JPS61173137U - - Google Patents

Info

Publication number
JPS61173137U
JPS61173137U JP5804885U JP5804885U JPS61173137U JP S61173137 U JPS61173137 U JP S61173137U JP 5804885 U JP5804885 U JP 5804885U JP 5804885 U JP5804885 U JP 5804885U JP S61173137 U JPS61173137 U JP S61173137U
Authority
JP
Japan
Prior art keywords
electrode
flat plate
hard
elastic
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5804885U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5804885U priority Critical patent/JPS61173137U/ja
Priority to GB08609256A priority patent/GB2173949B/en
Priority to DE19863612813 priority patent/DE3612813A1/de
Publication of JPS61173137U publication Critical patent/JPS61173137U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP5804885U 1985-04-16 1985-04-16 Pending JPS61173137U (xx)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP5804885U JPS61173137U (xx) 1985-04-16 1985-04-16
GB08609256A GB2173949B (en) 1985-04-16 1986-04-16 Semi-conductor device
DE19863612813 DE3612813A1 (de) 1985-04-16 1986-04-16 Halbleiter-bauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5804885U JPS61173137U (xx) 1985-04-16 1985-04-16

Publications (1)

Publication Number Publication Date
JPS61173137U true JPS61173137U (xx) 1986-10-28

Family

ID=30583173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5804885U Pending JPS61173137U (xx) 1985-04-16 1985-04-16

Country Status (1)

Country Link
JP (1) JPS61173137U (xx)

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