JPS61172359A - Plating treatment device and plating treatment to be performed using plating treatment device thereof - Google Patents

Abstract

PURPOSE:To reduce it for samples to be contaminated after being treated by a method wherein the conveying mechanisms for the samples in both of the flux tank part and the solder coating part are made to differ from the conveying mechanisms for the samples, which are started from the cleaning part on. CONSTITUTION:Semiconductor devices, which are fed from a loader 15, are conveyed on a rail 16 being spanned a flux tank 18 by a pin 34 being provided at a conveying lever 33 with the drive of the chains 31 of the first conveying mechanism. As flux liquid is jetting in the flux tank 18, the flux adheres not only on the leads 46 of the semiconductor devices 44 but also on packages 45, the pins 34 and the chains 31. Moreover, the flux to adhere on the semiconductor devices 44 is turned into vaporized state by the heat of the fused solder in the solder coating part and adheres on the pin 34, the chains 31 and so forth, while as the spin 34 and the chains 31 are never made to enter to a cleaning part 22 and a drying part 26, it is reduced that the flux to adhere on the pin 34 and the chains 31 is brought in to the cleaning part 2 and the drying part 26. As a result, it is reduced that the mediums to be cleansed or the mediums to be dried are contaminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a plating technology, and particularly to a technology that is effective for use in soldering the leads of electronic components such as semiconductor devices.

[Background technology]

Fig. 11 shows a conventional solder processing device (Japanese Patent Application Laid-open No. 1983-
158993).

This solder processing apparatus includes a supply section 1 that supplies electronic components to a soldering processing line, a flux application section 2 that applies 7 lux to the lead portions of the electronic components that are to be soldered, and a flux application section 2 that applies solder to the lead portions. The solder adhesion part 3, the cleaning part 4 which washes and removes the 7 lux adhering to the electronic components, the drying part 5 which dries the cleaning medium, and the collection part 6 which collects the electronic parts after the soldering process has been completed. Then, the electronic components are transferred from the supply section 1 to each soldering section 2.3. 4. It consists of a moving mechanism (FIG. 12) that moves the electronic components to the collection section 6 via the electronic components 5, and a guide mechanism 7 that guides the electronic components being moved.

The supply unit 1 has a storage magazine 9 that stores a plurality of electrical parts 8 (FIG. 11), and the storage is carried out by the endless conveyor and feed pin 12 of the moving mechanism 10 provided above the guide mechanism 7. Electronic components 8 are supplied from the magazine 9 to the rails 13 of the guide mechanism 7.

The present inventor performed solder processing on the lead portion (hereinafter referred to as lead) of a semiconductor device as a sample using a solder processing apparatus configured similarly to the solder processing apparatus described above.
The following problems were identified.

That is, the problem is that the semiconductor device is contaminated after soldering. The inventor of the present invention has thoroughly studied this problem and found that since the semiconductor device is transported from the supply section through each soldering section to the recovery section using the same transfer pin, 7 lux is deposited. Flux adhering to the conveyor pins in the solder application area is carried to the cleaning and drying areas, contaminating the cleaning medium or drying medium in the cleaning and drying areas, and as a result, the semiconductor device as the object to be processed may be contaminated. It became clear that it could not be cleaned and dried properly.

Additionally, since the flux bath used in the 7Lux attachment area is strongly acidic, if the flux adhering to the semiconductor device package or leads cannot be completely removed, 7Lux will be released into the package along with moisture from the gap between the package and the leads. It was also revealed that there is a problem in that the particles penetrate inside the package and corrode the electrical connections inside the package, causing failure of the semiconductor device.

The present inventor has arrived at the present invention as a result of extensive research into solder processing techniques that can reduce stains remaining on samples after treatment or re-adhesion.

[Purpose of the invention]

An object of the present invention is to provide a plating treatment technique that reduces staining of a sample after treatment.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, by making the transport mechanism for the sample in the 7lux and solder application section different from the transport mechanism for the sample after the cleaning section, the transport mechanism can transfer the flux to the cleaning section and the drying section. Since the sample can be washed and dried with a clean cleaning medium or a clean drying medium, the soldering process can be performed with less contamination of the sample after processing.

[Embodiment 1] FIG. 1 is a schematic perspective view showing a solder processing apparatus, which is an embodiment of the present invention.

FIG. 2 is a schematic front view showing the vicinity of a hot water cleaning tank of a solder processing apparatus according to an embodiment of the present invention.

In FIG. 1, 14 indicates a solder processing device.

