JPS61177586A - Memory card - Google Patents
Memory cardInfo
- Publication number
- JPS61177586A JPS61177586A JP60018394A JP1839485A JPS61177586A JP S61177586 A JPS61177586 A JP S61177586A JP 60018394 A JP60018394 A JP 60018394A JP 1839485 A JP1839485 A JP 1839485A JP S61177586 A JPS61177586 A JP S61177586A
- Authority
- JP
- Japan
- Prior art keywords
- display device
- substrate
- crystal display
- cover
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 2
- 238000007906 compression Methods 0.000 abstract 2
- 125000006850 spacer group Chemical group 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
- G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、少くともマイクロプロセッサ−とメモリー回
路を内蔵し、かつメモリー回路の内容を表示できる超薄
型表示装置を備えたメモリーカードに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a memory card that incorporates at least a microprocessor and a memory circuit, and is equipped with an ultra-thin display device capable of displaying the contents of the memory circuit.
メモリーカードは、カード本体内に半導体集積回路で構
成されるマイクロプロセッサ−及びメモリー回路を有す
るもので、蓄積できる情報量が、従来の磁気ストライプ
カードに比し、格段に多い上、このメモリー回路に本人
のみが確認することのできる情報を蓄積できるので安全
性も極めて高く、従来の磁気ストライプカードが改ざん
偽造により不正使用され、社会問題化していることを解
消するものとして注目されている。A memory card has a microprocessor made of a semiconductor integrated circuit and a memory circuit inside the card body, and the amount of information that can be stored is significantly larger than that of a conventional magnetic stripe card. It is extremely secure as it can store information that can only be verified by the person in question, and is attracting attention as a solution to the social problem of conventional magnetic stripe cards being used illegally through falsification and counterfeiting.
しかし、現在のメモリカードは、カード保有者がカード
を専用のカードリーダーにかけなければ、メモリの内容
を見ることかできない。従って、例えは、メモリカード
を電子通帳等に応用した場合、カード単体では、そのカ
ード保有者か、任意の時にメモリ内の預金残高、支払の
明細等の情報を見ることができないという欠点がある。However, with current memory cards, the contents of the memory cannot be viewed unless the cardholder inserts the card into a dedicated card reader. Therefore, for example, when a memory card is applied to an electronic passbook, etc., the card alone has the disadvantage that the card holder cannot view information such as bank balances and payment details in the memory at any time. .
そこでメモリー回路の内容を表示する表示装置を内蔵す
るメモリーカードか望まれるが、従来の表示装置を単に
組合せた丈では、現在キャッシュカードとして利用され
ている研気ストライプカードの国際標準化機構（ＩＳＯ
）規格である厚さ０．７６ ミ＋）メートルの薄槃構造
にすることができない。Therefore, a memory card with a built-in display device that displays the contents of the memory circuit is desired, but a length that simply combines a conventional display device is not suitable for the International Standardization Organization (ISO) of the Kenki Stripe Card, which is currently used as a cash card.
) The standard thickness of 0.76 mm +) cannot be made into a thin truss structure.
本発明は上記事情にもとづいてなされたもので、カード
本体内にマイクロプロセッサ−とメモリー回路を内蔵す
るとともに、メモリー回路の内容を表示できる超薄型表
示装置を内蔵し、かつ、従来の磁気ストライプカードと
同程度の薄型をしたメモリカードを提供することを目的
とする。The present invention has been made based on the above circumstances, and has a built-in microprocessor and memory circuit in the card body, an ultra-thin display device that can display the contents of the memory circuit, and a conventional magnetic stripe. The purpose is to provide a memory card that is as thin as a card.
本発明は上記目的を達成するために、カード本体を構成
する一対のカバー基板と埋込基板の内部に、マイクロプ
ロセッサ−とメモリー回路を截置したプリント基板と、
一対のフィルム基板で液晶層を狭持する構成の超薄型液
晶表示装置とを設置し、前記メモリー回路と前記液晶表
示装置とを電気的に接続し、熱圧着により一体化したこ
とを特徴とするものである。In order to achieve the above object, the present invention includes a printed circuit board in which a microprocessor and a memory circuit are disposed inside a pair of cover substrates and an embedded substrate constituting a card body;
An ultra-thin liquid crystal display device configured to sandwich a liquid crystal layer between a pair of film substrates is installed, the memory circuit and the liquid crystal display device are electrically connected, and integrated by thermocompression bonding. It is something to do.
