JPS61176109A - Manufacture of metalized film capacitor - Google Patents
Manufacture of metalized film capacitorInfo
- Publication number
- JPS61176109A JPS61176109A JP1699785A JP1699785A JPS61176109A JP S61176109 A JPS61176109 A JP S61176109A JP 1699785 A JP1699785 A JP 1699785A JP 1699785 A JP1699785 A JP 1699785A JP S61176109 A JPS61176109 A JP S61176109A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- metallized film
- capacitor element
- metallicon
- film capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は金属化フィルムコンデンサの製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing metallized film capacitors.
（従来の技術）
金属化プラスチックフィルム等のフィルムを巻回したコ
ンデンサ素子を用いた金属化フィルムコンデンサは、従
来、巻回後にコンデンサ素子の両端面にメタリコンを設
け、次にこの際に生じたメタリコンのバリを除去し、バ
リを除去後、メタリコンにリード線を接続し、さらに樹
脂中にディップ等して外装を設けて製造している。(Prior Art) Conventionally, a metallized film capacitor using a capacitor element wound with a film such as a metallized plastic film has been manufactured by providing metallization on both end faces of the capacitor element after winding, and then removing the metallization generated at this time. After removing the burrs, lead wires are connected to the metallicon, and then an exterior is provided by dipping it in resin.
（発明が解決しようとする問題点〉
ところで、この金属化フィルムコンデンサを印刷配線板
に半田リフロー等により接続する場合、コンデンサが加
熱されるために、コンデンサ素子内に含まれているガス
が膨張し、コンデンサが破壊される欠点があった。(Problems to be Solved by the Invention) By the way, when this metallized film capacitor is connected to a printed wiring board by solder reflow, etc., the capacitor is heated, which causes the gas contained in the capacitor element to expand. However, the disadvantage was that the capacitor was destroyed.
本発明の目的は、以上の欠点を改良し、印刷配線板に接
続する際の破壊を防止しつる金属化フィルムコンデンサ
の製造方法を提供するものである。SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks and provide a method for manufacturing a metalized film capacitor which can be prevented from being destroyed when connected to a printed wiring board.
（問題点を解決するための手段）
本発明は、上記の目的を達成するために、金属化フィル
ムを巻回したコンデンサ素子の両端面にメタリコンを形
成した後、該メタリコンのバリを除去し、前記メタリコ
ンにリード線を接続し、外装を形成する金属化フィルム
コンデンサの製造方法において、メタリコンを形成後、
バリを除去する前にコンデンサ素子を高温雰囲気中に放
置する熱処理を施すことを特徴とする金属化フィルムコ
ンデンサの製造方法を提供するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention forms a metallicon on both end faces of a capacitor element wrapped with a metallized film, and then removes burrs from the metallicon, In the method for manufacturing a metallized film capacitor in which a lead wire is connected to the metallicon and an exterior is formed, after forming the metallicon,
The present invention provides a method for manufacturing a metallized film capacitor, characterized in that a capacitor element is subjected to heat treatment in which it is left in a high-temperature atmosphere before removing burrs.
（作用）
本発明によれば、コンデンサ素子の両端面にメタリコン
を形成後に、高温雰囲気中に放置しているために、素子
内のガスが膨張して素子外部に放出される。それ故、印
刷配線板に接続する際にコンデンサに熱が加えられても
破壊されることがない。(Function) According to the present invention, since the capacitor element is left in a high-temperature atmosphere after forming metallicon on both end faces, the gas inside the element expands and is discharged to the outside of the element. Therefore, even if heat is applied to the capacitor when connecting it to a printed wiring board, it will not be destroyed.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
先ず、ポリエステルやポリプロピレン等の＾分子フィル
ムに亜鉛やアルミ等の金属を蒸着した金属化フィルムを
巻回してコンデンサ素子を形成する。次に、このコンデ
ンサ素子をヒートプレスして扁平化し、テーピングする
。テーピング後、コンデンサ素子の両端面に亜鉛や鉛等
の溶融金属を吹き付はメタリコンを設ける。メタリコン
を設けた後、テープを剥離する。テープを剥離後、温度
１３０℃の高温雰囲気中に１６８ｒ程、コンデンサ素子
を放置する。放置後、メタリコンにより生じたバリを除
去する。バリを除去後、メタリコンにリード線を溶接等
により接続する。リード線を接続後、コンデンサ素子を
熱硬化性樹脂中にディップし、引き上げて加熱し、塗布
された樹脂を硬化して外装を形成する。First, a capacitor element is formed by winding a metallized film in which a metal such as zinc or aluminum is vapor-deposited around a molecular film such as polyester or polypropylene. Next, this capacitor element is flattened by heat pressing and taped. After taping, metallic contact is provided by spraying molten metal such as zinc or lead on both end faces of the capacitor element. After applying the metallicon, remove the tape. After peeling off the tape, the capacitor element is left in a high temperature atmosphere of 130° C. for about 168 r. After leaving it for a while, remove the burrs caused by metallicon. After removing the burr, connect the lead wire to the metallicon by welding or the like. After connecting the lead wires, the capacitor element is dipped into a thermosetting resin, pulled up and heated, and the applied resin is cured to form the exterior.