Reference numeral 15 denotes a loader as a supply section, which stores semiconductor devices housed in a magazine (not shown) and can supply the semiconductor devices to rails to be described later. In this example, a semiconductor device having leads protruding from the side surface in the longitudinal direction of the package is used as a sample. 16 is
A plurality of rows of rails are laid from the loader 15 to the unloader described later. The semiconductor device is placed on the rail 16 with the rail 16 sandwiched between the leads in a direction perpendicular to the longitudinal direction of the semiconductor device, and is transported by a transport mechanism to be described later. Reference numeral 17 denotes a 7 lux adhesion section, which includes a flux tank 18 for applying 7 lux to leads (not shown), which are parts of the semiconductor device to be soldered.

The flux tank 18 is supplied with 7 by a pump or the like (not shown).
By jetting the lux liquid, it is possible to deposit 7 lux onto the leads of the semiconductor device.

Reference numeral 19 is a heating section, which has a function of heating the semiconductor device to which flux has been applied in the slack application section 17 to about 100 degrees (by means of a hot air mechanism (not shown) or the like).

Reference numeral 20 denotes a solder application portion, and a solder bath 21 is provided for applying solder to the leads of the semiconductor device after 7 lux has been applied. The solder tank 21 is configured to melt the solder using a heater (not shown) and to cause the melted solder to flow out using a pump (not shown) to adhere the solder to the leads of the semiconductor device. Reference numeral 22 is a cleaning unit that can thoroughly clean the semiconductor device after solder has been applied using three types of cleaning tanks. Reference numeral 23 denotes a hot water cleaning tank for rough cleaning, in which cleaning water heated to about several tens of degrees is jetted by a pump or the like (not shown) to clean the semiconductor device after soldering. There is.

The rail 16 laid in the hot water washing tank 23 has a series of openings in the longitudinal direction of the rail (not shown), and from the opening,
A transport lever (not shown) is adapted to protrude. In the hot water cleaning tank 23, the semiconductor device is transported by the rectangular movement of the transport lever. Reference numeral 24 denotes an ultrasonic cleaning tank, which is capable of cleaning semiconductor devices by applying vibrations of approximately several tens of KHz to the cleaning water using an ultrasonic oscillation mechanism (not shown). Reference numeral 25 denotes a finishing cleaning tank, which is capable of cleaning semiconductor devices with cleaning water.

Reference numeral 26 denotes a drying section, in which the cleaned semiconductor device is drained using compressed air and then dried using a hot air mechanism or the like. Reference numeral 27 denotes an unloader that can accommodate and store semiconductor devices after soldering in a magazine.

Reference numeral 28 denotes a first transport mechanism that can transport the semiconductor device supplied from the loader 15 through the flux application section 17 to the vicinity of the cleaning section 22 population. 29.3
0 is a sprocket, which is arranged near the loader 15 and near the cleaning section 22, respectively, and a chain 31 is placed between them. The chain 31 is driven by the rotation of a sprocket 30 connected to a motor (not shown). Reference numeral 32 denotes a connecting member that connects a conveyance lever, which will be described later, to the chain 31. Reference numeral 33 denotes a conveying lever, which is substantially orthogonal to the longitudinal direction of the rail 16, supports the plurality of rails 16, and supports the magnetic pin 34. In other words, the first transport mechanism 28 is driven by the chain 31 and the transport lever 33
The semiconductor devices supplied from the loader 15 are conveyed by the pins 34 to the vicinity of the cleaning section 22, that is, to the vicinity of the hot water cleaning tank 23. 35 is a second transport mechanism that can transport the semiconductor device from near the exit of the hot water cleaning tank 23 to the unloader 27. 3
6.37 is a sprocket, and a sprocket 36 and a sprocket 37 are arranged near the outlet of the hot water cleaning tank 23 and near the unloader 27, respectively. 38 is a chain, the sprocket 36 and the sprocket 37
bridged between. The chain 38 is driven by the rotation of a sprocket 36 connected to a motor (not shown). Reference numeral 39 is a connecting member that connects a conveyance lever, which will be described later, to the chain 38. Reference numeral 40 denotes a conveyance lever, which is substantially orthogonal to the longitudinal direction of the rails 16 and supports pins 41 corresponding to the plurality of rows of rails 16. The second tab conveyance mechanism is driven by the chain 38, and is driven by the pin 4 through the conveyance lever 40i.
1, the semiconductor device cleaned in the hot water cleaning tank 23 is transported to the unloader 27 via each processing section.

According to the configuration shown in FIG. 1 described above, the first transport mechanism 28 is provided with two transport levers, and the second transport mechanism is provided with one transport lever. It is preferable to provide a larger number of transport levers.

In FIG. 2, 42 is a semiconductor device as a sample. 43 is a package for a semiconductor device; 044 is a package for a semiconductor device;
This is a lead for semiconductor devices. A transport lever 45d is provided corresponding to the plurality of rows of rails 16 spanning the hot water washing tank 23.

