴とする半導体ウエハブレーキング用シート。[Scope of Claim for Utility Model Registration] A semiconductor wafer breaking sheet for adhering and supporting a semiconductor wafer when braking a semiconductor wafer that is adhered to an adhesive sheet and marked in advance to partition semiconductor elements, 1. A sheet for breaking semiconductor wafers, comprising a sheet base material with poor extensibility and a layer of an adhesive having adhesiveness inferior to that of the adhesive sheet described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431485U JPS61179750U (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6431485U JPS61179750U (en) | 1985-04-30 | 1985-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61179750U true JPS61179750U (en) | 1986-11-10 |
Family
ID=30595282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6431485U Pending JPS61179750U (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179750U (en) |
-
1985
- 1985-04-30 JP JP6431485U patent/JPS61179750U/ja active Pending