JPS61173833A - Ic storage device - Google Patents

Abstract

PURPOSE:To enable an integrated circuit (IC) to be stored at a high speed and reduce a tact time, by storing the IC in an only-use magazine while the IC is slided on a guide rail by horizontally moving a pawl member of an IC conveying mechanism. CONSTITUTION:An integrated circuit (IC) extracting mechanism 1 clamps an IC 6 to be extracted from a substrate or a socket. A guide rail 2 is horizontally set to the inlet side of an only-use magazine 7. A shuttle conveying mechanism 3 horizontally moves an IC mounting shuttle 3A between an end part of the guide rail 2 and the IC extracting mechanism 1 placed in an IC delivery position. An IC conveying mechanism 4, having an IC pressing pawl member 4B, vertically and horizontally moves said pawl member 4B. Accordingly, an IC storage device, conveying the IC 6 to the end part of the guide rail 2 by the shuttle 3A of the shuttle conveying mechanism 3, stores in the only-use magazine 7 the IC 6 while it is slided on the guide rail 2 by horizontally moving the pawl member 4B of the IC conveying mechanism 4.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an IC storage device that extracts an IC from a board or socket and stores the IC in a dedicated magazine, and particularly relates to an IC storage device suitable for shortening takt time. Storage device K
r! Do IA.

[Background of the invention]

Remove the ICt from the base 1 & or socket and remove the IC.
For example, as a device for transporting the
A device as shown in Japanese Patent No. 7-176800 is known. This device is configured such that the IC extraction head performs both vertical movement for extracting the IC 1 and horizontal movement for transporting the extracted IC to a temporary storage position. However, since the IC extracting head is equipped with mechanisms S such as an IC clamp and an IC extracting operation, it has a corresponding weight and inertia, making it unsuitable for high-speed operation. In other words, it is difficult to perform the vertical movement for extracting the IC and the horizontal movement for temporarily storing the IC at high speed.
The drawback is that takt time cannot be shortened.

An object of the present invention is to provide an IC storage device that can shorten processing time.

[Summary of the invention]

The present invention has an IC extraction mechanism for extracting an IC from a board or socket by clamping it, a guide rail installed horizontally on the entrance side of a special macazine, and a seven-wheeler for placing the IC on the shuttle. The IC has a shuttle transport mechanism that is horizontally moved between the tip of the guide rail and the IC extracting mechanism located at the IC delivery position, and a claw member for pushing the IC, and the claw member can be moved vertically and horizontally. The machine C is equipped with a board transport mechanism and is transported to the tip of the idle rail by the shuttle of the Kuyator transport mechanism.
t-1 The IC is configured to be stored in a dedicated magazine while sliding on the tag guide rail by the horizontal movement of the claw member of the IC transport mechanism, and the IC is received from the IC extraction mechanism) and the IC is placed at the tip of the guide rail (temporarily stored). the shuttle to be transported to a position);
By making it a small and lightweight member on which only one IC is mounted, slow operation is possible and takt time is shortened.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. FIG. 1 shows a schematic side view of an IC storage device according to the present invention, and FIG. 2 shows its operation diagram. In FIG. 1, this IC storage device includes an IC extraction mechanism 1, a guide rail 2, a shuttle transport mechanism 3, a CWi transport mechanism 4, and a guide 5.

The IC extraction mechanism 1 consists of a vertically movable main body and two clamp claws 1B attached to the main body 10. The IC extraction mechanism 1 is made up of a vertically movable main body and two clamp claws 1B.
It is removable from the t-board or socket (not shown).

The guide rail 2 has a dedicated magazine 7 for storing ICs.
It is fixed horizontally on the entrance side of the

The shuttle transport fs machine 113 includes a shuttle 3A that can carry only one workpiece C6, and a moving shaft 3B that is connected to the shuttle 3A at one end and is supported by a bearing 3C and can be moved horizontally.
It consists of a lever 3D that is swingable about a support shaft 3B and whose tip end is engaged with the other end of the moving shaft 3B, and a cam 3F that swings the lever 3Dt. Then, by swinging the lever 3D't by the cam 3F, the shuttle 3At is horizontally moved between the IC ejector side 1 at the IC delivery position and the tip of the guide rail 2 via the moving shaft 3Bt. It has become.

