JPS61171764A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS61171764A JPS61171764A JP1290685A JP1290685A JPS61171764A JP S61171764 A JPS61171764 A JP S61171764A JP 1290685 A JP1290685 A JP 1290685A JP 1290685 A JP1290685 A JP 1290685A JP S61171764 A JPS61171764 A JP S61171764A
- Authority
- JP
- Japan
- Prior art keywords
- fatty acid
- acid ester
- resin composition
- mold release
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
［技術分野］
この発明は、リレー、マイクロスイッチなどの電気機器
の製造技術の分野に属する。また、電気機器の製造のた
めに使用する成形用の樹脂組成物の技術分野にも属する
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention belongs to the field of manufacturing technology for electrical equipment such as relays and microswitches. It also belongs to the technical field of molding resin compositions used for manufacturing electrical equipment.
［背景技術］
従来、リレー、マイクロスイッチなどのハウジングなど
に使用されている樹脂組成物は、その成形時の復熱れを
よくするために、樹脂組成物中に離型剤を配合していた
。そして離型剤としてはステアリン酸、パルミチン酸、
オレイン酸アミドなどの長鎖のアルキル基を有するカル
ボン酸あるいはその誘導体が普通に使用されていた。[Background technology] Conventionally, resin compositions used for housings of relays, microswitches, etc. have had a release agent added to them in order to improve heat recovery during molding. . As mold release agents, stearic acid, palmitic acid,
Carboxylic acids or derivatives thereof having long chain alkyl groups such as oleic acid amide were commonly used.
ところが、これらの物質はリレー、マイクロスイッチな
どの動作時の発熱や高温での使用により成形物から揮発
し、接点に付着し、続いて接点開閉のアークによりパラ
フィンなどの熱分解物に変化後炭化し、接点抵抗が上昇
すると言う現象が生じていた。However, these substances volatilize from the molded product due to the heat generated during operation of relays, microswitches, etc. and use at high temperatures, adhere to the contacts, and then turn into thermal decomposition products such as paraffin due to the arc of opening and closing of the contacts, and then carbonize. However, a phenomenon occurred in which the contact resistance increased.
以上のように、成形用の樹脂組成物には離型剤は必須的
に必要であり、一方、その離型剤は前記のような接点の
機能に害を与えてはならないという要望をみたす必要が
ある。このような離型剤はこれまで提案されたことはな
かった。As mentioned above, a mold release agent is essential for resin compositions for molding, and on the other hand, it is necessary that the mold release agent must not harm the function of the contacts as described above. There is. Such a mold release agent has never been proposed before.
［発明の目的］
この発明は、リレー、マイクロスイッチなどのハウジン
グ、その他の部品の成形に使用する樹脂組成物であって
、リレー、マイクロスイッチなどの接点性能に悪い影響
を与えないような樹脂組成物を提供することを目的とす
る。[Object of the invention] This invention relates to a resin composition used for molding housings and other parts of relays, microswitches, etc., which does not have a negative effect on the contact performance of relays, microswitches, etc. The purpose is to provide something.
［発明の開示］
この発明は、リレー、マイクロスイッチなどのハウジン
グなど、あるいはその他の部品の成形用に使用するため
の樹脂組成物において、ポリオキシエチレン脂肪酸エス
テルまたは（および）ポリプロピレン脂肪酸エステルで
あって、脂肪酸のアルキル基の炭素数が４以下のものを
離型剤として配合してなる樹脂組成物を提供するもので
ある。[Disclosure of the Invention] The present invention provides a resin composition for use in molding housings of relays, microswitches, etc., or other parts, which comprises polyoxyethylene fatty acid ester and/or polypropylene fatty acid ester. The present invention provides a resin composition containing a fatty acid having an alkyl group of 4 or less carbon atoms as a mold release agent.
前記の離型剤としては、以下のような一般式で表される
ものが使用される。As the above-mentioned mold release agent, those represented by the following general formula are used.
ＣＨ９（ＣＨ２）ｎｃＯｏ （ＣＨ２ＣＨ２０）ｍＨＨ
９
ＣＨ！３ （ＣＨ２）ｎｃＯｏ （ＣＨ２ＣＨＯ）ｍ
Ｈここでｎ≦３、ｍ≧１
以上の式においてｎが３以上の場合は、つまり脂肪酸の
アルキル基の炭素数が４を超えるものは、接点に炭化物
が生成しやすくなり接点性能を悪化させる。ｍは１以上
であるが、離型性の観点からは５以上が望ましい。なお
、ｍは限定す趣旨ではないが１０以下が好ましい。CH9(CH2)ncOo (CH2CH20)mHH
9CH! 3 (CH2)ncOo (CH2CHO)m
HHere, n≦3, m≧1 In the above formula, if n is 3 or more, that is, if the alkyl group of the fatty acid has more than 4 carbon atoms, carbide tends to be generated at the contact, which deteriorates the contact performance. . m is 1 or more, but from the viewpoint of mold releasability, 5 or more is desirable. Although m is not intended to be limited, it is preferably 10 or less.
離型剤の配合量は、配合対象となる樹脂の種類、成形方
法などにより異なるが、５重量％以下の量が配合される
。The amount of the mold release agent blended varies depending on the type of resin to be blended, the molding method, etc., but it is blended in an amount of 5% by weight or less.
