JPS61172669A - Method for controlling automatic soldering system - Google Patents

Abstract

PURPOSE:To execute automatic soldering without wasteful waiting time by making such preparatory operation by which the regular operation optimum for work can be immediately started in accordance with the data read out of an upper computer. CONSTITUTION:The work P to be soldered is automatically soldered while the work is conveyed along a fluxer 2, a preheater 3 and a solder tank 5 by a conveyor 1. A means 22 for controlling solder temp. and a means 3a for controlling preheater temp. are first started at the set time and the 1st preparatory operation is made in this case. The 2nd preparatory operation to operate means 16, 17 for controlling the specific gravity of the flux in addition to the means 22 and the means 3a in accordance with the set value read out of the upper computer is then carried out. The regular operation to operate a means 29 for controlling conveyor speed in addition to the means 22, means 3a and the means 16, 17 in accordance with the set value read out of the upper computer is executed when the above-mentioned respective means satisfy the corresponding set values.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a control method for controlling an automatic soldering system based on data read out as necessary from a host computer.

[Conventional technology]

Generally, in an automatic soldering system, a conveyor conveys a workpiece to be soldered along a fluxer, a preheater, and a solder bath while soldering the workpiece.

When operating such a soldering system, traditionally,
Counting backwards from the start time, the timer operates at a predetermined time, energizing the solder heater, and then the sub-heater. When the start time arrives, the operation on switch is turned on to start the actual operation ( soldering operation).

[Problem that the invention seeks to solve]

However, the preheater temperature, soldering temperature, etc. differ slightly depending on the size of the printed wiring board to be soldered and the density of parts mounted, so the conventional uniform preparation operation time does not allow for changes such as the size of the printed wiring board. When actual operation is started, the preheater temperature, solder temperature, etc. are often not in an operating state suitable for the type of printed wiring board. Furthermore, it is virtually impossible to adjust the preparatory operation time before starting work each time depending on the printed wiring board. Therefore, there is often a wasted waiting time from the start time until the start of actual operation. ' The purpose of the present invention is to perform a preparatory operation based on the data read from the host computer according to the workpiece to be soldered so that the main operation optimal for the workpiece can be immediately performed, thereby reducing the time required until the main operation. The purpose is to eliminate it.

[Means for solving problems]

The first aspect of the present invention is an automatic soldering system in which a workpiece P to be soldered is soldered while being conveyed by a conveyor 1 along a fluxer 2, a preheater 3, and a solder bath 5. , the solder temperature control means 22 and the preheater temperature control means 3a are started to perform a first preparatory operation. .

Next, on the condition that the solder temperature reaches a predetermined temperature, in addition to the solder temperature control means 22 and the preheater temperature control means 3a, the flux specific gravity control means 16.17
A second preparatory operation is performed in which each of the two is operated based on the setting values read from the host computer 65.

Next, on the condition that each of the control means satisfies the corresponding set value, in addition to the solder temperature control means 22, the preheater temperature H8 means 3a, and the flux specific gravity control means IQ, 17, at least the conveyor speed 1ll.
A main operation is performed in which each of the I11 stages 29 is operated based on the setting values read from the host computer 65.

Furthermore, in the second aspect of the present invention, during the first preparatory operation,
Automatic control and manual control are selected, and in the automatic control, the same control method as in the first invention is performed, and in the manual control, the on-off type control means 19.2G, 24.2
This is a control method for an automatic soldering system in which a switch 8 or the like is turned on and off using a key input means.

[Effect]

In the first preparatory operation, the present invention first performs solder temperature control and preheater temperature control, which take time to reach the set value from startup, and takes into account that it takes time for solidified solder to melt. When the solder temperature reaches a predetermined temperature, a second preparation operation is started, and in addition to the solder temperature control and preheater temperature control described above, flux specific gravity IIIall, which requires less preparation time, is performed, and these control means perform preparation. Once completed, conveyor speed control means that do not require preparatory operation will be added and the actual operation will begin.