以下、本発明を図示の一実施例を参照しながら説明する
。Hereinafter, the present invention will be explained with reference to an illustrated embodiment.
第１図は、本発明による表示装置付き超薄型メモリーカ
ードの斜視図であり、カード本体ａＱ内に、マイクロプ
ロセッサ−とメモリー回路を構成する半導体回路が内蔵
されており、カードの一端部に設けられたインターフェ
ース部ａｚは、カードリーダー等の外部装置と前記半導
体回路とを電気的に接続するための複数の入出力端子（
１４）が設けられている。カード本体Ｑ〔には、更に前
記インターフェース部ｕりとは異なる位１１に透明偏光
体を埋込んだ表示窓部（１６）が設けられる。FIG. 1 is a perspective view of an ultra-thin memory card with a display device according to the present invention, in which a semiconductor circuit constituting a microprocessor and a memory circuit is built into the card body aQ, and one end of the card is The provided interface section az has a plurality of input/output terminals (
14) is provided. The card body Q is further provided with a display window section (16) in which a transparent polarizer is embedded at a position 11 different from the interface section.
この表示窓５Ｑｂｌの位置は、後述するように半導体回
路及び端子α４と重畳しない位置であればどこでも良い
か、第１図の実施例に示すようにインターフェース部（
１２１と反対側の端部に設けるのが好ましい。The display window 5Qbl may be positioned at any position as long as it does not overlap with the semiconductor circuit and the terminal α4, as will be described later, or it may be placed at any position as long as it does not overlap with the semiconductor circuit and the terminal α4.
It is preferable to provide it at the end opposite to 121.
この表示窓部（ＩＱは少くとも、カード本体に内蔵され
た表示装置に対応する部分を透明偏光体で形成するのが
望ましいが、上面基板全面を透明材で形成しても良い。It is desirable that at least the display window (IQ) corresponding to the display device built into the card body be formed of a transparent polarizer, but the entire top substrate may be formed of a transparent material.
第２図は、第１図のメモリカードの分解斜視図である。FIG. 2 is an exploded perspective view of the memory card of FIG. 1.
カード本体は、一対のカバー基板α瞠、■と、このカバ
ー基板Ｑ１９、固に狭持される埋込み基板＠、コアシー
ト材（２）とを熱圧着して一体化して形成される。The card body is formed by integrally bonding a pair of cover substrates α and ■, the cover substrate Q19, the embedded substrate held firmly between them, and the core sheet material (2) by thermocompression.
上面カバー基板−には、第１図で示したインターフェー
ス部圓を構成する複数の端子用孔（１５１が穿設される
とともに、表示窓部ｕｅは透明プラスチック偏光部材で
形成される。The top cover substrate is provided with a plurality of terminal holes (151) forming the interface circle shown in FIG. 1, and the display window ue is formed of a transparent plastic polarizing member.
埋込み基板＠には、後述するプリント基板及び液晶表示
装置を嵌合させる部品嵌合８１２３が設けられている。The embedded board @ is provided with a component fitting 8123 into which a printed circuit board and a liquid crystal display device, which will be described later, are fitted.
本実施例では、部品嵌合部のは埋込み基板＠を貫通して
設けられているが、埋込み基板の厚みによっては凹部状
に形成することもできる。In this embodiment, the component fitting portion is provided to penetrate the embedded board @, but it may be formed in the shape of a recess depending on the thickness of the embedded board.