The transport lever 45 is connected to the rail 16 that spans the hot water washing tank 23.
The semiconductor device 42 is transported by performing a rectangular movement along an opening (not shown).

Note that the solder processing apparatus of this embodiment performs various processing while transporting semiconductor devices along a rail.

Hereinafter, the operation of the solder processing apparatus having the above-mentioned configuration will be explained.

In FIG. 1 or 2, a plurality of semiconductor devices (not shown) stored in a magazine of a loader 15 are supplied to a plurality of rows of rails 16, respectively. Loader 1
As the chain 31 of the first transport mechanism 28 is driven, the semiconductor devices supplied from the first transport mechanism 28 are transported on the rail 16 extending over the flux tank 18 by the bin 34 provided on the transport lever 33. At this time, 7 lux is deposited on the leads of the semiconductor device by the jetting flux liquid. The semiconductor device coated with flux is heated by a hot air mechanism provided in the heating section 19. The heated semiconductor device has its leads covered with solder in a solder bath 21 .

Next, the semiconductor device 42 is transported by the pins 34 to a point close to the hot water cleaning tank 23, and is then roughly cleaned while being transported on the rail 16 spanning the hot water cleaning tank 23 by the rectangular movement of the transport lever 45. The roughly cleaned semiconductor device 42 is transported from near the outlet of the hot water cleaning tank 23 as the chain 38 of the second transport mechanism 35 is driven.
It is transported by a bin 41 provided on a transport lever 40 and is subjected to ultrasonic cleaning in an ultrasonic cleaning tank 24 . After the ultrasonic cleaning has been completed, the semiconductor device is thoroughly cleaned in the final cleaning tank 25, transported to the drying section 26, and after being drained by compressed air, it is dried by the hot air mechanism, and the series of soldering processes is completed. . The semiconductor devices after the soldering process are stored in a magazine inside the unloader 2 and stored therein.

By the way, in the flux tank 18, since the 7 lux liquid is flowing, not only the leads 46 of the semiconductor device 44 but also the package 45, the pins 34, the chain 31, etc.
There are also 72 tux attached to it.

Furthermore, in the solder attachment area, the 7 lux adhering to the semiconductor device 44 becomes vaporized by the heat of the molten solder.
It adheres to the pin 34, chain 31, etc.

However, according to the soldering technology described above, the bottle 3
4 and the chain pressure 31 do not enter the washing section 22 and drying section 26, so that the 7 lac attached to the bottle 34 and chain 31 is less likely to be brought into the washing section 22 and drying section 26. Contamination of the cleaning or drying media is reduced. Therefore, the semiconductor device after soldering can be thoroughly cleaned and dried.

Furthermore, since the semiconductor device can be thoroughly cleaned, it is possible to reduce the amount of dirt on the semiconductor device caused by soldering, and it is possible to reduce appearance defects of the semiconductor device due to adhesion of dirt.

Furthermore, since the semiconductor device can be thoroughly cleaned, corrosive components contained in the flux that corrode the electrical connections inside the package can be removed, and failures of the semiconductor device due to corrosive components entering the package can be reduced.

Since the cleaning medium is less contaminated, semiconductor devices can be cleaned quickly and cleanly.

Since contamination of the cleaning medium is reduced, the number of times the cleaning medium is cleaned can be reduced, and cleaning of the cleaning medium is facilitated.

In the above-mentioned nine embodiments, the transport mechanism up to the solder application part and the subsequent parts are separated, but the flux adhering to the transport mechanism at the flux application part and the solder application part is removed by a cleaning section,
It is sufficient to configure the transport mechanism to reduce the amount of particles carried into the drying section, and various methods can be considered, such as making the transport mechanism independent for at least the 7,7x adhering section.

[Embodiment 2] FIG. 3 is a schematic perspective view showing a solder processing apparatus according to another embodiment of the present invention.

FIG. 4 is a schematic perspective view showing the carrier jig.

FIG. 5 is a partially exploded side view showing the 10th-da.

FIG. 6 is a partially fragmented front view seen from the X-ray arrow in FIG. 5.

FIG. 7 is a schematic plan view showing the 20th-da.

FIG. 8 is a schematic plan view showing the U-turn section.

FIG. 9 is a schematic front view showing the empty magazine stock section.

FIG. 1O is a schematic plan view showing the seventeenth unloader.

In FIG. 3, 45 is the first loader, which has a function of storing carrier jigs in multiple stages in which magazines containing semiconductor devices to be soldered are placed in six rows, and separating the magazines and carrier jigs. have

Reference numeral 46 denotes the 20th holder, which can supply the semiconductor devices in the magazine to a slack attachment section to be described later.

