JPS61171254U - - Google Patents
Info
- Publication number
- JPS61171254U JPS61171254U JP5273885U JP5273885U JPS61171254U JP S61171254 U JPS61171254 U JP S61171254U JP 5273885 U JP5273885 U JP 5273885U JP 5273885 U JP5273885 U JP 5273885U JP S61171254 U JPS61171254 U JP S61171254U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bend
- main body
- degrees
- body mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5273885U JPS61171254U (en, 2012) | 1985-04-11 | 1985-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5273885U JPS61171254U (en, 2012) | 1985-04-11 | 1985-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61171254U true JPS61171254U (en, 2012) | 1986-10-24 |
Family
ID=30572955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5273885U Pending JPS61171254U (en, 2012) | 1985-04-11 | 1985-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61171254U (en, 2012) |
-
1985
- 1985-04-11 JP JP5273885U patent/JPS61171254U/ja active Pending