前記埋込み基板の部品嵌曾部の内にプリント、基板（ハ
）が嵌合保持される。このプリント基板の一端には、前
記カバー基板α鱒の端子用孔■に対応して、複数の入出
力端子α〜が設けられる。更に、この基板（ハ）には少
くともマイクロプロセッサ−及びメモリー回路を構成す
る半導体集積回路（ハ）、■と超薄型液晶表示装置０力
が設けられ、夫々は基板＠に設けられたプリント配線に
より、電気的に接続されるとともに、入出力端子住４に
も接続されている。A printed circuit board (c) is fitted and held within the component fitting portion of the embedded board. A plurality of input/output terminals α~ are provided at one end of this printed circuit board, corresponding to the terminal holes (■) of the cover board α. Further, this substrate (c) is provided with at least a semiconductor integrated circuit (c) constituting a microprocessor and a memory circuit, and an ultra-thin liquid crystal display device, each of which is connected to a printed circuit board provided on the substrate. It is electrically connected by wiring and is also connected to the input/output terminal 4.
本実施例では、プリント基板（至）上の入出力端子Ｉに
対して、半導体集積回路側、（７）と液晶表示装置Ｃ力
とが基板（支）の反対側面に設けられている。In this embodiment, the semiconductor integrated circuit side (7) and the liquid crystal display device C are provided on the opposite side of the printed circuit board (support) to the input/output terminal I on the printed circuit board (support).
コアシート部材ｃ！４）には、前記半導体集積回路の挿
入孔（ロ）、（至）及び液晶表示装置の挿入孔（至）が
設けられ【いる。Core sheet member c! 4) is provided with insertion holes (b) and (to) for the semiconductor integrated circuit and an insertion hole (to) for the liquid crystal display device.
さらに、下面カバー基板■上には、前記プリント基板（
４）による発熱を発散させるための金属箔（２）が設け
られており、この金属箔（至）にも、前記半導体集積回
路（至）、（７）か歌合する凹Ｓ冊がある。Furthermore, the printed circuit board (
A metal foil (2) is provided for dissipating the heat generated by 4), and this metal foil (2) also has a concave S-shaped plate that is connected to the semiconductor integrated circuit (1) and (7).
尚、本実施例では、埋込み基板（２）とコアシート部材
（２）を別体に構成したか、両部材を一体形成すること
も可能であり、さらに、プリント基板（至）上の入出力
端子Ｉと反対側に半導体集積回路側、（至）と表示装置
６カとを設けたが、埋込み基板の厚みによって、同一面
上にこれらを設けることも可能である。In this embodiment, the embedded board (2) and the core sheet member (2) may be configured separately or both may be integrally formed. Although the semiconductor integrated circuit side (to) and the display device 6 are provided on the side opposite to the terminal I, it is also possible to provide these on the same surface depending on the thickness of the embedded substrate.
第３図は、第２図のプリント基板２６のＸ−Ｘ線断面図
である。プリント基板（２６）上に半導体集積回路（２
８）と液晶表示装置（３幻とが設けられ、夫々基板上の
プリント配線（４２）で電気的に接続されている。FIG. 3 is a cross-sectional view taken along the line X--X of the printed circuit board 26 in FIG. 2. FIG. Semiconductor integrated circuit (2) on printed circuit board (26)
8) and a liquid crystal display device (three screens) are provided, and are electrically connected to each other by printed wiring (42) on the board.
液晶表示装置（３２）の構成は、液晶層（４４）を、一
対＜７）ｙｌＪエーテルサルフオンフイルム基板（４６
）でスペーサ（４８）を介して狭持し、下ｌ１１ｉフィ
ルム基板（４６）には、偏光体（４８）及び反射体（５
０）が設けられている。フィルム基板（４６）の液晶層
側内面には、夫々透明導電膜（５２）が形成される。The liquid crystal display device (32) has a structure in which a liquid crystal layer (44) is connected to a pair of <7) ylJ ether sulfon film substrates (46).
), and the lower l11i film substrate (46) has a polarizer (48) and a reflector (5).
0) is provided. A transparent conductive film (52) is formed on the inner surface of the film substrate (46) on the liquid crystal layer side.