47 is an empty carrier stock part, and the 10th-da 45
It has the function of storing separated carrier jigs in multiple stages. 48 is an empty magazine stock section, and the 20th-
At the magazine 46, semiconductor devices are supplied and empty magazines can be stored in six rows and stages. 49 is a 7 lux deposition part, and a 7 lux tank 50 for depositing 7 lux on the leads, which are the parts to be soldered, of the semiconductor device.
It is equipped with The flux tank 50 is configured such that a pump or the like (not shown) causes a jet of flux to adhere to the leads of the semiconductor device. 5
Reference numeral 1 denotes a heating section, which can heat the semiconductor device to which 7 lux has been applied in the flux application section 49 to about 100 degrees by means of a hot air mechanism (not shown). Reference numeral 52 denotes a solder application portion, and a solder bath 53 is provided for applying solder to the leads of the semiconductor device after flux application. In the solder tank 53, the solder is melted by a heater (not shown), and the molten solder is jetted by a pump or the like shown in the figure, so that the solder can be applied to the leads of the semiconductor device. There is. Reference numeral 54 is a cooling unit, and the semiconductor device after soldering can be cooled by a fan or the like (not shown). Reference numeral 55 denotes a rough cleaning section, which includes a hot water cleaning tank 56 in which cleaning water heated to about several tens of degrees is jetted by a pump or the like (not shown) to roughly clean the semiconductor device after soldering. 57 is a U-turn section, rough cleaning section 55
The semiconductor device cleaned by the ultrasonic cleaning section can be transported to the vicinity of the entrance of the ultrasonic cleaning section, which will be described later.

In this embodiment, the semiconductor device is soldered while being transported in a substantially U-shape.

58 is a rail, and the 20th-da 46 and the U
The turn portion 57 is connected to the flux applied portion 49. Heating section 51. Solder application part 52. Cooling section 54, rough cleaning section 55
It is set up so that it spans the The rails 58 are laid in six rows. The semiconductor device is placed on the rail 58 with the rail 58 sandwiched between the leads in a direction perpendicular to the longitudinal direction of the semiconductor device, and is transported by a transport mechanism to be described later. 59 is the first transport mechanism, and the 20th-da 4
The semiconductor device supplied from 6 can be transported to the U-turn section 57. The sprocket (not shown) and the sprocket 60 are located near the 20th-da 46 protrusion and U, respectively.
It is provided near the turn section 57, and the sprocket 61.
62 is located between them. Reference numeral 63 denotes a chain, which is stretched between a sprocket (not shown) provided near the 20th-da 46 exit and the sprocket 60. The chain 63 is driven by the rotation of a sprocket 60 connected to a motor (not shown). Reference numeral 64 denotes a connecting member that connects a conveyance lever, which will be described later, to the chain 63. Reference numeral 65 is a conveyance lever, which is substantially perpendicular to the longitudinal direction of the rails 58 and supports pins 66 corresponding to six rows of rails 58. The first transport mechanism 59 drives the chain 63 and transports the semiconductor devices supplied from the 20th machine 46 through the transport lever 65 and the bin 66.
The vehicle will be transported to a U-turn section with 57 passengers. 67
The ultrasonic cleaning section 68 is equipped with an ultrasonic cleaning tank 68 that can clean semiconductor devices by applying vibrations of several tens of KHz to the cleaning water using an ultrasonic oscillation mechanism (not shown). 6
Reference numeral 9 includes a final cleaning tank 70 in which semiconductor devices can be cleaned using cleaning water in the final cleaning section. Reference numeral 71 is a water draining section, and the cleaning water adhering to the semiconductor device cleaned in the final cleaning section 69 can be removed by a compressed air blowing mechanism or the like (not shown). Reference numeral 72 denotes a drying section that can dry the semiconductor device after draining water using a hot air mechanism (not shown) or the like. Reference numeral 73 denotes a first unloader, which is capable of storing semiconductor devices after soldering into a magazine. 74 is a rail that connects the U-turn section 57 and the first unloader 73, the ultrasonic cleaning section 67, the finishing cleaning section 69. Drainer section 71. It is provided so as to span the drying section 72. The rail 74 is
It is laid out in 6 rows. The semiconductor device is placed on the rail 74 with the rail 74 sandwiched between leads extending perpendicular to the longitudinal direction of the semiconductor device, and is transported by a transport mechanism to be described later. Reference numeral 75 denotes a second transport mechanism that can transport the semiconductor device from the U-turn section 57 to the first unloader 73. The sprocket 76 and the sprocket (not shown) are located near the U-turn portion 57, respectively.
The first unloader is installed near the 73rd population,
77.78 are placed between them. 79 is
It is a chain, and is stretched between sprockets provided near the sprocket 76 and the first unloader 73. Chain 79 connects a motor etc. (not shown)
It is designed to be driven by the rotation of the sprocket 76. Reference numeral 80 denotes a connecting member that connects a conveyance lever, which will be described later, to the chain 79.