The IC transport mechanism 4 includes a plurality of (three in the illustration) claws 4.
A first moving shaft 4C whose one end is connected to the four claw members and which is supported by a bearing 4D and is movable horizontally, and the other end of the first moving shaft and 4C. A first cam 4F that horizontally moves the first moving shaft +Ct via an actuating plate 4Et- attached to the second moving shaft 4G, which has one end connected to a bearing 4D and is supported by a bearing 4H and is movable up and down. It consists of a second cam 4 that moves up and down together with the second moving shaft 4Gf:m receiver 4D via an actuating plate 4J attached to the other end of the second moving shaft 4G. By vertically moving the second moving shaft 4G and bearing 4D't by the second cam 4K, the pawl member 4A is moved vertically via the first moving shaft 4C, and the first cam 4F moves the claw member 4A vertically. 1 By horizontally moving the moving shaft 4C, the claw member 4At
It can be moved horizontally.

The guide 5 is installed between the tip of the guide rail/I/2 and the C extraction mechanism 1 located at the delivery position, and the guide 5 is installed between the tip of the guide rail/I/2 and the IC extraction mechanism 1 located at the delivery position, and the guide 5 is installed between the top of the IC and the IC that is transported by three shuttlers from the delivery position to the tip of the guide rail 2. Shuttle 3 by guiding both sides
It is designed to prevent falling from A.

Next, the operation of this embodiment will be explained.

When the IC extraction mechanism 1 extracts the IC from the board or socket with its clamp claw 1B and moves to the delivery position as shown in FIG. Horizontal movement downward (forward)
let When the shuttle 3A is located below the IC extraction mechanism 1, the clamp claw IB releases the IC 6 and places it on the shuttle 3A. Thereafter, the cam 3F operates again to horizontally move (retreat) the shuttle 3At to the position of the tip of the guide rail 2, as shown in FIG. On the other hand, the machine C extractor W#1 descends to extract the next IC. shuttle 3
When a person is located at the tip of the guide rail 2, the second cam 4K of the IC transport @ 4 is activated and the claw member 4A is in the standby position.
lower to the IC pushing position. When the claws 4B of the four claw members engage with the rear surface of the IC 6, the first cam 4B operates and the magazine 7 exclusively for the claw members 4Affi is activated.
Move horizontally (retreat) in the direction. As a result, the machine 6 on the shaft 3A is remounted on the guide rail 2, and is stored in the dedicated magazine 7 while sliding on the guide rail 2. By repeating the above-described operations, the ICs extracted by the C extracting mechanism 1 can be stored one after another into the dedicated machine 7.

IC extraction mechanism 1 and shuttle transport mechanism 3 in this embodiment
An example of an operation timing chart of the IC transport mechanism 4 is shown in FIG.

Therefore, in this embodiment, the shuttle 3A of the shuttle transport mechanism 3 can be made of a small and lightweight member that can carry only one IC6t, which enables high-speed operation of the shuttle 3A and shortens the takt time. be able to.

Further, in this embodiment, the claw member 4 of the IC transport mechanism 4
AK A plurality of claws 4B are provided, and these claws 4B can be used to push the ICs on the shuttle 3A into the dedicated magazine 7 one after another, so the distance for one push of an IC can be shortened and the tact time can be reduced. Time and cost can be further reduced.

In this embodiment, the shuttle transport mechanism 3 and the IC transport mechanism 4 are operated by cams, but the present invention is not limited to this.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to speed up IC storage and shorten takt time.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of the IC storage device of the present invention, FIG. 2 is a side view showing its operating state, and FIG. 3 is a diagram showing an example of an operation timing chart. l...IC extraction mechanism 2...Guide rail 3
...Shuttle transport mechanism 3A...Shuttle 4
...IC transport mechanism 4A...claw member 6...
IC7...Special magazine. Liao I trouble

Claims (1)

[Claims] 1. Remove the IC from the board or socket and remove the IC from the board or socket.
It is a device that stores ICs in a dedicated magazine, and is used to extract and remove ICs from boards or sockets by clamping them.
It has a C extracting mechanism, a guide rail installed horizontally on the entrance side of the dedicated magazine, and an IC loading shuttle, and the shuttle is connected between the tip of the guide rail and the IC extracting mechanism located at the IC transfer position. a shuttle transport mechanism that can be moved horizontally between the two; and an IC transport mechanism that has a claw member for pushing an IC and that can move the claw member vertically and horizontally; An IC storage device characterized in that the transported IC is stored in a dedicated magazine while sliding on a guide rail by horizontal movement of a claw member of the IC transport mechanism. 2. The IC storage device according to claim 1, wherein the IC pushing claw member of the IC transport mechanism is provided with a plurality of claws that engage with the rear surface of the IC at equal intervals.