本実施例では、半導体集積回路（２８）、（３０）を截
置するプリント基板（２６）と液晶表示装置を構成する
一対のフィルム基板の−１を一体構造とし、液晶表示装
置の−１の透明導電膜（５２）とプリント基板上の配線
（４２）とを直接接続する構成を示しているが、集積回
路（２８）を截置するプリント基板（２６）と液晶表示
装ｆｔ（３２）とは別体に構成しても良い。In this embodiment, the printed circuit board (26) on which the semiconductor integrated circuits (28) and (30) are mounted and -1 of the pair of film substrates constituting the liquid crystal display device are integrally constructed, and -1 of the liquid crystal display device is integrated. Although a configuration is shown in which the transparent conductive film (52) and the wiring (42) on the printed circuit board are directly connected, the printed circuit board (26) on which the integrated circuit (28) is mounted and the liquid crystal display device ft (32) are connected directly. may be configured separately.
本発明のポリエーテルサルフオンフィルム基板を用いた
液晶表示装置によれは、フィルム基板（４６）を０．２
ｍｍ厚以下にすることができるので、反射体厚が０．
１ｍｍ でも、表示装置全体を０．６ｒｒＶｎ 以下
に形成することができ、従来のガラス基板液晶装置では
達成することのできない超薄型表示装置つきメモリー・
カードが提供される。In a liquid crystal display device using the polyether sulfon film substrate of the present invention, the film substrate (46) may be
Since the thickness of the reflector can be reduced to less than 0.0 mm, the thickness of the reflector can be reduced to 0.0 mm.
Even with a thickness of 1mm, the entire display device can be formed with a voltage of 0.6rrVn or less, making it possible to create a memory device with an ultra-thin display device that cannot be achieved with conventional glass substrate liquid crystal devices.
A card will be provided.
尚、半導体回路及び液晶表示装置の電源は、外部装置か
らカードに供給される構造としても良いし、カード内に
、高分子フィルムを用いたシート状電池を内蔵しても良
い。又、表示装置を任意に点滅させるためのフラットパ
ネルスイッチを設け【も良い。Note that the power for the semiconductor circuit and the liquid crystal display device may be supplied to the card from an external device, or a sheet-like battery using a polymer film may be built into the card. Additionally, a flat panel switch may be provided to arbitrarily blink the display device.
又、本実施例では、上下面の一対のカバー基板と、これ
らに狭持される埋込み基板を同一の大きさにしたがカバ
ー基板の周端部に、夫々対向する凸状部を設け、埋込み
基板をカバー基板外周より小さくすることもできる。Furthermore, in this embodiment, the pair of upper and lower cover substrates and the embedded substrate sandwiched between them are made of the same size, but opposing convex portions are provided on the peripheral edges of the cover substrates, so that the embedded substrate is The substrate can also be made smaller than the outer circumference of the cover substrate.
以上説明したように本発明によれば、フィルム基板の液
晶表示装置を用いてメモリカードを構成したので、汎用
の磁気ストライプカードと同一の厚さにすることができ
、磁気ストライプを設けて磁気ストライプカード機器に
も互換便用できる超薄型のメモリカードか提供でき、か
つ、カード保有者が任意の時にメモリー回路の内容を表
示して見ることかできるとともに、携帯時にも、従来の
カードと同厚で極めて便利である。As explained above, according to the present invention, since a memory card is configured using a liquid crystal display device on a film substrate, it can be made to have the same thickness as a general-purpose magnetic stripe card, and a magnetic stripe can be provided. We can provide an ultra-thin memory card that can be used interchangeably with card devices, and the cardholder can display and view the contents of the memory circuit at any time, and can be carried just like a conventional card. Thick and extremely convenient.
第１図は本発明の表示装置つきメモリーカードの斜視図
、第２図は第１図のメモリカードの分解斜視図、第３図
は第２図のプリント基板Ｘ−Ｘ線断面図で、本発明に有
用な液晶表示装置を詳細に説明するための拡大図である
。
１４・・・入出力端子、１６・・・表示窓部、１８゜２
０・・・カバー基板、２２・・・埋込み基板、２６・・
・プリント基板、２８．３０・・・半導体集積回路、３
２・・・液晶表示装置、４６・・・フィルム基板。
・−ｌテ５；：〒へFIG. 1 is a perspective view of a memory card with a display device of the present invention, FIG. 2 is an exploded perspective view of the memory card of FIG. FIG. 2 is an enlarged view for explaining in detail a liquid crystal display device useful for the invention. 14... Input/output terminal, 16... Display window section, 18゜2
0...Cover board, 22...Embedded board, 26...