Reference numeral 81 denotes a transport lever, which supports a pin 82 corresponding to the rail 74.

The second transport mechanism 75 transports the semiconductor device coming out of the U-turn section 57 via the transport lever 81 and the pin 82 by driving the chain 79 to the first unloader 73.
It is intended to be transported up to

Reference numeral 83 denotes a transport unit that can transport a magazine containing soldered semiconductor devices to a second unloader, which will be described later. A second unloader 84 is capable of accumulating the magazines conveyed by the conveyance section 83 in a plurality of rows and stages.

Note that the term "exit" and "inlet" refer to the part where the semiconductor device is taken out as the exit, and the part where the semiconductor device is brought in as the entrance.

In FIG. 4, reference numeral 85 indicates a carrier jig, and reference numeral 086 indicates a magazine support lever, two of which are arranged in parallel, and pins 87 and 88 of different heights are provided alternately in the longitudinal direction of the top surface. ing. 89 is a magazine, and a series of openings 90 are provided in the longitudinal direction of the upper surface of the magazine. A series of recesses 91 are provided in the longitudinal direction of the lower surface of the magazine 89 to support the lower surface of the package of the semiconductor device. The pin 88 is provided corresponding to the recess 91 of the magazine 89, and is lower in height than the pin 87. The height of the pin 87 is such that it can suppress the movement of the magazine 89 from the sides in the longitudinal direction of the magazine. The pick magazine 89 is placed in such a way that the longitudinal sides of the carrier jig 85 are held by the pins 87 , and the recess 91 of the magazine 89 is supported by the pins 88 . be done. At this time, pins 87, 882>!
, 2 to support the inside of both longitudinal ends of the magazine 89.
According to the book fixing member 92, the magazine support lever 86
is fixed.

In FIG. 5 or 6, 93 is a pawl mechanism that allows the pawl 94 to slide freely in its longitudinal direction. The pawl 94 is connected to the magazine support lever 86
By hooking both longitudinal ends of the carrier jig 85, the carrier jig 85 can be supported.
5 is stored in multiple stages. Reference numeral 95 is a chain and is disposed below the outside of the magazine support lever 86 of the carrier jig 85, and is connected to the first loader 45, the 20th loader 46 . It spans the empty magazine stock section 48, the first unloader 73', and the transport section 83. The chain 95 is driven by the rotation of a sprocket 96 connected to a motor (not shown) or the like. The chain 95 is alternately provided with pins 98 and 99 similar to the pins 87 and 88 of the carrier jig 85 via an attachment 97 so that the magazine 89 can be supported by the pins 98 and 99. It has become. 100
is a rail, and its longitudinal direction is in the same direction as the longitudinal direction of the chain 95. The rails 100 are arranged in double rows and are capable of supporting the fixing member 92 of the carrier jig 85. The rails 100 are arranged in double rows to support the fixing member 92 of the carrier jig 85. The carrier jig 85 is conveyed until the end.

Reference numeral 102 denotes a carrier jig support body, which has a longitudinal direction corresponding to the magazine support lever 86 of the carrier jig 85. By supporting the magazine support lever 86, the carrier jig 85 It is now possible to support The carrier jig support 102 can be moved up and down by a cylinder mechanism 103. 104 indicates a semiconductor device.

In FIG. 7, reference numeral 105 denotes a push-out mechanism, which has a lever 106 whose longitudinal direction is orthogonal to the longitudinal direction of the magazine 89, and which is connected to a female threaded body 107.

The female screw body 107 can be moved along the guide 109 by rotation of the male screw 1080 connected to a motor (not shown). A bottle 110 is attached to the lever 106 in correspondence with the opening 90 of the magazine 89. By rotating the tab and male screw 108 and moving the lever 106 to which the bottle 110 is attached, υ
, a semiconductor device 104 is transported on a rail 58 spanning a flux tank 50.

In FIG. 8, 111 is a U-turn mechanism. 11
Reference numeral 2 denotes a chain arm, which extends in a direction substantially perpendicular to the longitudinal direction of the rail 58, and is arranged to connect the hot water cleaning tank 56 and the ultrasonic cleaning tank 68. chain 1
12 can be rotated and driven between the hot water cleaning tank 56 and the ultrasonic cleaning tank 68 by rotation of a sprocket (not shown). A magazine 113 is similar to the magazine 89, and has a series of openings 1 in the longitudinal direction of its upper surface.
14 are provided. The magazine 113 is attached to the rail 58
Six magazines 1 are attached to the chain 11]2 corresponding to the six rails 58, and six magazines 1 corresponding to the six rails 58 are attached to the chain 11]2.
If 13 is one set, a plurality of sets are attached to the chain 112. Reference numerals 115 and 116 denote extrusion mechanisms, which are constructed in the same manner as the extrusion mechanism 105, so the explanation will be omitted.
The extrusion mechanism 116 includes 1,
The semiconductor devices 104 in the magazine 113 can be transported onto the rails 74. In other words, the semiconductor device 104 after rough cleaning is placed in the magazine 113 of the U-turn mechanism 111 and transported to the ultrasonic cleaning tank 68 by the rotational drive of the chain 112, and then transported onto the rails 74. It is.

