JPS6117735U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6117735U
JPS6117735U JP1984102590U JP10259084U JPS6117735U JP S6117735 U JPS6117735 U JP S6117735U JP 1984102590 U JP1984102590 U JP 1984102590U JP 10259084 U JP10259084 U JP 10259084U JP S6117735 U JPS6117735 U JP S6117735U
Authority
JP
Japan
Prior art keywords
semiconductor element
support body
elastic body
semiconductor equipment
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984102590U
Other languages
English (en)
Other versions
JPH0642337Y2 (ja
Inventor
光雄 大館
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1984102590U priority Critical patent/JPH0642337Y2/ja
Priority to CA000486075A priority patent/CA1234228A/en
Priority to DE19853524191 priority patent/DE3524191A1/de
Publication of JPS6117735U publication Critical patent/JPS6117735U/ja
Priority to US07/056,990 priority patent/US4803180A/en
Priority to US07/075,218 priority patent/US4792844A/en
Application granted granted Critical
Publication of JPH0642337Y2 publication Critical patent/JPH0642337Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y10T29/49917—Overedge assembling of seated part by necking in cup or tube wall
    • Y10T29/49918—At cup or tube end

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例の半導体装置の断面図、第２図はその装
置の突起部形成法を示す部分断面図、第３図は本考案の
一実施例による半導体装置の断面図、第４図は本実施例
装置の折り曲げ部形成法を示す部分断面図である。 １・・・半導体素子、２・・・ケース、２ａ・・・支持
体、２ｂ・・・筒状体、６・・・皿バネ（弾性体）、１
２ａ・・・折り曲げ部。 なお図中同一符号は同一又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 支持体と、該支持体上に載置された半導体素子と、この
    半導体素子の上方に設けられ所定の加圧力で該素子を上
    記支持体に圧接する弾性体と、その下端部が上記支持体
    に固着され上記半導体素子及び弾性体を収納する筒状体
    と、上記弾性体を介して上記半導体素子に上記加圧力を
    加えた状態にて上記筒状体の上端部を少なくとも３箇所
    以上内周方向に折り曲げて上記弾性体の上端部に接触加
    圧するよう形成された折り曲げ部とを備えたことを特徴
    とする半導体装置。
JP1984102590U 1984-07-05 1984-07-05 半導体装置 Expired - Lifetime JPH0642337Y2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1984102590U JPH0642337Y2 (ja) 1984-07-05 1984-07-05 半導体装置
CA000486075A CA1234228A (en) 1984-07-05 1985-06-28 Semiconductor device
DE19853524191 DE3524191A1 (de) 1984-07-05 1985-07-05 Halbleitereinrichtung
US07/056,990 US4803180A (en) 1984-07-05 1987-06-03 Method for manufacturing pressure contact semiconductor devices
US07/075,218 US4792844A (en) 1984-07-05 1987-07-20 Pressure contact semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984102590U JPH0642337Y2 (ja) 1984-07-05 1984-07-05 半導体装置

Publications (2)

Publication Number Publication Date
JPS6117735U true JPS6117735U (ja) 1986-02-01
JPH0642337Y2 JPH0642337Y2 (ja) 1994-11-02

Family

ID=14331444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984102590U Expired - Lifetime JPH0642337Y2 (ja) 1984-07-05 1984-07-05 半導体装置

Country Status (4)

Country Link
US (2) US4803180A (ja)
JP (1) JPH0642337Y2 (ja)
CA (1) CA1234228A (ja)
DE (1) DE3524191A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013219244A (ja) * 2012-04-10 2013-10-24 Mitsubishi Electric Corp 半導体装置の半導体モジュールの固定方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3718598A1 (de) * 1986-06-04 1987-12-10 Mitsubishi Electric Corp Halbleiteranordnung
DE3912213C1 (ja) * 1989-04-13 1990-10-04 Hydromatik Gmbh, 7915 Elchingen, De
FR2665817B1 (fr) * 1990-08-07 1996-08-02 Auxilec Diode a electrode et a boitier assembles sans soudure ni sertissage, et pont redresseur realise avec de telles diodes.
DE102010055470B4 (de) 2010-12-22 2017-10-19 Texas Instruments Deutschland Gmbh RFID-Transponder und schlüsselloses Fahrzeugzugangssystem