In addition, when necessary for maintenance etc.,
During preparatory operation, the control means is turned on and off using the key input means.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

FIG. 1 shows an outline of a soldering system, in which a fluxer 2, a preheater 3, a
A hot air fan 4, a solder bath 5, and a cooling fan 6 are arranged.

In FIG. 2, in the fluxer 2, the flux 10 is intermittently foamed by the air supplied from the compressor 7 to the foam tube 9 through the on/off solenoid valve 8 in conjunction with the detection of the printed wiring board P. Flux jetted from the nozzle 11 is applied to the lower surface of the printed circuit board P. A hydrometer 12 as a means for measuring flux specific gravity and a liquid level gauge 13 are inserted into the flux, and a stock solution tank 14 and a diluted solution tank 15 are connected via electromagnetic valves 16 and 17 as flux specific gravity control means. ing. The stock solution and the diluted solution may be supplied from a floor-mounted tank by air pressure via the electromagnetic valves 16 and 17.

The above-mentioned pre-heater 3 has a heating wire 3a as a pre-heater temperature control means wired over almost the entire surface of the case, and this heating wire 3a has a chromel-alumel thermal lightning pair 31 for measuring the ambient temperature of the heating wire 3a, Above heating wire 3
Infrared radiation thermometer 18 that measures the temperature of the lower surface (soldering surface) of the printed wiring board heated by a without contact.
The heating temperature is detected by a preheater temperature measuring means consisting of and proportionally controlled.

The hot air fan 4 includes a heater 19 and a fan motor 2.
0 is controlled to be turned on and off.

The solder bath 5 contains molten solder 2 which is initially melted by a melting heater 21 and maintained at approximately 250°C by a 1liI heater 22 serving as a solder temperature control means during operation.
3 is intermittently jetted from a nozzle 26 by a pump 25 driven by a motor 24 in conjunction with the detection of the printed wiring board P, and soldered to the lower surface of the printed wiring board P. The temperature of the molten solder is detected by a thermocouple 27 as one stage of solder temperature measurement and is proportionally controlled.

The cooling fan 6 is turned on and off by a motor 28.

The conveyor 1 is driven by a speed controllable ring cone motor 29 as a conveyor speed control means, and the conveyor speed is detected by a tachometer generator (hereinafter referred to as TG) 30 as a conveyor speed measurement means.

Figure 3 shows the operation unit that controls the above soldering system.
The main body case 33 includes an embedded keyboard (console) 34 as a key input means, a cathode ray tube display (hereinafter referred to as CRT) 35 as a display means, a printer 36 as a recording output means, and a main switch (manual switch). - control mode changeover switch (automatic-manual) 39, preparation on switch 40, preparation off switch 41, operation on switch 42, operation off switch 43, case 33
A switch 45 for stopping a warning light (trade name: PATLITE) 44 and a warning buzzer (not shown) provided on the upper side;
A switch 46 is provided to cancel the alarm.

In Figure 4, the keyboard 3 is stored under the CRT 35.
4 is pushed a little further inside, and is guided by the telescopic rail 47 and protrudes to the outside. A unit 48 such as a central processing unit (CPLJ), a unit 49 such as a CRT interface, and a unit 50 such as a power supply are provided at the rear of the CRT 35.

FIG. 5 is a block diagram showing the hardware relationship of this system control system, and includes a read-only memory (hereinafter referred to as ROM) 54 in which a control program for a microcomputer (hereinafter referred to as microcomputer) is stored and data of the microcomputer. A central processing unit (hereinafter referred to as CPU) that constitutes the microcomputer 56 along with a random access memory (hereinafter referred to as RAM) 55 used as memory.
57, the keyboard 34, CRT 35, printer 3;
6 and a calendar timer 58 that can set annual time programs in seconds by serial input/output (810) 59 or parallel input/output.
In addition to connecting via Qutobut (PIO) 60,
The various control means (collectively referred to as 61) in the conveyor 1, fluxer 2, preheater 3, solder Il' 15, fan 4.6, etc. of the automatic soldering system are described in the above PT.
06G via input/output (Ilo > 62, analog/digital converter (A/D) 63 or digital/analog converter (D/A) 64. The microcomputer 56 is connected to the input/output (Ilo > 62). A comparator circuit (not shown) is provided for performing feedback control by comparing the values.

