JPS61171144A - Semiconductor assembler - Google Patents
Semiconductor assemblerInfo
- Publication number
- JPS61171144A JPS61171144A JP60011871A JP1187185A JPS61171144A JP S61171144 A JPS61171144 A JP S61171144A JP 60011871 A JP60011871 A JP 60011871A JP 1187185 A JP1187185 A JP 1187185A JP S61171144 A JPS61171144 A JP S61171144A
- Authority
- JP
- Japan
- Prior art keywords
- output
- capillary
- supersonic
- horn
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体組立部品のリードフレーム上に搭載さ
れたベレットの電極とリードとの金属細線による接続（
以下ワイヤーダンディングという）において、接続の際
にキャピラリーに振動、特に超音波振動を加える超音波
？ンディング装置（以下ＵＳＢとする）に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a connection between an electrode of a pellet mounted on a lead frame of a semiconductor assembly component and a lead using a thin metal wire (
(hereinafter referred to as wire danding), is an ultrasonic wave that applies vibrations, especially ultrasonic vibrations, to the capillary during connection? The present invention relates to a loading device (hereinafter referred to as USB).
従来のワイヤーダンディングは、接続温度を低く抑え、
接続荷重を小さくし、更に接続強度を向上させる目的で
接続の際にキャピラリーに超音波振動を加えるＵＳＢが
用いられているが、ワイヤーダンディング時に与える超
音波出力の検出は発振器からの出力もしくは超音波ホー
ンに超音波振動を与える振動子からの出力によって行な
われているＯ
又、ベレットに実際に加わっている振動出力を検出する
為、ＵＳＢの稼動を中断し、キャぎラリ−の下に圧電素
子等のセンサーをセットし、その出力の測定を行なう方
法も用いられている。Conventional wire dangling keeps the connection temperature low,
USB is used to apply ultrasonic vibration to the capillary during connection in order to reduce the connection load and further improve the connection strength. However, the detection of the ultrasonic output during wire dangling is performed using the output from an oscillator or ultrasonic vibration. This is done by the output from the vibrator that gives ultrasonic vibrations to the sonic horn.Also, in order to detect the vibration output actually applied to the pellet, the operation of the USB is interrupted and a piezoelectric is placed under the carriage. Another method is to set up a sensor such as an element and measure its output.
上述した従来のＵＳＢでは、超音波出力の検出を発振器
からの出力もしくは振動子からの出力を用いて行なう場
合には、超音波ホーンに取シ付けられたキャピラリーの
取り付け具合が不完全であった場合、実際にベレットに
加わっている超音波出力の有無や強さを検出し得ない欠
点があった。In the conventional USB described above, when detecting the ultrasonic output using the output from the oscillator or the output from the vibrator, the capillary attached to the ultrasonic horn was not properly attached. In this case, there was a drawback that it was not possible to detect the presence or absence and strength of the ultrasonic output actually applied to the pellet.
更に、キャピラリーの下に圧電素子等のセンサーをセッ
トし、その出力の測定を行なう方法を用いる場合も、実
際にペレットに加わっている超音波出力をかなシ正確に
検出できる反面、測定のたびにＵＳＢの稼動を中断する
必要が有り、定常的な管理に用いる場合、非常に効率が
悪くなる欠点があった。Furthermore, when using a method of setting a sensor such as a piezoelectric element under the capillary and measuring its output, although it is possible to accurately detect the ultrasonic output actually applied to the pellet, It is necessary to interrupt the operation of the USB, and when used for regular management, there is a drawback that efficiency is extremely low.
又、キャピラリーを圧電素子に当接させて出力を検出す
るため、キャピラリー先端の金属細線を通す孔がつまっ
たシ、先端形状が変化したりする不具合も考えられ、こ
の場合はキャピラリーの交換が必要となってくる。更に
キャピラリー交換後、キャピラリーの取り付け具合が変
化したシすると、稼動中の超音波出力が、測定時の出力
と異なってしまう不具合も予想される。In addition, since the output is detected by bringing the capillary into contact with the piezoelectric element, the hole at the tip of the capillary through which the thin metal wire is passed may become clogged, or the shape of the tip may change.In this case, the capillary must be replaced. It becomes. Furthermore, if the way in which the capillary is attached changes after replacing the capillary, a problem may occur in which the ultrasonic output during operation differs from the output during measurement.
本発明は通常の使用状態における超音波出力を常時得る
ことができる装置を提供するものである。The present invention provides a device that can constantly obtain ultrasonic output under normal usage conditions.
〔問題点を解決するための手段〕
本発明は超音波ホーンのキャピラリー取シ付け部に、超
音波出力を検出するセンサーを据付けたことを特徴とす
る半導体組立装置である。[Means for Solving the Problems] The present invention is a semiconductor assembly apparatus characterized in that a sensor for detecting ultrasonic output is installed in a capillary mounting portion of an ultrasonic horn.
次に本発明の実施例について図面を用いて説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）は、本発明の一実施例の上面図、及び（ｂ
）は第１図（、）のＡ−Ａ’断面図である。FIG. 1(a) is a top view of an embodiment of the present invention, and FIG. 1(b) is a top view of an embodiment of the present invention.
) is a sectional view taken along line AA' in FIG. 1 (,).