・Printed circuit board, 28.30...Semiconductor integrated circuit, 3
2...Liquid crystal display device, 46...Film substrate.・-lte5;: to 〒
Claims (1)
とを任意の位置に有する一対のカバー 基板と、 ｂ）部品嵌合部を有し、前記カバー基板の間に狭持され
る埋込み基板と、 ｃ）前記カバー基板のインターフェース部を介して外部
装置と情報の伝達を行なう入出 力端子と、この入出力端子と電気的に接続 されるマイクロプロセッサー及びメモリー 回路を構成する半導体集積回路とを截置し、前記埋込基
板の部品嵌合部内に保持される プリント基板と、 ｄ）前記カバー基板の表示窓部に対応する位置で前記埋
込基板の部品嵌合部内に設置さ れ、かつ一対のフィルム基板で液晶層を狭 持する構成の超薄型液晶表示装置とを有し、前記カバー
基板と前記埋込基板とを圧着一 体化するとともに、前記半導体回路と前記 液晶表示装置とを電気的に接続したことを 特徴とするメモリー・カード。(1) a) a pair of cover substrates having an interface section with an external device and a display window section at arbitrary positions; and b) an embedded substrate having a component fitting section and sandwiched between the cover substrates. and c) an input/output terminal for transmitting information to an external device via the interface section of the cover substrate, and a semiconductor integrated circuit constituting a microprocessor and a memory circuit electrically connected to the input/output terminal. d) a printed circuit board placed in the component fitting part of the embedded board at a position corresponding to the display window part of the cover board; an ultra-thin liquid crystal display device having a structure in which a liquid crystal layer is sandwiched between film substrates, the cover substrate and the embedded substrate are integrated by pressure bonding, and the semiconductor circuit and the liquid crystal display device are electrically connected. A memory card that is characterized by being connected to
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60018394A JPS61177586A (en) | 1985-02-01 | 1985-02-01 | Memory card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60018394A JPS61177586A (en) | 1985-02-01 | 1985-02-01 | Memory card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61177586A true JPS61177586A (en) | 1986-08-09 |
Family
ID=11970485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60018394A Pending JPS61177586A (en) | 1985-02-01 | 1985-02-01 | Memory card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177586A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2842339A1 (en) * | 2002-07-12 | 2004-01-16 | Thales Sa | SELF-SUPPORTING LIQUID CRYSTAL DISPLAY |
| US7269021B2 (en) | 2000-05-05 | 2007-09-11 | Infineon Techonologies Ag | Smart card containing a carrier body for receiving at least one system component having a plurality of electrical components and uniting electrical functions for operating the smart card |
| US7652359B2 (en) | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
| US9317797B2 (en) | 2001-09-25 | 2016-04-19 | Giesecke & Devrient Gmbh | Chip card with a display |
-
1985
- 1985-02-01 JP JP60018394A patent/JPS61177586A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7269021B2 (en) | 2000-05-05 | 2007-09-11 | Infineon Techonologies Ag | Smart card containing a carrier body for receiving at least one system component having a plurality of electrical components and uniting electrical functions for operating the smart card |
| US9317797B2 (en) | 2001-09-25 | 2016-04-19 | Giesecke & Devrient Gmbh | Chip card with a display |
| FR2842339A1 (en) * | 2002-07-12 | 2004-01-16 | Thales Sa | SELF-SUPPORTING LIQUID CRYSTAL DISPLAY |
| WO2004008235A3 (en) * | 2002-07-12 | 2004-04-08 | Thales Sa | Self-supporting liquid crystal display screen |
| US7652359B2 (en) | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
| US7863116B2 (en) | 2002-12-27 | 2011-01-04 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
| US8158491B2 (en) | 2002-12-27 | 2012-04-17 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
| US8268702B2 (en) | 2002-12-27 | 2012-09-18 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
| US8674493B2 (en) | 2002-12-27 | 2014-03-18 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
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