すなわち、本発明によれば、メタリコンを形成した後に
、高温雰囲気中に放置しているため、コンデンサ素子内
部のガスが外部に排出し、最終的に外装を形成した際、
コンデンサ素子内部にはほとんどガスは含まれていない
。それ故、コンデンサを印刷配線板に半田リフロー等に
より接続した場合でも、コンデンサが加熱されても内部
のガス膨張はほとんどなく、コンデンサ破壊が防止され
る。That is, according to the present invention, since the metallicon is left in a high temperature atmosphere after forming, the gas inside the capacitor element is discharged to the outside, and when the exterior is finally formed,
Almost no gas is contained inside the capacitor element. Therefore, even when the capacitor is connected to a printed wiring board by soldering reflow or the like, even if the capacitor is heated, there is almost no expansion of the internal gas, and destruction of the capacitor is prevented.
（発明の効果）
以上の通り、本発明によれば、コンデンサ内にほとんど
ガスが含まれないため、印刷配線板への接続時の破壊を
防止しつる金属化フィルムコンデンサの製造方法が得ら
れる。(Effects of the Invention) As described above, according to the present invention, since almost no gas is contained in the capacitor, it is possible to obtain a method for manufacturing a metalized film capacitor that prevents destruction during connection to a printed wiring board.
Claims (1)
面にメタリコンを形成した後、該メタリコンのバリを除
去し、前記メタリコンにリード線を接続し、外装を形成
する金属化フィルムコンデンサの製造方法において、メ
タリコンを形成後、バリを除去する前にコンデンサ素子
を高温雰囲気中に放置する熱処理を施すことを特徴とす
る金属化フィルムコンデンサの製造方法。(1) A method for producing a metallized film capacitor, in which metallized film is formed on both end faces of a capacitor element, burrs are removed from the metallized film, and lead wires are connected to the metallized film to form an exterior package. A method for manufacturing a metallized film capacitor, which comprises performing a heat treatment in which the capacitor element is left in a high-temperature atmosphere after forming the metallicon and before removing burrs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1699785A JPS61176109A (en) | 1985-01-31 | 1985-01-31 | Manufacture of metalized film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1699785A JPS61176109A (en) | 1985-01-31 | 1985-01-31 | Manufacture of metalized film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61176109A true JPS61176109A (en) | 1986-08-07 |
Family
ID=11931651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1699785A Pending JPS61176109A (en) | 1985-01-31 | 1985-01-31 | Manufacture of metalized film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61176109A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398058A (en) * | 1977-02-08 | 1978-08-26 | Hitachi Condenser | Manufacturing method of film capacitor element |
| JPS5785216A (en) * | 1980-11-18 | 1982-05-27 | Matsushita Electric Ind Co Ltd | Method of producing dry metallized polypropylene film condenser |
| JPS5931018A (en) * | 1982-08-16 | 1984-02-18 | ニツセイ電機株式会社 | Method of producing metallized plastic film condenser |
| JPS59215715A (en) * | 1983-05-23 | 1984-12-05 | マルコン電子株式会社 | Method of producing laminated ceramic capacitor |
-
1985
- 1985-01-31 JP JP1699785A patent/JPS61176109A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398058A (en) * | 1977-02-08 | 1978-08-26 | Hitachi Condenser | Manufacturing method of film capacitor element |
| JPS5785216A (en) * | 1980-11-18 | 1982-05-27 | Matsushita Electric Ind Co Ltd | Method of producing dry metallized polypropylene film condenser |
| JPS5931018A (en) * | 1982-08-16 | 1984-02-18 | ニツセイ電機株式会社 | Method of producing metallized plastic film condenser |
| JPS59215715A (en) * | 1983-05-23 | 1984-12-05 | マルコン電子株式会社 | Method of producing laminated ceramic capacitor |
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