Further, a host computer 65 is connected to the microcomputer 56 via an 81059. Various data corresponding to various types of workpieces are inputted into the host computer 65 for each control means, and the data is provided from the host computer 65 to the RAM 55 of the microcomputer 56.

For example, for a certain type of printed wiring board P, the specific gravity value of the flux is 0.83G, and the ambient temperature of the preheater (
(hereinafter referred to as preheater temperature) is 150℃, melted solder temperature is 250℃, and conveyor speed is 1.2s/sin.
These setting values are input to the host computer 65 as shown in FIG.

This host computer 65 controls the entire soldering system, and for example, when it is necessary to change the above data for each control means due to differences in the size of the printed wiring board P, the density of soldering parts, etc. Modified data is output from this host computer 65 at any time.

Then, in the fluxer 2, the hydrometer 12 and the liquid level gauge 1
The measured value of the flux specific gravity measuring means consisting of 3 is A/D converted and inputted to the microcomputer 56, which is compared with the set value given from the host computer 65, and based on the error between the set value and the measured value, the microcomputer From 56 to Ilo, a solenoid valve 18.17 serves as a flux specific gravity control means.
On/off control commands are output for each.

In the preheater 3, the measured value of the preheater temperature measuring means consisting of the thermocouple 31 and the infrared radiation thermometer 18 is measured by the A/D.
It is converted and input to the microcomputer 56, which is compared with the set value given from the host computer 65, and based on the error between the set value and the measured value, the microcomputer 56 sends Ilo
A proportional control command is output to the heating wire 3a as preheater temperature control means.

In the solder bath 5, the measured value of the solder temperature measuring means consisting of the thermal lightning pair 27 is A/D converted and inputted to the microcomputer 56, which is compared with the set value given from the host computer 65, and the set value and the measured value are compared with the set value given from the host computer 65. Based on the error from the value, a proportional control command is outputted from the microcomputer 56 via Ilo to the control heater 22 as a wet solder coal control means, and the solder temperature is set to 250°C. Note that the melting heater 21
is controlled to be turned off when the solder fAa reaches 200° C. according to the initial setting value written in the RAM 55.

In the conveyor 1, the measured value of the conveyor speed measuring means consisting of the TG 30 is A/D converted and inputted to the microcomputer 56, which is compared with the set value given from the host computer 65, and the set value and the measured value are compared. Based on the error, the microcomputer 56 outputs an autorator MINI command to the ring cone motor 29 as a conveyor speed control means through D/A conversion.

In addition, when the printed wiring board P on each unit such as a fluxer or a solder beam is detected by a switch (not shown),
The solenoid valve 8 in the air supply line to the foam tube 9 of the fluxer 2 is controlled from closed to open, and the nozzle 11 foams (intermittent foaming method). The valve 69 is opened to supply compressed air from the compressor 7, and the air is blown onto the printed wiring board P to remove the excess flux. &lJwJ at high speed, and the wave of molten solder jetted from the nozzle 26 is switched from a low level to a low level (intermittent jet method). These intermittent operations are performed by the microcontroller 5.
Managed by 6.

Next, the program for this entire system is shown in the flowchart shown in FIG. Note that Sn in the figure indicates each step of the flowchart.