In FIG. 9, 117 indicates an empty magazine stock mechanism. 118 is a chain, arranged in the Z direction,
It is rotationally driven in the Z direction by the rotation of a sprocket 119 connected to a motor (not shown) or the like. Reference numeral 120 is an L-shaped angle, and a bin 121 is provided so that the recess 91 of the magazine 89 can be hooked thereon.

A plurality of angles 120 are attached to the chain 118 by attachments 122. Six chains 118 are arranged in parallel to form a pair facing each other so as to be able to support both ends of the magazine 89. That is, the empty magazines 89 are transported by the chain 95, and hooked onto the angles 121 by the drive of the chain 118 in the empty magazine stock section, so that six magazines are stocked in multiple stages.

In FIG. 10, reference numeral 123 denotes an extrusion mechanism, which is constructed in the same manner as the extrusion mechanisms 105, 115, and 116, and is used to hold the semiconductor device 10 on the rail 74 after soldering.
4, the first unloader.

It can be stored in a magazine 89 in 73.

It should be noted that the semiconductor devices stored in the magazine after the soldering process are transported by the transport section 83 in FIG. 3 to the second unloader 84 and stored together with the magazine.

Incidentally, also in this embodiment, the semiconductor device is soldered while being transported.

The operation of the solder processing apparatus having the above-mentioned configuration will be explained below.

In the first loader 45 shown in FIG. 5 or 6, the carrier jig support 102 rises and supports the magazine support lever 86 of the lowest one of the stacked carrier jigs, Lift the carrier jig slightly. The pawl 94 is released and the carrier jig support 102
is lowered, and the carrier jig is also lowered. Magazine support lever 8 supported by carrier jig support 102
6 passes through the pawl 94, the pawl 94 protrudes. When the carrier jig support 102 continues to descend further, the magazine support lever 86 of the carrier jig stacked second from the bottom is hooked by the pawl 94, and only the carrier jig at the bottom is separated. be done. When the separated carrier jig 85 descends further, the chain 95
magazine 89 by means of pins 98 and 99 attached to the
The magazine 89 and the carrier jig are separated by being hooked at both longitudinal ends thereof. The separated magazine 89 is
The chain 95 is driven to convey it to the 20th-order. On the other hand, the carrier jig continues to be lowered, its fixing member 92 is supported on the rail 100, and the carrier jig is conveyed to the empty carrier stock section by pushing out the conveyance lever 101 and stored therein. By repeating the above-described operations, the accumulated carrier jigs and the magazine 89 are sequentially separated, and the magazine 89 is transported to the 20th compartment, and the carrier jigs are transported to the empty carrier stock section.

The magazine conveyed to the 20th holder is aligned with the rail 58 extending over the flux application section 49, as shown in FIG. Due to the extrusion of the extrusion mechanism 105, the semiconductor device 104 housed in the magazine 89 is conveyed onto the rail 58. The semiconductor device 104 transported onto the rail 58 is placed on the first
While being transported through the flux application section 49 by the transport mechanism 59, 7 lux is applied. After 7, the semiconductor device 104 is heated by the heating unit 51 so as not to significantly lower the humidity of the molten solder in the solder bath 53 and to improve the adhesion of the solder to the leads of the semiconductor device. be done. The heated semiconductor device 104 has its leads covered with solder by a jet of solder in the solder bath 53 . Next, the semiconductor device is gradually cooled (hereinafter referred to as slow cooling) in the cooling section 54 so that a sudden thermal shock (due to rapid cooling) during cleaning is not applied to the semiconductor device. The slowly cooled semiconductor device is transferred to a hot water cleaning tank 56 in a rough cleaning section 55.
Roughly cleaned by Thereafter, as shown in FIG.
transported inside.

At this time, due to the change in the transport mechanism for transporting the semiconductor device, the flux application part 49 or the solder application part 5
2, the slack attached to the bin 66 of the first transport mechanism 59 is prevented from being carried into the U-turn section 57, and the ultrasonic cleaning tank 68.2 is used for ultrasonic cleaning as the next step. Furthermore, a finishing cleaning tank 70. Draining section 71. Contamination of various media within the drying section 72 is reduced.