配合対象となる樹脂は、とくに限定はしないが、ポリブ
チレンテレフタレート（以下ＰＢ↑と略す）、６．６ナ
イロン（以下６．６−Ｎと略す）、ポリエチレンテレフ
タレート（以下ＰＥＴと略す）などの熱可塑性樹脂、あ
るいはエポキシ樹脂、フェノール樹脂などの熱硬化性樹
脂などが対象となる。The resins to be blended are not particularly limited, but thermal resins such as polybutylene terephthalate (hereinafter abbreviated as PB↑), 6.6 nylon (hereinafter abbreviated as 6.6-N), polyethylene terephthalate (hereinafter abbreviated as PET), etc. Targets include plastic resins and thermosetting resins such as epoxy resins and phenolic resins.
以上の離型剤としてのポリエーテル類は、従来、接点の
コンタクトオイルなどには使用されていたが離型剤とし
ては使用されたことはなかった。The above-mentioned polyethers as mold release agents have conventionally been used in contact oils for contacts, but have never been used as mold release agents.
また、このポリエーテル類は接点に付着した場合におい
ても炭化物になりやすいパラフィン類には分解せず、ア
ークによる炭化物の生成は極めて少なく、接触抵抗も上
昇しにくいと言う利点がある、勿論離型効果も充分であ
る。In addition, even if these polyethers adhere to contacts, they do not decompose into paraffins that easily become carbides, and have the advantage that carbide formation due to arcing is extremely small and contact resistance does not easily increase. The effect is also sufficient.
実施例、比較例
１１第１表のような樹脂、離型剤（樹脂にたいして
０．５％配合）の配合組合せで実施した。その結果を同
表に接点不良率として表示した。また、従来の離型剤と
してステアリン酸とオレイン酸アミドを使用して実施例
と比較した。Examples, comparative examples
11 The tests were carried out using the combinations of resin and mold release agent (0.5% blended with respect to the resin) as shown in Table 1. The results are shown in the same table as the contact defect rate. In addition, stearic acid and oleic acid amide were used as conventional mold release agents for comparison with Examples.
なお、第１表において、離型剤の表示として使用した記
号はつぎのような意味である。すなわち、Ａはペンタエ
チレングリコールモノ酪酸エステル、Ｂはペンタエチレ
ングリコールモノバレリアン酸エステル、Ｃはペンタエ
チレングリコールモノカブロン酸エステル、Ｄはデカエ
チレングリコールモノバレリアン酸エステル、Ｅはペン
タエチレングリコールモノバレリアン酸エステル、Ｆは
ベンタプロビレングリニールバレリアン酸エステルを表
す。In addition, in Table 1, the symbols used to indicate mold release agents have the following meanings. That is, A is pentaethylene glycol monobutyrate, B is pentaethylene glycol monovalerate, C is pentaethylene glycol monocabroate, D is decaethylene glycol monovalerate, and E is pentaethylene glycol monovalerate. , F represents bentaprobylene glycyl valerate.
［以下余白］
第１表
［発明の効果〕
この発明は、離型剤としてポリオキシエチレン脂肪酸エ
ステルまたは（および）ポリプロピレン脂肪酸エステル
であって、脂肪酸のアルキル基の炭素数が４以下のもの
を配合してなるので、接点不良を起こさない利点がある
。[Margins below] Table 1 [Effects of the Invention] This invention is a mold release agent containing a polyoxyethylene fatty acid ester or (and) a polypropylene fatty acid ester, in which the alkyl group of the fatty acid has 4 or less carbon atoms. This has the advantage of not causing contact failure.
Claims (1)
物において、ポリオキシエチレン脂肪酸エステルまたは
（および）ポリプロピレン脂肪酸エステルであって、脂
肪酸のアルキル基の炭素数が４以下のものを配合したこ
とを特徴とする樹脂組成物。(1) In a resin composition for use in equipment having electrical contacts, a polyoxyethylene fatty acid ester or (and) a polypropylene fatty acid ester containing a fatty acid in which the number of carbon atoms in the alkyl group is 4 or less is blended. A resin composition characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1290685A JPS61171764A (en) | 1985-01-25 | 1985-01-25 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1290685A JPS61171764A (en) | 1985-01-25 | 1985-01-25 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171764A true JPS61171764A (en) | 1986-08-02 |
Family
ID=11818400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1290685A Pending JPS61171764A (en) | 1985-01-25 | 1985-01-25 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171764A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0498417A2 (en) * | 1991-02-07 | 1992-08-12 | Hoechst Aktiengesellschaft | Ester of polyoxymethylene wax and its use as separating agent on plastics manufacture |
| JP2016050236A (en) * | 2014-08-29 | 2016-04-11 | 精工化学株式会社 | Adhesion preventing agent for rubber latex |
-
1985
- 1985-01-25 JP JP1290685A patent/JPS61171764A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0498417A2 (en) * | 1991-02-07 | 1992-08-12 | Hoechst Aktiengesellschaft | Ester of polyoxymethylene wax and its use as separating agent on plastics manufacture |
| JP2016050236A (en) * | 2014-08-29 | 2016-04-11 | 精工化学株式会社 | Adhesion preventing agent for rubber latex |
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