When the program starts and the microcomputer 56 is selected by the host computer 65 (S), the microcomputer 5G reads control data from the host computer 65 and sends it to the RA.
The data is stored in M55 (S2). For example, the setting value for solder temperature (250°C), the setting value for preheater temperature (150°C), the setting value for flux specific gravity, the setting value for conveyor (7 speeds), and the setting value for each heater 3.
21 and 22, and data regarding the operating time of the printer 36, etc. are read from the host computer 65.

Then, when it is set, 1! ll (e.g. 6:30)
At S3), the solder heaters 21 and 22 are energized so that the solder temperature reaches the set value (250°C).
The solder temperature is controlled (S4), and when the preheater 3 reaches the set time (S5), the preheater 3 is controlled so that the preheater temperature reaches the set value (150°C).
Electrification is started to the electric heater @3a, and preheater temperature control is performed (S6).

This initial solder temperature control and preheater temperature control are
Kotobi will be driving.

Next, during the first preparatory operation, manual υ control and automatic f, l
Select J control (S7).

If manual control is selected in S7, for example, ■Preheater 3, ■Solder motor 24, ■Fan motor 28, ■
On-off control means (control units) such as the conveyor motor 29, heat immersion fan motor 20 and heater 19, and cleaning m (not shown) are displayed on the CRT 35, so you can use the keyboard as needed during maintenance etc. 34 to make a selection from ■ to ■ and press the return key (on) for operation or the space key (off) for stop (S8). unit) can be started or stopped manually (S9), return to 83 by pressing the end key, or otherwise return to S8's number ■-■ selection and on/off selection (Sl.). Note that the preheater 3 and the conveyor motor 29 are feedback-controlled in the on state.

If you return to S7 and select automatic control, it is checked whether there is any data change from the host computer 65 (S11), and if there is a change, the process returns to S2 to store new data from the host computer and update it. Based on the data,
Control solder temperature and preheater temperature.

If there is no data change from the above-mentioned host computer,
It is determined whether the preparation on switch 40 is ready for reception (S1□). For example, the soldering temperature is at least 200℃
It is determined whether the solder temperature has reached (YES) or not (No). If the solder temperature has not been reached, S12 is repeated from S to 813 when the solder temperature reaches 200°C.
Proceed to.

If the preparation on switch 40 is not pressed in this S13,
Step 813 is repeated from step S, and when the preparation on switch 40 is pressed, feedback control is performed for the solder temperature and preheater temperature as well as the flux specific gravity using the set values read from the host computer as target values (814). , a second preparatory operation is performed.

Next, when the preparation off switch 41 is turned on, the process returns to S3.
Only the solder temperature and preheater temperature are tsm until the preparation on switch is turned on in S13.

By leaving the preparation off switch 41 off, the process advances to S16, where it is determined whether the preparation is complete. That is, it is determined whether the solder temperature, preheater temperature, and flux specific gravity have all reached set values.

If the preparation is not completed, check whether there is any data change from the host computer (511). If there is a data change, you can return to S2 and start over from the first preparation operation. If there is no data change, proceed to S14. Then, the second preparation operation is continued.

Return to S18 and if the preparation is complete, turn on the operation on switch 4.
The main operation (soldering) starts when S1 is turned on (S1
8) Based on the setting values read from the host computer, in addition to feedback control of the solder temperature, preheater temperature, and slack specific gravity, feedback control of the conveyor speed is performed (S19), and at the same time, the fan motors 2G, 28, and the cleaning machine are controlled. (not shown),
On/off type control means such as the hot air heater 19 and the soldering motor 24 are started (S2o). This main operation continues unless the preparation off switch 41 or the operation off switch 43 is turned on and there is no data change from the host computer, and when the preparation off switch is turned on (82
1) Return to the first preparatory operation of step 83, and when the operation off switch is turned on again (S22), return to the second preparatory operation of S14.

Furthermore, the presence or absence of data changes from the host computer is checked (523), and if there are any data changes, an indication of operation stop is displayed on the CRT 35 (S24).