Semiconductor devices 104 transported into the magazine 113 are transported together with the magazine 113 to the ultrasonic cleaning section 67 by the drive of the chain 112, and are aligned with the rails 74 spanning the ultrasonic cleaning tank 68. Due to the extrusion of the extrusion mechanism 116, it is conveyed onto the rail 74 that spans the ultrasonic cleaning tank.

Thereafter, the semiconductor device is transported on the rails 74 by the second transport mechanism 75 shown in FIG. 3, and is subjected to ultrasonic cleaning in the ultrasonic cleaning tank 68.

As described above, since the flux adhering to the pin 66 of the first transport mechanism 59 is reduced in the flux adhesion section 49, the semiconductor device is ultrasonically cleaned using cleaning water with less contamination. and can be cleaned thoroughly. After the ultrasonic cleaning has been completed, the semiconductor device is transferred to the final cleaning section 69.
After that, the cleaning water adhering to the semiconductor device is removed by the compressed air blowing mechanism of the draining section 72, and the semiconductor device is transported to the drying section 72.

In the drying section 72, the semiconductor device is dried by a hot air mechanism. Finish cleaning section 69. Also in the draining section 71 and the drying section 72, contamination of various media is reduced by 7 lux, so semiconductor devices can be cleaned.

Can be dried neatly.

On the other hand, the emptied magazines from which the semiconductor devices have been taken out in the 20th-order 46 are stored in stacks in the empty magazine stock section 48, as shown in FIG. The semiconductor device is taken out at the 20th stage 46 and supplied to various soldering processes, but after passing through each soldering process,
This is because it takes time to store the magazines up to the first unloader, and during that time semiconductor devices are sequentially supplied, increasing the number of empty magazines and requiring temporary storage of the magazines. The number of stages of magazines stored in the empty magazine stock section 48 is determined by the length of the rails used to transport the semiconductor devices, the transport speed when transporting the semiconductor devices, and the like.

Therefore, when a predetermined number of stages are accumulated in the empty magazine stock section 48, the empty magazines are transported directly to the first unloader.

In FIG. 10, a semiconductor device 10 after soldering has been completed.
4 is housed in the magazine 89 conveyed from the 20th machine by the push-out mechanism 123. The semiconductor devices 104 are stored in the magazine 89 and stored in the second unloader 84 by the transport section 83 shown in FIG.

By repeating the six operations described above, the semiconductor device is sequentially soldered.

According to the embodiments described above, the flux is less likely to be brought into the washing section, the draining section, and the drying section, so that the possibility of contaminating various media is reduced. Therefore, semiconductor devices can be thoroughly cleaned after soldering.

Can be dried.

Furthermore, since the semiconductor device can be cleanly cleaned and dried, it is possible to reduce the amount of dirt on the semiconductor device caused by soldering, and it is possible to reduce appearance defects of the semiconductor device due to adhesion of dirt.

Since semiconductor devices can be thoroughly cleaned and dried, it is possible to remove corrosive components contained in 7lux that corrode the electrical connections inside the package, reducing the risk of semiconductor device failure due to corrosive components entering the package. .

Since the cleaning medium is less contaminated, semiconductor devices can be cleaned quickly and cleanly.

Since contamination of the cleaning medium is reduced, the number of times the cleaning medium is cleaned can be reduced, and cleaning of the cleaning medium is facilitated.

In the above embodiment, the semiconductor device was simply transported from the hot water cleaning tank to the ultrasonic cleaning tank in the U-turn section, but it is also possible to bring the hot water cleaning tank or the ultrasonic cleaning tank into the U-turn section. In that case, the solder processing apparatus can be made more compact than that of the second embodiment.

Furthermore, in the above-described embodiment, the same transport mechanism is used to transport the semiconductor device from the flux application area to the rough cleaning area, but the transport mechanism up to the solder application area may be made independent. In that case, it is possible to reduce the amount of 7 lux brought into the rough cleaning section, and to clean semiconductor devices.
Drying can be done quickly and cleanly.

At the very least, if the transport mechanism in the flux-adhering part is made independent and the flux adhering to the transport mechanism in the flux-adhering part can be reduced from being brought into the cleaning tank, it is possible to clean and dry semiconductor devices. can be done neatly.

By the way, the transport mechanism for semiconductor devices, magazines, etc. in each part is the same as in the first embodiment described above. It is not limited to Example 2, and various other methods can be considered.

As for the sample, it can be applied to various electronic components other than semiconductor devices.

Furthermore, the present invention can be applied to a plating technology for parts used in precision machines that must avoid dust, foreign matter, etc., and can be plated without staining the parts after processing.

[Effects] - 1. By using different transport mechanisms for the sample in the flux application section and solder application section and the sample transport mechanism in the cleaning section, 7 sixes can be removed by the transport mechanism. It is possible to reduce the amount of media carried into the cleaning section and drying section, and to reduce the amount of dirt on various media.