本発明装置は振動子１に結合された超音波ホーン２の先
端のキャピラリー取シ付け部に、超音波出力を検出する
センサーとしての圧電素子４をキャピラリー３の周囲を
囲んで据付けたものである。In the device of the present invention, a piezoelectric element 4 as a sensor for detecting ultrasonic output is installed around a capillary 3 at a capillary mounting portion at the tip of an ultrasonic horn 2 coupled to a vibrator 1. .
実施例において、振動子１より超音波ホー７２を介して
キャピラリー３に与えられる超音波出力は、圧電素子４
により常時検出され、したがって通常の使用状態での超
音波出力を監視することが可能となる。In the embodiment, the ultrasonic output applied from the vibrator 1 to the capillary 3 via the ultrasonic hole 72 is transmitted through the piezoelectric element 4.
is constantly detected, thus making it possible to monitor the ultrasonic output under normal usage conditions.
尚、第１図の実施例では、キャピラリーの周囲全体を圧
電素子で囲んだ構造としたが、特に水槽 Ｊ造に取ら
れれる必要はなく、キャピラリーの一部に圧電素子が接
する様な構造でも充分に効果は得られる。In the embodiment shown in Fig. 1, the capillary is entirely surrounded by a piezoelectric element, but it does not have to be a J structure for water tanks, and a structure in which a piezoelectric element is in contact with a part of the capillary is also applicable. You can get sufficient effects.
尚、実施例ではＵＳＢについて説明したが、その他何ら
かの形でキャピラリーに振動を与えるがンディング装置
についても、同様に応用することができることは明白で
ある。Incidentally, although the USB was explained in the embodiment, it is obvious that the present invention can be similarly applied to a landing device that applies vibration to a capillary in some other way.
以上説明したように、本発明は、キャピラリーに加わる
超音波出力を設備の稼動を停止することなく、連続的に
得ることができ、又、例えばキャピラリーの取υ付けが
正常でない場合などにも、正常な状態での超音波出力を
調査しておけば、異常の早期発見ができ、ワイヤーボン
ディング工程の作シ込み品質の向上が期待できる。As explained above, the present invention can continuously obtain the ultrasonic output applied to the capillary without stopping the operation of the equipment, and even when the capillary is not installed properly, for example. By investigating the ultrasonic output under normal conditions, abnormalities can be detected early and the quality of markings in the wire bonding process can be expected to improve.
更に従来のＵＳＢでは、そのほとんどが出力のコントロ
ールを発振器内部、もしくは振動子の出力の帰還によシ
行なっているため、超音波ホーンや、キャピラリーに何
らかの異常（例えば負荷がかかった場合）があった場合
に超音波出力の変動に対してキャピラリーの実際の超音
波出力として安定した発振出力を得るのには不利であっ
たが、本発明では、キャピラリー取り付け部より超音波
出力が得られるので、その出力を帰還源として用いれば
、よシ安定した超音波出力を得ることができる効果を有
するものである。Furthermore, in most conventional USBs, the output is controlled within the oscillator or by feedback of the output of the transducer, so there is a risk of some kind of abnormality (for example, when a load is applied) to the ultrasonic horn or capillary. However, in the present invention, since the ultrasonic output can be obtained from the capillary attachment part, If the output is used as a feedback source, it is possible to obtain a highly stable ultrasonic output.
第１図（、）は本発明の一実施例を示す上面図、伽）は
第１図（ａ）のＡ−Ａ’断面図である。
１・・・圧電型振動子、２・・・超音波ホーン、３・・
・キャピラリー、４−・・圧電素子（センサー）。FIG. 1(a) is a top view showing an embodiment of the present invention, and FIG. 1(a) is a sectional view taken along line AA' in FIG. 1(a). 1...Piezoelectric vibrator, 2...Ultrasonic horn, 3...
・Capillary, 4-...Piezoelectric element (sensor).
Claims (1)
ペレットの電極とリードとの金属細線による接続を、ホ
ーン及び該ホーンに備えたキャピラリーを加振させて行
なう半導体組立装置において、前記ホーンのキャピラリ
ー取り付け部分に、振動出力を検出するセンサーを据付
けたことを特徴とする半導体組立装置。(1) In a semiconductor assembly device in which a lead and an electrode of a pellet mounted on a lead frame of a semiconductor assembly component are connected by a thin metal wire by vibrating a horn and a capillary provided in the horn, the capillary of the horn A semiconductor assembly device characterized in that a sensor for detecting vibration output is installed in the mounting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60011871A JPS61171144A (en) | 1985-01-25 | 1985-01-25 | Semiconductor assembler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60011871A JPS61171144A (en) | 1985-01-25 | 1985-01-25 | Semiconductor assembler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61171144A true JPS61171144A (en) | 1986-08-01 |
Family
ID=11789783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60011871A Pending JPS61171144A (en) | 1985-01-25 | 1985-01-25 | Semiconductor assembler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61171144A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04120753A (en) * | 1989-12-22 | 1992-04-21 | Hughes Aircraft Co | Bond signature analyzer |
| US5263630A (en) * | 1991-08-02 | 1993-11-23 | Nec Corporation | Bonding apparatus |
-
1985
- 1985-01-25 JP JP60011871A patent/JPS61171144A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04120753A (en) * | 1989-12-22 | 1992-04-21 | Hughes Aircraft Co | Bond signature analyzer |
| US5263630A (en) * | 1991-08-02 | 1993-11-23 | Nec Corporation | Bonding apparatus |
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