This operation stop is only displayed and is not executed as it is, and the process returns to S19, so by turning on the preparation off switch in S21, the process returns to S3, and then returns to S2 via 811, where changes are made from the host computer. The existing data is stored, and IIJ III is performed based on the changed data.

Note that the feedback control described above is not limited to the four control means, for example, the higher-level computer 6
5, enter a large amount of data regarding the width of the conveyor corresponding to the size of the printed wiring board, and when the size of the printed wiring board is changed, data changes from the host computer will change the distance between the pair of conveyor chains of conveyor 1. The interval may be automatically adjusted. Specifically, the front and rear of the conveyor frame that supports the conveyance cheno on one side,
Translation in the width direction is achieved using a ball screw or the like configured to rotate synchronously.

〔Effect of the invention〕

According to the first aspect of the present invention, the vII, which requires time for preparatory operation, is based on the setting values given from the host computer.
Since the operation is started sequentially from means I1, the main operation (soldering operation) can be started immediately at the start of work under the optimum conditions for the work, and there is no wasted time.

Further, since the operating setting values of each control means are obtained from the host computer, the setting values can be easily changed as needed, and it is possible to easily respond to changes in the workpiece, etc.

Further, according to the second aspect of the present invention, during the initial first semi-operation, automatic control and manual tI11w are selected, and in manual control, the on-off type control means is turned on and off by key input means. Therefore, in the state where the solder is melted in the first preparatory operation, the on-off type control means such as the soldering motor can be selectively driven by key operation of the key input means, and maintenance can be easily performed.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention, in which Fig. 1 is a plan view showing an overview of the system equipment +1nii section, Fig. 2 is a sectional view thereof, Fig. 3 is a perspective view of its control operation section, and Fig. Figure 4 is a cross-sectional view of the system, Figure 5 is a block diagram showing the hardware relationship of the system control system, and Figure 6 is the system illumination.
2 is a flowchart showing a II-based software program. P...Print placement as work 1! Board, 1...conveyor, 2...fluxer, 3...preheater, 5...solder bath, 3a...heating wire as preheater temperature control means, 16.17...as flux specific gravity control means?
t1 magnetic valve, 22... solder a! Heater as melon control means, 24... Solder motor as on/off type control means, 29... Motor as conveyor speed control means,
34... Keyboard as key input means, 65... Upper level computer.

Claims (2)

[Claims] (1) The work to be soldered is transported by a conveyor.
In an automatic soldering system that performs soldering while transporting a fluxer, a preheater, and a solder bath, at a set time, the solder temperature control means and the preheater concentration control means are started to perform a first preparatory operation, and the solder temperature is adjusted. has reached a predetermined temperature, a second preparatory operation is performed in which the solder temperature control means and preheater temperature control means as well as the flux specific gravity control means are each operated based on the set values read from the host computer, and each of the above On the condition that the control means satisfy the corresponding set values, in addition to the solder temperature control means, preheater temperature control means, and flux specific gravity control means, at least the conveyor speed control means are each operated based on the set values read from the host computer. A control method for an automatic soldering system, characterized in that a main operation is performed. (2) The work to be soldered is transported by a conveyor,
In an automatic soldering system that performs soldering while transporting a fluxer, a preheater, and a solder bath, the solder temperature control means and the preheater temperature control means are started at a set time to perform a first preparatory operation. 1. During the preparation operation, automatic control and manual control are selected, and in automatic control, on condition that the solder temperature reaches a predetermined temperature, in addition to the solder temperature control means and preheater temperature control means, the flux specific gravity control means is The second
After performing the preparatory operation, on the condition that each of the above-mentioned control means satisfies the corresponding set value, in addition to the above-mentioned solder temperature control means, preheater temperature control means, and flux specific gravity control means, at least the conveyor speed control means are controlled from the host computer. A method for controlling an automatic soldering system, characterized in that the main operation is carried out based on the read setting values, and in the manual control, the on-off type control means is turned on and off by means of a key input means.