2. By reducing contamination of various media, it is possible to quickly and cleanly wash and dry samples.

3. By quickly cleaning and drying the sample, the soldering efficiency can be improved.

4. By cleaning and drying the sample cleanly, it is possible to reduce the amount of dirt on the sample that accompanies the soldering process, and it is possible to reduce the appearance defects of the sample due to the adhesion of dirt.

5. By cleaning and drying the sample cleanly, it is possible to remove corrosive components contained in the flux that corrode the electrical connections inside the package, thereby preventing semiconductor device failure due to corrosive components entering the package. can be reduced.

6. Since the sample can be cleanly cleaned and dried, it is possible to reduce the need to clean and dry the sample with dirt after soldering.

7. Since the dirt on the cleaning medium can be reduced, the number of times the cleaning medium must be cleaned can be reduced, and the cleaning medium can be easily cleaned.

Although the invention made by the present inventor has been specifically explained above based on Examples, the present invention is not limited to the above Examples.

[Application field]

The above explanation has mainly been about the application of the invention made by the present inventor to the soldering technology of semiconductor devices, which is the background field of application, but the invention is not limited thereto. It can be applied to processing technology, etc.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view showing a solder processing device which is an embodiment of the present invention, and FIG. 2 is a schematic front view showing the vicinity of the 7 lux attachment part of the solder processing device which is an embodiment of the present invention. , FIG. 3 is a schematic perspective view showing a solder processing apparatus according to another embodiment of the present invention, FIG. 4 is a schematic perspective view showing a carrier jig, and FIG.
FIG. 6 is a partially fragmented side view showing the 10th-da, FIG. 6 is a partially broken front view as seen from the X-ray arrow in FIG. 5, FIG. 7 is a schematic plan view showing the 20th-da, and FIG. , U
FIG. 9 is a schematic plan view showing the turn section; FIG. 9 is a schematic front view showing the empty magazine stock section; FIG. 10 is a schematic plan view showing the first unloader;
The figure is a perspective view showing a conventional solder processing apparatus, and FIG.
FIG. 3 is a schematic cross-sectional view showing a moving state of electronic components. 1... supply section, 2, 17, 49... 7 lux adhering section, 3.20. 52...Solder attachment part, 4,22...
・Cleaning section, 5, 26, 72...Drying section, 6...Recovery section, 7...Guide mechanism, 8...Electronic component, 9...
Storage magazine, 10... Moving mechanism, 11... Endless conveyor, 12... Transfer pin, 13, 16.58, 74
, 100... Rail, 14... Solder processing device, 15
...Loader, 18°50...Flux tank, 19.
51...Heating part, 21°53...Solder tank, 23,5
6... Warm water cleaning tank, 24°68... Ultrasonic cleaning tank,
25.70... Finish cleaning tank, 27... Unloader,
28.59...first conveyance mechanism, 29.30,36,
37,60,61,62,76°77.78,96,1
19... Sprocket, 31°38.63,79,9
5,112,118...Chain, 32,39,64
．． 80...Connecting member, 33°40.45,65,81
, 101...transport lever, 34.41, 66.82,
87,88,98,99゜110.121... bottle,
35.75...Second transport mechanism, 42,104...
Semiconductor device, 43...Backage, 44...Lead, 45...10th-day, 46...20th-day, 47
...Empty carrier stock section, 48...Empty magazine stock section, 54...Cooling section, 55...Rough cleaning section, 5
7... U-turn section, 67... Ultrasonic cleaning section, 69.
...Final cleaning section, 71...Draining section, 73...First
Unloader, 83... Conveyance unit, 84... Second unloader, 85... Carrier jig, 86... Magazine support lever, 89, 113... Magazine, 90, 114
... opening, 91 ... recess, 92 ... fixing member, 9
3... Pawl mechanism, 94... Pawl, 97,122...
- Attachment, 102... carrier jig support,
103... cylinder mechanism, 105, 115, 116,
123... Push-out mechanism, 106... Lever, 10
7...Female thread body, 108...Male thread, -109...
- Guide, 111... U-turn mechanism, 117... Empty magazine stock mechanism, 120... Angle. Figure 4 Figure 5 Figure 6 Figure 1σ8 Figure 7 Figure l19 Figure 10

Claims (1)

[Scope of Claims] 1. A plating processing apparatus comprising a flux application section for activating the part of the sample to be plated, and a cleaning section for cleaning the sample after plating, which A plating processing apparatus characterized by having a first transport mechanism for transporting a sample in a washing part and a second transport mechanism for transporting a sample in a cleaning part. 2. After applying flux and plating to the sample supplied from the supply section in the flux application section while being transported by the first transport mechanism, the sample is cleaned while being transported by the second transport mechanism. A plating process characterized by drying.