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146181A (en) * 1975-06-11 1976-12-15 Toshiba Corp Press contact type diode device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA665744A (en) * 1963-06-25 Fansteel Metallurgical Corporation Semiconductor diode assembly and housing therefor
CA884591A (en) 1971-10-26 Meyerhoff Alfred Pressure electrical contact assembly for an electrical device
NL289148A (ja) * 1961-08-12
DE1514114A1 (de) * 1965-02-17 1969-08-28 Licentia Gmbh Spule fuer Elektromagnetsysteme,z.B. das Antriebssystem fuer Luftschuetze
GB1140677A (en) * 1965-05-07 1969-01-22 Ass Elect Ind Improvements relating to semi-conductor devices
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
IE32747B1 (en) * 1968-04-10 1973-11-14 Westinghouse Electric Corp Pressure electrical contact assembly for an electrical device and method and apparatus for producing the same
BE755326A (fr) * 1969-08-26 1971-02-26 Siemens Ag Memoire inalterable
US3683492A (en) * 1970-02-06 1972-08-15 Westinghouse Electric Corp Apparatus and process for making a pressure electrical contact assembly for an electrical device
DE2042333A1 (de) * 1970-08-26 1972-03-02 Siemens Ag Verfahren zum gasdichten Verschließen von Halbleiterbauelementen
US3950778A (en) * 1974-09-30 1976-04-13 Westinghouse Electric Corporation Semiconductor device and case member
US4305087A (en) * 1979-06-29 1981-12-08 International Rectifier Corporation Stud-mounted pressure assembled semiconductor device
JPS6149448U (ja) * 1984-09-03 1986-04-03
DE3612813A1 (de) * 1985-04-16 1986-10-23 Mitsubishi Denki K.K., Tokio/Tokyo Halbleiter-bauelement

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146181A (en) * 1975-06-11 1976-12-15 Toshiba Corp Press contact type diode device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013219244A (ja) * 2012-04-10 2013-10-24 Mitsubishi Electric Corp 半導体装置の半導体モジュールの固定方法

Also Published As

Publication number Publication date
JPH0642337Y2 (ja) 1994-11-02
DE3524191A1 (de) 1986-01-16
US4792844A (en) 1988-12-20
US4803180A (en) 1989-02-07
CA1234228A (en) 1988-03-15

Similar Documents

Publication Publication Date Title
JPS6117735U (ja) 半導体装置
JPH051200Y2 (ja)
JPS59100533U (ja) 弾性部材圧入装置
JPS60138045U (ja) 防振装置
JPS58109757U (ja) 定着装置
JPS5981524U (ja) 円筒部材の曲げ装置
JPS5851670U (ja) 電気刷子
JPS58138407U (ja) 車輛用アンテナの取付装置
JPS6069814U (ja) 取付用ねじ装置
JPS5844878U (ja) クリツプ装置
JPS5990538U (ja) 自動ねじ締め装置における自動調心機構
JPS58107284U (ja) 接点装置
JPS5915274U (ja) 整流子モ−タのブラシ保持機構
JPS5811291U (ja) 取付装置
JPS5866644U (ja) Ｉｃクリツプ
JPS58165319U (ja) レバ−装置
JPS58139874U (ja) 刷子装置
JPS5950483U (ja) 電子機器取付装置
JPS637473U (ja)
JPS58114053U (ja) 半導体装置
JPS5926851U (ja) 流体圧シリンダにおける検出スイツチ取付装置
JPS599541U (ja) 半導体素子の電極固定装置
JPS6136386U (ja) 圧接装置の材料つかみ装置
JPS59166258U (ja) 加圧ロ−ル定着装置
JPS5876046U (ja) 感熱素子の取付装置